Abstract: A heat sink structure having a pipe attached to a plurality of fins for dissipating heat into an environment. Each fin in the plurality is constructed of a thermally conductive material and has a cavity formed therein dimensioned for seating about the pipe exterior surface. An opening or notch extends from the edge of each of the fins to the cavity to facilitate the spread of an adhesive or solder to the fin/pipe interface for providing thermal and physical coupling of the plurality of fins to the pipe.

Abstract: A heat sink assembly having a heat plate with a channel formed therein which is accessible through a surface of the heat plate via a slot. A heat pipe is disposed in the channel and is bound to the heat plate with a bonding material disposed through the slot and into the channel.

Abstract: A heat sink structure having a pipe attached to a plurality of fins for dissipating heat into an environment. Each fin in the plurality is constructed of a thermally conductive material and has a cavity formed therein dimensioned for seating about the pipe exterior surface. An opening or notch extends from the edge of each of the fins to the cavity to facilitate the spread of an adhesive or solder to the fin/pipe interface for providing thermal and physical coupling of the plurality of fins to the pipe.

Abstract: Disclosed is a spring clip fastener for mounting a heat sink and a semiconductor device package to the surface of a circuit board. The fastener includes a spring portion and support members extending from the spring portion for supporting the spring portion above the surface of the circuit board. A shoulder is internally formed in the support members so that the spring portion urges the semiconductor device package against the heat sink. Feet extend from the support members for engaging the surface of the circuit board. The feet are coated with a solder-promoting material.

Abstract: A self-securing heat sink for transistors and the like comprises a unitary member that is constructed from a malleable material having a high heat transfer coefficient. The unitary member includes a base portion, at least one heat radiating fin portion, and a clip portion that is capable of engaging a transistor to retain the heat sink securely on the transistor without necessitating the use of threaded fasteners, rivets, or the like.

Abstract: A heat sink is described that includes a base portion, and having a pair of heat radiating portions attached to the base portion. The heat radiating portions are each of sufficient width so that when bent along a line at roughly their midpoint, the unattached lower edges of such heat radiating portions will be disposed parallel to and in juxtaposition with the free edges of the base portion. Also, the method of manufacturing such heat sink includes, after punching the heat sinks from the sheet of material from which they are constructed, bending the heat radiating portions along the line extending generally through their midpoint and intersecting a corner of the base and then bending each of the heat radiating portions along an edge of the base to a position wherein the heat radiating portions are disposed at approximately 90 degrees to the base portion.

Abstract: A spring clip fastener (10) is provided for mounting a heat sink (40) and a semiconductor device package (42) to a circuit board (44). Spring clip fastener (10) includes a spring portion (12). Support members (14, 16) extend from the spring portion (12) for supporting the spring portion (12) above the surface of the circuit board (44). A shoulder (18, 20) is contained within the support members (14, 16), such that the spring portion (12) urges the semiconductor device package (42) against the heat sink (40). Feet (30, 32) extend from support members (22, 24) for engaging holes (46, 52) of the circuit board (44). Feet (30, 32) are coated with a solder-promoting material.