Abstract: Techniques for improving on data center best practices are provided. In one aspect, an exemplary methodology for analyzing energy efficiency of a data center having a raised-floor cooling system with at least one air conditioning unit is provided. The method comprises the following steps. An initial assessment is made of the energy efficiency of the data center based on one or more power consumption parameters of the data center. Physical parameter data obtained from one or more positions in the data center are compiled into one or more metrics, if the initial assessment indicates that the data center is energy inefficient. Recommendations are made to increase the energy efficiency of the data center based on one or more of the metrics.

Abstract: A memory cell includes a storage medium having a programmable thermal impedance, and a heater in thermal communication with the storage medium for programming the thermal impedance. In another aspect, a memory cell includes a storage medium having a programmable electrical impedance, and a heater in thermal communication with the storage medium for programming the electrical impedance. In a third aspect, a memory device includes a plurality of the memory cells in accordance with the first and/or second aspect of the present invention.

Abstract: An information processing assembly includes at least one heater suitable for information processing, and a controller for controlling the at least one heater by at least one of adjusting a power to the at least one heater to match a target power level, and changing a polarity of an electrical current supplied to the heater.

Abstract: A memory cell includes a storage medium having a programmable thermal impedance, and a heater in thermal communication with the storage medium for programming the thermal impedance. In another aspect, a memory cell includes a storage medium having a programmable electrical impedance, and a heater in thermal communication with the storage medium for programming the electrical impedance. In a third aspect, a memory device includes a plurality of the memory cells in accordance with the first and/or second aspect of the present invention.

Abstract: An information processing assembly includes at least one heater suitable for information processing, and a controller for controlling the at least one heater by at least one of adjusting a power to the at least one heater to match a target power level, and changing a polarity of an electrical current supplied to the heater.

Abstract: An optical system includes a spectrometer and a multipass optical probe. The multipass optical probe includes a retroreflective element such that light propagating, in a first direction, from the probe to a sample under test and passing through or reflecting from the sample under test, is reflected back in a second direction opposite the first direction, so as to pass through the sample under test a total of at least two times.

Abstract: A method for detecting and/or imaging a workpiece. In a detection aspect, the method comprises the steps of sampling an electromagnetic wave packet representative of workpiece properties and comprising encoded wave information derivable from a multi-pole interactive coupling between a probe tip and the workpiece; decoding said electromagnetic wave packet by interrogating at least one of its phase and amplitude information; and, using the decoding information as a means for detecting the presence of the workpiece. In an imaging aspect, the method includes incorporating the previous steps in a scanning operation for developing an image representative of the workpiece.

Abstract: An assembly for making thickness measurements in a thin film structure. The assembly comprises a chemical-mechanical planarization (CMP) subassembly for effecting topographical changes in a thin film structure; and, a measuring subassembly for detecting the thickness of a thin film structure, the measuring subassembly interposed with the CMP subassembly so that a thickness measurement can be made during and independent of CMP process operations.