Abstract: This disclosure describes systems and methods for a single-use oximetry sensor in which a single-use connector is used with the sensor assembly. The disclosure describes a connector which consists of a single-use male connector for use with female connector on an oximeter. The connector includes a housing enclosing one or more pins, one or more movable members, and a locking mechanism. Upon engagement of the male connector into the female connector the locking mechanism activates such that when the female connector is removed, the moveable member moves from a first position to a second position and locks into the second position. When in the second position the male connector can not engage the female connector, thereby limiting the male connector to a single use engagement.

Abstract: This disclosure describes systems and methods for a single-use oximetry sensor in which a single-use connector is used with the sensor assembly. The disclosure describes a connector which consists of a single-use male connector for use with female connector on an oximeter. The connector includes a housing enclosing one or more pins, one or more movable members, and a locking mechanism. Upon engagement of the male connector into the female connector the locking mechanism activates such that when the female connector is removed, the moveable member moves from a first position to a second position and locks into the second position. When in the second position the male connector can not engage the female connector, thereby limiting the male connector to a single use engagement.

Abstract: A method for work hardening gold contact pads is disclosed. The method includes providing gold contact pads, providing lapping pads, and placing the lapping pads in contact with the gold contact pads to create a contact interface. A liquid medium is then applied to the contact interface while moving the lapping pads relative to the gold contact pads. The liquid medium is preferably a particulate-free pH neutral liquid, which makes water a good choice. Also disclosed is a gold pad having a work hardened surface.

Abstract: A method for work hardening gold contact pads is disclosed. The method includes providing gold contact pads, providing lapping pads, and placing the lapping pads in contact with the gold contact pads to create a contact interface. A liquid medium is then applied to the contact interface while moving the lapping pads relative to the gold contact pads. The liquid medium is preferably a particulate-free pH neutral liquid, which makes water a good choice. Also disclosed is a gold pad having a work hardened surface.

Abstract: A semiconductor substrate material is disclosed for producing a semiconductor substrate. In an embodiment, the semiconductor substrate material may include a multitude of hollow microspheres. Each one of the multitude of hollow microspheres may have an inner layer and an outer layer. The inner layer may include a first material, the outer layer may include a second material, and the first material and the second material may differ from one another. The first material of the inner layer of each of the multitude of hollow microspheres may have a first melting point, the second material of the outer layer of the multitude of hollow microspheres may have a second melting point, and the first melting point may be higher than the second melting point.

Abstract: Methods for producing waveguides are disclosed. In one embodiment, a waveguide is produced by depositing a first metal layer on a substrate, depositing a sacrificial material on the first metal layer, depositing a second metal layer on the sacrificial material, the second metal layer contacting the first metal layer and defining therebetween a cavity for the waveguide, the cavity filled with the sacrificial material, and removing the sacrificial material.

Abstract: The present invention relates to an electrical relay in which a solid slug is moved within a channel and used to make or break an electrical connection. The solid slug is moved by electromagnets. In the preferred embodiment, the slug is wetted by a conducting liquid, such as liquid metal, that also adheres to wettable contact pads within the channel to provide a latching mechanism. The relay is amenable to manufacture by micro-machiningtechniques.

Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) depositing a photoimagable dielectric layer onto a substrate, 2) photoimaging at least one channel plate feature on the dielectric layer, and 3) developing the dielectric layer to form the at least one channel plate feature in the dielectric layer, thereby forming the channel plate. A method for making a switch with a photoimaged channel plate is also disclosed.

Abstract: Fluid-based switches and methods for producing the same are disclosed. In one embodiment, a method for producing a switch comprises depositing a first alignment pad on a first substrate, depositing a second alignment pad on a second substrate with a perimeter relief surrounding the second alignment pad, depositing solder on at least one of the alignment pads, depositing a switching fluid on the first substrate, mating the first substrate to the second substrate by aligning the alignment pads and heating the solder, the substrates defining there between a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states to form a liquid switch, forming a perimeter ring around the liquid switch on at least one of the two substrates, depositing wettable material in the perimeter ring, depositing solder paste containing uncured epoxy on the wettable material in the perimeter ring, and reflowing the solder paste.

