Patents by Inventor Marvin Klein
Marvin Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11137304Abstract: A system, probe and method accurately measure the strain or extension of a fastener that occurs as a nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections, which result in a higher magnitude and more easily and precisely measurable reflected signal peak than a signal peak associated with a signal directly reflected against the opposite end of the fastener.Type: GrantFiled: January 4, 2020Date of Patent: October 5, 2021Assignee: Intelligent Optical Systems, Inc.Inventor: Marvin Klein
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Publication number: 20200141826Abstract: A system, probe and method accurately measure the strain or extension of a fastener that occurs as a nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections, which result in a higher magnitude and more easily and precisely measurable reflected signal peak than a signal peak associated with a signal directly reflected against the opposite end of the fastener.Type: ApplicationFiled: January 4, 2020Publication date: May 7, 2020Inventor: Marvin Klein
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Patent number: 10527510Abstract: In the present disclosure, embodiments including a system, probe and method are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections.Type: GrantFiled: March 26, 2019Date of Patent: January 7, 2020Assignee: Optech Ventures, LLCInventor: Marvin Klein
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Publication number: 20190219466Abstract: In the present disclosure, embodiments including a system, probe and method are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections.Type: ApplicationFiled: March 26, 2019Publication date: July 18, 2019Inventor: Marvin Klein
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Patent number: 10345173Abstract: In the present disclosure, embodiments including a system, device and methods are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal wave reflections and a mode conversion to a shear wave.Type: GrantFiled: May 12, 2017Date of Patent: July 9, 2019Assignee: Optech Ventures, LLCInventor: Marvin Klein
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Patent number: 10184858Abstract: A visual inspection system (100, 200) for optical fibers (150) includes at least a pattern source (120, 220A, 220B, 220C, 520); at least a first illumination source (130, 230A, 230B, 230C, 510, 522) to direct light towards an optical fiber (150); and at least a first camera (140, 240A, 240B, 240C, 540) positioned at an opposite side of the fiber (150) from the pattern source (120, 220A, 220B, 220C, 520). At least one image (170, 180, 190) of the optical fiber (150) is taken and a pattern visible through the optical fiber (150) in the image (170, 180, 190) may be analyzed to detect distortions in the pattern.Type: GrantFiled: February 1, 2013Date of Patent: January 22, 2019Assignee: CommScope Connectivity Belgium BVBAInventors: Marvin Klein, Milan Maksimovic, Gerard Cornelis Van Den Eijkel
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Publication number: 20170363491Abstract: In the present disclosure, embodiments including a system, device and methods are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal wave reflections and a mode conversion to a shear wave.Type: ApplicationFiled: May 12, 2017Publication date: December 21, 2017Inventor: Marvin Klein
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Publication number: 20150009320Abstract: A visual inspection system (100, 200) for optical fibers (150) includes at least a pattern source (120, 220A, 220B, 220C, 520); at least a first illumination source (130, 230A, 230B, 230C, 510, 522) to direct light towards an optical fiber (150); and at least a first camera (140, 240A, 240B, 240C, 540) positioned at an opposite side of the fiber (150) from the pattern source (120, 220A, 220B, 220C, 520). At least one image (170, 180, 190) of the optical fiber (150) is taken and a pattern visible through the optical fiber (150) in the image (170, 180, 190) may be analyzed to detect distortions in the pattern.Type: ApplicationFiled: February 1, 2013Publication date: January 8, 2015Inventors: Marvin Klein, Milan Maksimovic, Gerard Cornelis Van Den Eijkel
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Patent number: 8269979Abstract: A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.Type: GrantFiled: December 6, 2007Date of Patent: September 18, 2012Assignee: Optech Ventures, LLCInventors: Marvin Klein, Todd Murray
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Patent number: 8243280Abstract: A laser ultrasonic measurement system includes a first and a second laser source configured to generate a first and a second laser beam, respectively. A movable mechanical link is arranged to transmit the first laser beam. The movable mechanical link is formed by a plurality of rigid sections interconnected by rotating joints. A robot is configured to support and control the movement of at least a section of the mechanical link to transmit the first laser beam to an object. An optical scanner is positioned proximate to the mechanical link. The optical scanner is configured to direct the first and second laser beams onto the object. An interferometer is optically coupled to the optical scanner. The interferometer is configured to receive reflected light from the object and in response generate an electrical signal. The first laser source is kinematically mounted in a housing assembly.Type: GrantFiled: May 12, 2009Date of Patent: August 14, 2012Assignee: iPhoton Solutions, LLCInventors: Marc Dubois, Thomas E. Drake, Marvin Klein
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Patent number: 8149421Abstract: Faults, dimensions and other characteristics of a material or structure are sensed by a coherent beam's reflection from the material when probed with ultrasonic waves or when vibrating at high frequencies. The reflected beam acquires a dynamic phase change substantially different from its original phase and from the phase of a reference beam split from the common source beam. The reflected beam and the reference beam are superimposed by diffraction in an adaptive holographic beam-splitter, and the superimposed beams are detected by a photodetector capable of detecting small phase changes from ultrasonic surface displacements or perturbations. An apparatus and method are disclosed defining an improved crystal homodyne interferometer with an energy source coupled to the crystal and operative to maintain the crystal in a condition for emptying unwanted traps in the crystal.Type: GrantFiled: June 23, 2008Date of Patent: April 3, 2012Assignee: Optech Ventures, LLCInventors: Marvin Klein, Konstantin Shcherbin
