Patents by Inventor Martin Zucker
Martin Zucker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220187021Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.Type: ApplicationFiled: December 9, 2021Publication date: June 16, 2022Inventors: Manuel Sohn, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Martin Zucker, Pete Lembesis, Michael Yang
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Publication number: 20200243305Abstract: A plasma process apparatus is provided. The plasma processing apparatus includes a plasma chamber and a processing chamber. The processing chamber includes a substrate holder operable to support a substrate. The plasma processing apparatus further includes a separation grid separating the plasma chamber from the processing chamber. The separation grid includes a gas delivery system. The gas delivery system defines a channel, an inlet and a plurality of outlets in fluid communication with the inlet via the channel. The gas delivery system is configured to reduce non-uniformities associated with a treatment process performed on the substrate.Type: ApplicationFiled: January 16, 2020Publication date: July 30, 2020Inventors: Weimin Zeng, Chun Yan, Dixit V. Desai, Hua Chung, Michael X. Yang, Peter Lembesis, Ryan M. Pakulski, Martin Zucker
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Patent number: 10049858Abstract: Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber defining a sidewall and an inductive coil wrapped around at least a portion of the sidewall. A vacuum seal can be positioned between the sidewall of the vacuum chamber and a heat sink. A thermally conductive bridge can be coupled between the sidewall and heat sink. Further, the thermally conductive bridge can be positioned relative to the vacuum seal such that the thermally conductive bridge redirects a conductive heat path from the sidewall or any heat source to the heat sink so that the heat path bypasses the vacuum seal.Type: GrantFiled: May 9, 2014Date of Patent: August 14, 2018Assignee: MATTSON TECHNOLOGY, INC.Inventors: Vladimir Nagorny, Steven Parks, Martin Zucker
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Publication number: 20160013025Abstract: Systems and methods for protecting vacuum seals in a plasma processing system are provided. The processing system can include a vacuum chamber defining a sidewall and an inductive coil wrapped around at least a portion of the sidewall. A vacuum seal can be positioned between the sidewall of the vacuum chamber and a heat sink. A thermally conductive bridge can be coupled between the sidewall and heat sink. Further, the thermally conductive bridge can be positioned relative to the vacuum seal such that the thermally conductive bridge redirects a conductive heat path from the sidewall or any heat source to the heat sink so that the heat path bypasses the vacuum seal.Type: ApplicationFiled: May 9, 2014Publication date: January 14, 2016Applicant: Mattson Technology, Inc.Inventors: Vladimir Nagorny, Steven Parks, Martin Zucker
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Patent number: 9184072Abstract: An apparatus and method are described for processing workpieces in a treatment process. A multi-wafer chamber defines a chamber interior including at least two processing stations within the chamber interior such that the processing stations share the chamber interior. Each processing station includes a plasma source and a workpiece pedestal for exposing one of the workpieces to the treatment process using a respective plasma source. The chamber includes an arrangement of one or more electrically conductive surfaces that are asymmetrically disposed about the workpiece at each processing station in a way which produces a given level of uniformity of the treatment process on a major surface of each workpiece. A shield arrangement provides an enhanced uniformity of exposure of the workpiece to the respective one of the plasma sources that is greater than the given level of uniformity that would be provided in an absence of the shield arrangement.Type: GrantFiled: July 27, 2007Date of Patent: November 10, 2015Assignee: Mattson Technology, Inc.Inventors: Daniel J. Devine, Charles Crapuchettes, Dixit Desai, Rene George, Vincent C. Lee, Yuya Matsuda, Jonathan Mohn, Ryan M. Pakulski, Stephen E. Savas, Martin Zucker
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Patent number: 8668422Abstract: As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.Type: GrantFiled: August 17, 2004Date of Patent: March 11, 2014Assignee: Mattson Technology, Inc.Inventors: Leszek Niewmierzycki, David Barker, Daniel J. Devine, Michael Kuhlman, Ryan Pakulski, Hongqing Shan, Martin Zucker
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Publication number: 20100190331Abstract: A method for depositing a film onto a substrate is provided. The substrate is contained within a reactor vessel at a pressure of from about 0.1 millitorr to about 100 millitorr. The method comprises subjecting the substrate to a reaction cycle comprising i) supplying to the reactor vessel a gas precursor at a temperature of from about 20° C. to about 150° C. and a vapor pressure of from about 0.1 torr to about 100 torr, wherein the gas precursor comprises at least one organo-metallic compound; and ii) supplying to the reactor vessel a purge gas, an oxidizing gas, or combinations thereof.Type: ApplicationFiled: September 15, 2009Publication date: July 29, 2010Inventors: Steven C. Selbrede, Martin Zucker, Vincent Venturo
