Patents by Inventor Martin William Weiser

Martin William Weiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF
    Publication number: 20110038124
    Abstract: A curable thermal interface material composition includes an epoxy polymeric adhesive matrix; a high conductivity filler; a low melting temperature solder material; and a matrix material modification agent.
    Type: Application
    Filed: April 18, 2009
    Publication date: February 17, 2011
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Kikue S. Burnham, Lea Dankers, Martin William Weiser