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Publication number: 20100131210Abstract: The invention relates to a method and inspection system for non-destructive inspection of a colony of stress corrosion cracks in a pipe or a vessel. The method comprises mapping the colony of stress corrosion cracks, identifying at least one individual crack to be sized within the colony, and sizing the at least one individual crack to be sized.Type: ApplicationFiled: November 24, 2008Publication date: May 27, 2010Inventors: Martin Fingerhut, Munendra Tomar, Marvin Klein
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Publication number: 20090290163Abstract: A laser ultrasonic measurement system includes a first and a second laser source configured to generate a first and a second laser beam, respectively. A movable mechanical link is arranged to transmit the first laser beam. The movable mechanical link is formed by a plurality of rigid sections interconnected by rotating joints. A robot is configured to support and control the movement of at least a section of the mechanical link to transmit the first laser beam to an object. An optical scanner is positioned proximate to the mechanical link. The optical scanner is configured to direct the first and second laser beams onto the object. An interferometer is optically coupled to the optical scanner. The interferometer is configured to receive reflected light from the object and in response generate an electrical signal. The first laser source is kinematically mounted in a housing assembly.Type: ApplicationFiled: May 12, 2009Publication date: November 26, 2009Inventors: Marc DUBOIS, Thomas E. DRAKE, Marvin KLEIN
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Publication number: 20080216575Abstract: A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.Type: ApplicationFiled: December 6, 2007Publication date: September 11, 2008Inventors: Marvin Klein, Todd Murray
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Patent number: 7327448Abstract: Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Alternatively, the generation laser beam may be absorbed in the bulk of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using overlapping probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.Type: GrantFiled: July 29, 2004Date of Patent: February 5, 2008Assignees: Optech Ventures LLC, Boston UniversityInventors: Marvin Klein, Todd Murray
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Publication number: 20070234809Abstract: Subsurface defects in a processed metal are detected by a laser-ultrasonic method involving generation of a surface acoustic wave at one location on the processed metal surface, and detection of a scattered acoustic wave at another location on the processed metal surface. The method can be used in-line to provide real time monitoring of laser cladding and other metal processing operations.Type: ApplicationFiled: October 4, 2005Publication date: October 11, 2007Inventors: Marvin Klein, Todd Sienicki, Jerome Eichenbergeer
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Patent number: 7278315Abstract: Subsurface defects in a processed metal are detected by a laser-ultrasonic method involving generation of a surface acoustic wave at one location on the processed metal surface, and detection of a scattered acoustic wave at another location on the processed metal surface. The method can be used in-line to provide real time monitoring of laser cladding and other metal processing operations.Type: GrantFiled: October 4, 2005Date of Patent: October 9, 2007Assignee: Op tech Ventures LLCInventors: Marvin Klein, Todd Sienicki, Jerome Eichenbergeer
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Patent number: 7241808Abstract: A composition for the treatment of skin comprises a carboxylated, acidic amino acid obtained by acidifying an acidic amino acid with a carboxylic acid. The resultant material, which is also referred to as a tricarboxylic acid or an amino fruit acid, has significant benefit for the treatment of a number of skin conditions. In addition, the composition of the present invention is very noncaustic to skin, even when employed at a pH as low as 0.5. Also disclosed herein are therapeutic methods and compositions which employ the carboxylated acidic amino acids.Type: GrantFiled: May 1, 2003Date of Patent: July 10, 2007Inventors: Marvin Klein, John E. Kulesza
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Patent number: 7117741Abstract: Dynamic vibration monitoring of a cutting tool or workpiece is provided by propagating an ultrasonic carrier beam in a stream of fluid flowing from a probe chamber, which includes a transducer, to the cutting tool or workpiece target area. The modulated ultrasonic beam reflected from the target is detected via a transducer in the chamber, and is demodulated to provide measurements of vibrational surface displacement and velocity. The method is insensitive to the target surface roughness and can be used for dynamic characterization prior to machining, and for monitoring during the machining operation. The device is inexpensive and robust to the machining environment, and can be applied to small cutting tools.Type: GrantFiled: March 23, 2004Date of Patent: October 10, 2006Inventors: Marvin Klein, Bruno Pouet, Jerome Eichenberger
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Publication number: 20060021438Abstract: Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Alternatively, the generation laser beam may be absorbed in the bulk of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using overlapping probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.Type: ApplicationFiled: July 29, 2004Publication date: February 2, 2006Inventors: Marvin Klein, Todd Murray