Patents by Inventor Martin Perez-Guzman
Martin Perez-Guzman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240110836Abstract: The disclosure relates to a substrate support assembly and apparatus for measuring the temperature of a substrate disposed on the support assembly. In one embodiment, a substrate temperature measurement apparatus includes a substrate support assembly, a probe assembly, and a probe target. The substrate support assembly includes an electrostatic chuck and one or more plates. The probe assembly within the substrate support assembly extends through one or more of the one or more plates. The probe assembly includes an optical probe sensor, an optical fiber coupled to the optical probe sensor, and an insulating sheath surrounding the optical fiber. The probe target includes a phosphor coating, is in contact with the electrostatic chuck, and is spaced from the probe assembly.Type: ApplicationFiled: September 14, 2023Publication date: April 4, 2024Inventors: Sankaranarayanan RAVI, Alvaro GARCIA, Martin Perez GUZMAN, Stephen Donald PROUTY, Andrew Antoine NOUJAIM
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Publication number: 20240112889Abstract: The disclosure relates to a substrate support assembly for reducing the evacuation time when using argon gas. In one embodiment, a substrate support assembly includes a porous plug within the substrate support assembly. The porous plug includes a first cylindrical section with a first volume and axial length, a second cylindrical section with a second volume and axial length. The first cylindrical section has a larger volume than the second cylindrical section. The first cylindrical section and second cylindrical section have a volume ratio between about 2 and about 12. The first cylindrical section axial length and second cylindrical section axial length have a length ratio between about 2 and about 10.Type: ApplicationFiled: September 26, 2023Publication date: April 4, 2024Inventors: Tony Jefferson GNANAPRAKASA, Alvaro GARCIA, Martin Perez GUZMAN, Stephen Donald PROUTY
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Publication number: 20240112894Abstract: A method and apparatus for cooling a semiconductor chamber are described herein. A semiconductor chamber component, includes a powered region, a grounded region, and a fluid conduit disposed within the semiconductor chamber component and passing through the powered region and grounded region, the fluid conduit comprising a ceramic material.Type: ApplicationFiled: September 22, 2023Publication date: April 4, 2024Inventors: Sankaranarayanan RAVI, Alvaro GARCIA, Martin Perez GUZMAN, Stephen D. PROUTY, Andreas SCHMID
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Patent number: 11924972Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.Type: GrantFiled: June 2, 2020Date of Patent: March 5, 2024Assignee: Applied Materials, Inc.Inventors: Phillip A. Criminale, Zhiqiang Guo, Andrew Myles, Martin Perez-Guzman
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Publication number: 20240023246Abstract: A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes storing the sensor data in a memory of the diagnostic disc. The method further includes wirelessly transmitting the sensor data to the computing system, using the wireless communication circuit. The method further includes terminating the secure wireless connection with the computing system and clearing the sensor data from the memory of the diagnostic disc.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Inventors: Phillip A. Criminale, Zhiqiang Guo, Andrew Myles, Martin Perez-Guzman
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Publication number: 20230413446Abstract: A method includes causing, by a computing system comprising at least one processing device, a diagnostic disc placed within a processing chamber to generate sensor data of at least one component of the processing chamber using a set of non-contact sensors of the diagnostic disc, receiving, by the computing system, the sensor data from the diagnostic disc via a wireless connection established between the computing system and the diagnostic disc, determining, by the computing system based on the sensor data, whether at least one of alignment concentricity is skewed with respect to the at least one component, and in response to determining that at least one of alignment or concentricity is skewed with respect to the at least one component, initiating, by the computing system, correction of at least one of alignment or concentricity of the at least one component.Type: ApplicationFiled: September 6, 2023Publication date: December 21, 2023Inventors: Phillip A. Criminale, Zhiqiang Guo, Andrew Myles, Martin Perez-Guzman, Nelson Joseph Gaspard, Timothy Joseph Franklin, Michael A. Stearns
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Publication number: 20230380016Abstract: A substrate support assembly includes a puck, comprising a heating element, a power distribution assembly, and an insulator comprising at least one of alumina or thermoplastic disposed between the puck and the power distribution assembly, wherein an electrical connection between the heating element and the power distribution assembly comprises a terminal and a conical washer.Type: ApplicationFiled: May 15, 2023Publication date: November 23, 2023Inventors: Denis Martin Koosau, Suresh Gupta, Martin Perez-Guzman, Ashish Goel