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Patent number: 7658586Abstract: A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.Type: GrantFiled: April 1, 2005Date of Patent: February 9, 2010Assignee: Mattson Technology, IncInventors: Leszek Niewmierzycki, David Barker, Michael Kuhlman, Ryan Pakulski, Hongqing Shan, Martin Zucker
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Patent number: 7563068Abstract: As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.Type: GrantFiled: January 11, 2007Date of Patent: July 21, 2009Assignee: Mattson Technology, Inc.Inventors: Leszek Niewmierzycki, David Barker, Daniel J. Devine, Michael Kuhlman, Ryan Pakulski, Hongqing Shan, Martin Zucker
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Publication number: 20090028761Abstract: An apparatus and method are described for processing workpieces in a treatment process. A multi-wafer chamber defines a chamber interior including at least two processing stations within the chamber interior such that the processing stations share the chamber interior. Each processing station includes a plasma source and a workpiece pedestal for exposing one of the workpieces to the treatment process using a respective plasma source. The chamber includes an arrangement of one or more electrically conductive surfaces that are asymmetrically disposed about the workpiece at each processing station in a way which produces a given level of uniformity of the treatment process on a major surface of each workpiece. A shield arrangement provides an enhanced uniformity of exposure of the workpiece to the respective one of the plasma sources that is greater than the given level of uniformity that would be provided in an absence of the shield arrangement.Type: ApplicationFiled: July 27, 2007Publication date: January 29, 2009Inventors: Daniel J. Devine, Charles Crapuchettes, Dixit Desai, Rene George, Vincent C. Lee, Yuya Matsuda, Jonathan Mohn, Ryan M. Pakulski, Stephen E. Savas, Martin Zucker
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Publication number: 20070175864Abstract: As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.Type: ApplicationFiled: January 11, 2007Publication date: August 2, 2007Inventors: Leszek Niewmierzycki, David Barker, Daniel Devine, Michael Kuhlman, Ryan Pakulski, Hongqing Shan, Martin Zucker
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Publication number: 20070012251Abstract: A guard barrier arrangement is used in an O-ring seal arrangement to limit reactive species in coming into contact with an O-ring. The arrangement is supported in a chamber passage for exposure to the reactive species. An o-ring is compressed so as to peripherally resiliently bias the guard ring arrangement further into the chamber passage configuration toward the chamber interior to limit access of the reactive species to the o-ring. The passage configuration can use a narrowing surface arrangement against which the barrier arrangement is urged. The barrier can include an annular configuration that can change responsive to being biased into the chamber passage configuration.Type: ApplicationFiled: June 29, 2006Publication date: January 18, 2007Inventors: Martin Zucker, Daniel Devine, Rene George, Josef Hoog, Vincent Lee
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Publication number: 20060045664Abstract: As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.Type: ApplicationFiled: August 17, 2004Publication date: March 2, 2006Inventors: Leszek Niewmierzycki, David Barker, Daniel Devine, Michael Kuhlman, Ryan Pakulski, Hongqing Shan, Martin Zucker
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Publication number: 20060039781Abstract: A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.Type: ApplicationFiled: April 1, 2005Publication date: February 23, 2006Inventors: Leszek Niewmierzycki, David Barker, Michael Kuhlman, Ryan Pakulski, Hongqing Shan, Martin Zucker
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Publication number: 20040025787Abstract: A method for depositing a film onto a substrate is provided. The substrate is contained within a reactor vessel at a pressure of from about 0.1 millitorr to about 100 millitorr. The method comprises subjecting the substrate to a reaction cycle comprising i) supplying to the reactor vessel a gas precursor at a temperature of from about 20° C. to about 150° C. and a vapor pressure of from about 0.1 torr to about 100 torr, wherein the gas precursor comprises at least one organo-metallic compound; and ii) supplying to the reactor vessel a purge gas, an oxidizing gas, or combinations thereof.Type: ApplicationFiled: April 14, 2003Publication date: February 12, 2004Inventors: Steven C. Selbrede, Martin Zucker, Vincent Venturo