Abstract: A device for applying and removing nail polish comprising a first container for storing polish remover solvent and a second container for storing nail polish. Each container includes a threaded neck and an opening. A lid structure includes a first end for rotatably mounting to the threaded neck of the first container and a second end for rotatably mounting to the threaded neck of the second container. A sponge applicator snap fits into the opening of the first container for selectively permitting dispensing of the polish remover solvent. A brush assembly is mounted within the lid structure for facilitating application of the nail polish. The nail polish application and removal device also includes a check valve snap fitted into the opening of the second container for straightening the bristles of the brush assembly, and a replaceable emery board removably attached to the exterior surface of the first container for filing and shaping nails.