Patents by Inventor Marvin L. Buller

Marvin L. Buller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of providing an externally accessible flash memory card with security feature in a network computer
    Patent number: 6259598
    Abstract: A computer chassis for covering and protecting the components of a data processing system. In a preferred embodiment, the computer chassis includes a chassis bezel. The chassis bezel has a slotted opening there through for allowing a user to access a user changeable component in the data processing system. The chassis bezel is configured to accept a cover plate that will cover the slotted opening thus preventing access to the user changeable component.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventors: Daniel Paul Beaman, Marvin L. Buller, Michael Edward Criscolo, Sanjay Gupta, Brian Michael Kerrigan
  • Method for attaching heat sink to plastic packaged electronic component
    Patent number: 4978638
    Abstract: Described is an improvement for thermal enhancement technology for high power dissipating plastic packaged electronic circuit chips derived from providing structural features in the plastic package adapted to snap fit with complementarily formed edges of heat sink members.
    Type: Grant
    Filed: December 21, 1989
    Date of Patent: December 18, 1990
    Assignee: International Business Machines Corporation
    Inventors: Marvin L. Buller, Barbara J. McNelis, Campbell H. Snyder
  • Welded wire cooling
    Patent number: 4714953
    Abstract: An improved thermal management technique is disclosed for use in semiconductor device packaging utilizing ultrasonic welding to attach aluminum wires of predetermined diameter at one end directly to preselected hot spots on the device and at the other end to thermally conductive package elements.
    Type: Grant
    Filed: May 12, 1986
    Date of Patent: December 22, 1987
    Assignee: International Business Machines Corporation
    Inventors: Marvin L. Buller, Douglas L. Lumbra, Douglas W. Phelps, Sigvart J. Samuelsen, William C. Ward