Abstract: The present invention relates to a safflower plant or part thereof involving the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7, wherein the plant produces and accumulates chymosin in seed under agricultural conditions. A plant seed involving the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7. A consumer product produced from the seed, defined as chymosin, and additionally as ground grain, flour, flakes, oil, biodiesel, biogas, or another biomaterial. Also, the present invention include a recombinant DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7. A DNA polynucleotide primer molecule comprising at least 15 contiguous nucleotides of the DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7, or its complement which is useful in a DNA amplification method to produce a diagnostic amplicon for the event IND-1ØØØ3-4 and IND-1ØØ15-7, or each of them separately IND-1ØØØ3-4 and IND-1ØØ15-7.

Abstract: The present invention relates to a safflower plant or part thereof involving the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7, wherein the plant produces and accumulates chymosin in seed under agricultural conditions. A plant seed involving the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7. A consumer product produced from the seed, defined as chymosin, and additionally as ground grain, flour, flakes, oil, biodiesel, biogas, or another biomaterial. Also, the present invention include a recombinant DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7. A DNA polynucleotide primer molecule comprising at least 15 contiguous nucleotides of the DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7, or its complement which is useful in a DNA amplification method to produce a diagnostic amplicon for the event IND-1ØØØ3-4 and IND-1ØØ15-7, or each of them separately IND-1ØØØ3-4 and IND-1ØØ15-7.

Abstract: The present invention relates to a safflower plant or part thereof involving the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7, wherein the plant produces and accumulates chymosin in seed under agricultural conditions. A plant seed involving the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7. A consumer product produced from the seed, defined as chymosin, and additionally as ground grain, flour, flakes, oil, biodiesel, biogas, or another biomaterial. Also, the present invention include a recombinant DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7. A DNA polynucleotide primer molecule comprising at least 15 contiguous nucleotides of the DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4 x IND-1ØØ15-7, or its complement which is useful in a DNA amplification method to produce a diagnostic amplicon for the event IND-1ØØØ3-4 and IND-1ØØ15-7, or each of them separately IND-1ØØØ3-4 and IND-1ØØ15-7.

Abstract: The present invention relates to a safflower plant or part thereof involving the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7, wherein the plant produces and accumulates chymosin in seed under agricultural conditions. A plant seed involving the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7. A consumer product produced from the seed, defined as chymosin, and additionally as ground grain, flour, flakes, oil, biodiesel, biogas, or another biomaterial. Also, the present invention include a recombinant DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7. A DNA polynucleotide primer molecule comprising at least 15 contiguous nucleotides of the DNA molecule involved in the molecular stacking of safflower events IND-1ØØØ3-4×IND-1ØØ15-7, or its complement which is useful in a DNA amplification method to produce a diagnostic amplicon for the event IND-1ØØØ3-4 and IND-1ØØ15-7, or each of them separately IND-1ØØØ3-4 and IND-1ØØ15-7.

Abstract: A method and an apparatus for removing polymer from a substrate are provided. In one embodiment, an apparatus utilized to remove polymer from a substrate includes a processing chamber having a chamber wall and a chamber lid defining a process volume, a substrate support assembly disposed in the processing chamber, and a remote plasma source coupled to the processing chamber through an outlet port formed within the chamber wall, the outlet port having an opening pointing toward an periphery region of a substrate disposed on the substrate support assembly, wherein the remote plasma source is fabricated from a material resistant to hydrogen species.

Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

Abstract: An integrated thermal unit comprising a housing; a bake station positioned within the housing, the bake station comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill station positioned within the housing, the chill station comprising a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate receiving station positioned within the housing, the substrate receiving station configured to hold a substrate; wherein the bake station, chill station and substrate receiving station are arranged in a vertical stack within the housing. In some embodiments the integrated thermal unit further comprises a substrate transfer shuttle positioned within the housing and adapted to transfer substrates between the substrate receiving station, bake station and chill stations.

Abstract: An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.

Abstract: An integrated thermal unit comprises a bake station comprising a bake plate configured to hold and heat a substrate; a chill station comprising a chill plate configured to hold and cool a substrate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the chill plate along a horizontally linear path within the thermal unit and raise and lower substrates along a vertical path within the integrated thermal unit.

Abstract: A plasma reactor for processing a workpiece, includes a vacuum chamber defined by a sidewall and ceiling, and a workpiece support pedestal having a workpiece support surface in the chamber and facing the ceiling and including a cathode electrode. An RF power generator is coupled to the cathode electrode. Plasma distribution is controlled by an external annular inner electromagnet in a first plane overlying the workpiece support surface, an external annular outer electromagnet in a second plane overlying the workpiece support surface and having a greater diameter than the inner electromagnet, and an external annular bottom electromagnet in a third plane underlying the workpiece support surface. D.C. current supplies are connected to respective ones of the inner, outer and bottom electromagnets.