Abstract: In accordance with the invention, Brownian noise caused by molecular gas collisions in a micromachined varactor are substantially reduced, and even eliminated, by specialized packaging of the micromachined varactor. The packaging of the micromachined varactor provides for altering the environment of the micromachined varactor so that it is in a vacuum rather than in a gas. Accordingly, the random pressure fluctuations may be completely eliminated. Since a varactor is a device in which the moveable parts do not make contact with the fixed parts, and then separate, stiction is not a problem.

Abstract: A method for healing cracks in a switch substrate is disclosed. The method includes heating the switch substrate to a temperature in the range between an annealing point and a softening point of the substrate, and then cooling the substrate. Also disclosed are a method for forming a channel plate, and a method for producing a switch.

Abstract: Disclosed herein is a channel plate for a fluid-based switch. The channel plate is produced by 1) forming a plurality of channel plate layers in ceramic green sheet, 2) forming at least one channel plate feature in at least one of the channel plate layers, and 3) laminating the channel plate layers to form the channel plate. A method for making a switch with a ceramic channel plate is also disclosed.

Abstract: Fluid-based switches and a method for producing the same are disclosed. In one embodiment, a switch is provided with first and second mated substrates that define therebetween at least portions of a number of cavities. A plurality of wettable pads is exposed within one or more of the cavities. A switching fluid is held within one or more of the cavities, and is wetted to the wettable pads. The switching fluid serves to open and block light paths through one or more of the cavities, in response to forces that are applied to the switching fluid. Forces are applied to the switching fluid by an actuating fluid that is held within one or more of the cavities. At least a portion of the switching fluid is coated with a surface tension modifier.

Abstract: Fluid-based switch and methods for reducing oxides on switching fluid are disclosed. In one method, oxides are reduced by depositing a switching fluid on a first substrate, mating the first substrate to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states, and creating a gas in the cavity holding the switching fluid, the gas to react with at least one of oxygen in the cavity and oxides on the switching fluid.

Abstract: A method for depositing material on a channel plate such that the material is registered to one or more channels formed in the channel plate includes filling at least one of the channels with a resist that is not wetted by the material; depositing the material on at least a region of the channel plate that includes at least part of the resist, the material registering with at least one channel edge as a result of the material's abutment to the resist; and then removing the resist. The method may be used, in one embodiment, to apply an adhesive or gasket material that is used in assembling a switch.

Abstract: A semiconductor substrate is presented which is manufactured from hollow, gas-filled glass or ceramic microspheres, which are bound together in a dried or fired matrix. The microspheres may be glass-coated microspheres, which are bound together by sintering the outer layers of glass together. The semiconductor surface may be smoothed by glazing the surface.

Abstract: Methods for producing air bridges are disclosed. In one embodiment, an air bridge is produced by depositing one or more circuit components on a substrate, depositing a sacrificial material over at least a portion of the circuit components, depositing a first circuit trace over the sacrificial material, the first circuit trace crossing over the circuit components, and thermally decomposing the sacrificial material.

Abstract: Methods for producing waveguides are disclosed. In one embodiment, a waveguide is produced by depositing a first metal layer on a substrate, depositing a sacrificial material on the first metal layer, depositing a second metal layer on the sacrificial material, the second metal layer contacting the first metal layer and defining therebetween a cavity for the waveguide, the cavity filled with the sacrificial material, and removing the sacrificial material.

Abstract: In one embodiment, a switch is assembled by depositing a liquid switching element on a substrate. A channel plate is then positioned adjacent the substrate. The channel plate has a main channel and a waste chamber, and the main channel is positioned over the liquid switching element. The channel plate is then moved toward the substrate to cause a portion of the liquid switching element that overfills the main channel to be isolated from the main channel in the waste chamber. A method of switch production is also disclosed.

Abstract: Disclosed herein is a method for making a fluid-based switch having a channel plate and a switching fluid. The method comprises 1) ultrasonically milling at least one feature into a channel plate, and 2) aligning the at least one feature cut in the channel plate with at least one feature on a substrate and sealing at least a switching fluid between the channel plate and the substrate. Alternate embodiments of the invention are also disclosed.