Abstract: The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

Abstract: The disclosure relates to a printed circuit board with a printed circuit board core which has an upper face. A metallization layer is formed on at least some sections of the upper face. The metallization layer includes at least one first region and a second region which differs from the first region. An electric module is arranged on the first region and is connected to same in an electrically conductive manner, the second region is arranged and/or formed at a distance to the first region, and the second region surrounds and/or borders the first region. The electric module is encapsulated with a sealing material, where the encapsulation is delimited by the second region.

Abstract: The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

Abstract: The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side. A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.

Abstract: The disclosure relates to a mechatronic assembly. The assembly includes a supporting circuit board with at least one populated flat side . A multiplicity of electronic components are arranged on the at least one populated flat side. In addition, at least one mechanical insert part for the mechanical fixing of at least one electronic component is also arranged on the at least one populated flat side. An encapsulation of one-piece design is provided which, in form-fitting and cohesive fashion, surrounds all of the components arranged on the at least one populated flat side of the supporting circuit board. The disclosure also relates to a method for producing the mechatronic assembly.

Abstract: A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.

Abstract: A circuit device has a base plate, a first substrate arranged on a first outer side of the base plate, a second substrate arranged on a second outer side opposite the first outer side of the base plate, at least one electrical connection element that electrically connects the first substrate and the second substrate, at least one electronic component arranged on or in the first substrate, at least one electronic component arranged on or in the second substrate, a mold package molded around the two substrates and the electronic components arranged thereon, and at least one contacting element for electrically contacting the first substrate and/or the second substrate. The at least one contacting element is electrically conductively connected to the first substrate and/or the second substrate and is led out from the mold package.

Abstract: An electronic module for use as a control device in a motor vehicle, includes a plastic-coated electronic circuit with at least one organic HDI circuit carrier. The electronic circuit is disposed on a heat sink and electrically-conductive conductor structures are provided for electrically connecting the electronic circuit to electrical devices or components outside the electronic module. The circuit carrier is thermally and conductively connected to the heat sink, and the electronic circuit and the heat sink are coated in plastic in such a manner that only the rear side of the heat sink lying opposite the circuit carrier is at least partially free of plastic, and at least contact ends of the conductor structures, which make the electrical connection to the electrical devices or components outside the electronic module are free of plastic. A method for the production of the electronic module is also provided.