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Publication number: 20230377930Abstract: A substrate support assembly includes a plate structure and an insulator structure. The plate structure includes an upper plate and a lower plate. The lower plate includes a lower plate structure surface. The insulator structure is disposed beneath the plate structure. The insulator structure includes a lower insulator structure surface and an upper insulator structure surface. A first portion of the upper insulator structure surface is recessed with respect to a second portion of the upper insulator structure surface. The first portion of the upper insulator structure surface forms an interior volume with the lower plate structure surface.Type: ApplicationFiled: May 15, 2023Publication date: November 23, 2023Inventors: Denis Martin Koosau, Suresh Gupta, Martin Perez-Guzman, Ashish Goel
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Publication number: 20230264238Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.Type: ApplicationFiled: April 24, 2023Publication date: August 24, 2023Applicant: Applied Materials, Inc.Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo
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Publication number: 20230199992Abstract: A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, at a vacuum of about 0.1 mTorr to about 50 mTorr and a temperature of about ?20° C. to about 120° C., by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes wirelessly transmitting the sensor data to the computing system via the secure wireless connection using the wireless communication circuit. The diagnostic disc includes a disc-shaped body, a printed circuit board (PCB), a power source coupled to the PCB, a casing that encapsulates the power source, and a cover positioned over the PCB and the power source.Type: ApplicationFiled: February 14, 2023Publication date: June 22, 2023Inventors: Phillip A. Criminale, Zhiqiang Guo, Philip A. Kraus, Andrew Myles, Martin Perez-Guzman
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Patent number: 11666952Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.Type: GrantFiled: March 6, 2020Date of Patent: June 6, 2023Assignee: Applied Materials, Inc.Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo
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Patent number: 11589474Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.Type: GrantFiled: June 2, 2020Date of Patent: February 21, 2023Assignee: Applied Materials, Inc.Inventors: Phillip A. Criminale, Zhiqiang Guo, Philip A. Kraus, Andrew Myles, Martin Perez-Guzman
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Publication number: 20210378119Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.Type: ApplicationFiled: June 2, 2020Publication date: December 2, 2021Inventors: Phillip A. Criminale, Zhiqiang Guo, Philip A. Kraus, Andrew Myles, Martin Perez-Guzman
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Publication number: 20210378100Abstract: A diagnostic disc includes a disc-shaped body having raised walls that encircle the interior of the disc-shaped body and at least one protrusion extending outwardly from the disc-shaped body. The raised walls of the disc-shaped body define a cavity of the disc-shaped body. A non-contact sensor is attached to each of the at least one protrusion. A a printed circuit board (PCB) is positioned within the cavity formed on the disc-shaped body. A vacuum and high temperature tolerant power source is disposed on the PCB along with a wireless charger and circuitry that is coupled to each non-contact sensor and includes at least a wireless communication circuit and a memory. A cover is positioned over the cavity of the disc-shaped body and shields at least a portion of the PCB, circuitry, power source, and wireless charger within the cavity from an external environment.Type: ApplicationFiled: June 2, 2020Publication date: December 2, 2021Inventors: Phillip A. Criminale, Zhiqiang Guo, Andrew Myles, Martin Perez-Guzman
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Publication number: 20210343512Abstract: A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate, and a connector coupled to the ground plate that houses a portion of the fluid conduit. The connector includes a biasing assembly and a fastener disposed in a pocket formed in the ground plate.Type: ApplicationFiled: April 30, 2020Publication date: November 4, 2021Inventors: Vijay D. PARKHE, Andreas SCHMID, Andrew Antoine NOUJAIM, Stephen Donald PROUTY, Alvaro GARCIA DE GORORDO, Martin PEREZ-GUZMAN
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Publication number: 20210276056Abstract: Methods of semiconductor processing may include performing a process on a semiconductor substrate. The semiconductor substrate may be seated on a substrate support positioned within a processing region of a semiconductor processing chamber. The methods may include flowing a first backside gas through the substrate support at a first flow rate. The methods may include removing the semiconductor substrate from the processing region of the semiconductor processing chamber. The methods may include performing a plasma cleaning operation within the processing region of the semiconductor processing chamber. The methods may include flowing a second backside gas through the substrate support at a second flow rate. At least a portion of the second backside gas may flow into the processing region through accesses in the substrate support.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Applicant: Applied Materials, Inc.Inventors: Stephen D. Prouty, Martin Perez-Guzman, Sumanth Banda, Rajinder Dhindsa, Alvaro Garcia de Gorordo