Patents by Inventor Marvin Wayne Cowens

Marvin Wayne Cowens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire-based methodology of widening the pitch of semiconductor chip terminals
    Patent number: 8674504
    Abstract: A packaged semiconductor device (100) comprising a semiconductor chip (101) of an area having a first surface (101a) including a plurality of bond pads (102) linearly arrayed, adjacent pads having a first pitch (103) center-to-center; an insulating layer (110) on the first chip surface covering the chip area, the layer having a height (116) and a second surface (110a) parallel to the first surface; the second surface including contact nodes (120) in staggered array, the nodes having the same plurality as the pads, adjacent nodes having a second pitch (121) center-to-center greater than the first pitch; and metal wires through the layer height connecting the pads to respective nodes.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: March 18, 2014
    Assignee: Texas Systems Incorporated
    Inventors: Charles Anthony Odegard, Marvin Wayne Cowens, Jaimal Mallory Williamson
  • Wire-Based Methodology of Widening the Pitch of Semiconductor Chip Terminals
    Publication number: 20130307141
    Abstract: A packaged semiconductor device (100) comprising a semiconductor chip (101) of an area having a first surface (101a) including a plurality of bond pads (102) linearly arrayed, adjacent pads having a first pitch (103) center-to-center; an insulating layer (110) on the first chip surface covering the chip area, the layer having a height (116) and a second surface (110a) parallel to the first surface; the second surface including contact nodes (120) in staggered array, the nodes having the same plurality as the pads, adjacent nodes having a second pitch (121) center-to-center greater than the first pitch; and metal wires through the layer height connecting the pads to respective nodes.
    Type: Application
    Filed: May 21, 2012
    Publication date: November 21, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Charles Anthony Odegard, Marvin Wayne Cowens, Jaimal Mallory Williamson
  • LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM
    Publication number: 20100159644
    Abstract: Various exemplary embodiments provide materials and methods for flip-chip packaging technology. The disclosed flip-chip packaging technology can use a single B-stage wafer-applied photo-sensitive adhesive along with printed interconnects, which does not include conventional underfill materials and processes. In one embodiment, a photo-sensitive adhesive can be applied on a semiconductor die or a base substrate with conductive bumps printed in through-openings of the photo-sensitive adhesive. One or more semiconductor dies can be laterally packaged or vertically stacked on the base substrate using the printed conductive bumps as interconnects there-between.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 24, 2010
    Inventors: Rajiv Carl Dunne, Marvin Wayne Cowens, Mario Antonio Bolanos