Patents by Inventor Marvin Laut

Marvin Laut has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sheet metal component with depression
    Patent number: 6281432
    Abstract: A process is provided for providing a metal element and removing portions of the metal at a series of location at a section of the metal element. By removing portions of the metal element a plurality of webs are provided separating the holes where the material has been removed. The webs are subsequently pressed to allow the webs to expand into the region of the holes and to form a depressed region based on the depressed surfaces of each of the webs relative to the surrounding web seat. The resulting product provides a metal piece such as a sheet metal element wherein a groove or depression is formed on one side without any extension or protrusion on the other side. A system is also provided using the metal element in combination with a gasket element and another component. This system provides an effective EMI barrier.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: August 28, 2001
    Assignee: 3Com Corporation
    Inventor: Marvin Laut
  • Electromagnetic emissions shielding structure for circuit board connector assembly
    Patent number: 6116924
    Abstract: An assembly is provided including a printed circuit board, a faceplate and a connector. The connector provides a media interface for connections through the circuit board. The printed circuit board is provided with a ground plane over a ground plane region. The faceplate includes a faceplate extension extending from a front faceplate region to the ground plane region of the PCB. The faceplate extension includes a ground plane contact portion in contact with the ground plane.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: September 12, 2000
    Assignee: 3COM Corporation
    Inventor: Marvin Laut
  • Ring-connected circuit module assembly
    Patent number: 4700274
    Abstract: A ring-connected circuit module assembly wherein signals are regenerated at each circuit module is provided in a single row of parallel circuit modules. The assembly provides short interconnection lengths and facilitates access and servicing of the circuit modules. Circuit modules of a first set alternate in the assembly with circuit modules of a second set. Adjacent circuit modules in the first set are interconnected, adjacent circuit modules in the second set are interconnected and a circuit module of the first set is interconnected with the adjacent module of the second set at each end of the row to form a ring-connection of the circuit modules. The maximum interconnection length is twice the distance between adjacent circuit modules.
    Type: Grant
    Filed: February 5, 1987
    Date of Patent: October 13, 1987
    Assignee: GTE Laboratories, Incorporated
    Inventor: Marvin Laut