Patents by Inventor Mary G. Boyd

Mary G. Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4610744
    Abstract: A decorative laminate and method of transferring designs onto articles. The laminate is formed of a transfer substrate affixed to a support member. The transfer substrate is composed of a protective layer, an ink layer, and a nonwax-based adhesive/release layer. The adhesive/release layer is in direct contact with the support member and use of a wax layer intermediate the adhesive/release layer and the support is excluded. Optionally, a barrier layer is provided between the adhesive/release layer and the ink layer. In many applications the protective coating layer may be omitted. The laminate is applied to an article using a heated silicone rubber transfer pad to which the transfer substrate adheres during the transfer process.
    Type: Grant
    Filed: September 9, 1985
    Date of Patent: September 9, 1986
    Assignee: Dennison Manufacturing Company
    Inventors: Donald R. Smith, Mary G. Boyd
  • Patent number: 4555436
    Abstract: An improved release formulation for use in a heat transferable laminate wherein an ink design image is transferred from a carrier support to an article by application of heat to the carrier support. On transfer the release splits from the carrier and forms a protective coating over the transfered design. The improved release is coated onto the carrier as a solvent based-wax release. The release coating is then dried to evaporate the solvent contained therein. The improved release has the property that its constituents remain in solution down to temperatures approaching ambient temperature. Upon transfer, the release forms a protective coat which may be subjected to hot water. The improved release contains a montan wax, a rosin ester or hydrocarbon resin, a solvent, and ethylene-vinyl acetate copolymer having a low vinyl acetate content.
    Type: Grant
    Filed: May 3, 1984
    Date of Patent: November 26, 1985
    Assignee: Dennison Manufacturing Co.
    Inventors: Friedrich H. H. Geurtsen, John M. Anemaet, Donald R. Smith, Mary G. Boyd
  • Patent number: 4511425
    Abstract: Apparatus for heat transfer labelling of articles using a resilient pad maintained at elevated temperatures. Decorative laminates affixed to a support member such as a web are fed to a heated platen. A resilient pad consisting of a silicone elastomer is pressed against the laminate at the heated platen, whereby the laminate adheres to the pad when it retracts from the platen. The heated pad is then pressed against an article to be labelled, to which the transfer substrate adheres in preference to the pad surface. The resilient pad is typically heated to a temperature above ambient temperature but lower than that of the heated platen. The pad is heated by repetitive contact with the platen, and additionally by an independent heater. The pad may include one or more interior heating elements, or an exterior radiant heater located adjacent the pad during periods between label transfers. This apparatus is well suited to the labelling of articles of a wide variety of sizes, shapes, and materials.
    Type: Grant
    Filed: June 13, 1983
    Date of Patent: April 16, 1985
    Assignee: Dennison Manufacturing Company
    Inventors: Mary G. Boyd, Donald R. Smith, Peter F. Imondi, Norman A. Hiatt, Fritz E. Bauer, John M. Anemaet, Alfred K. MacKenzie
  • Patent number: 4392905
    Abstract: A decorative laminate and method of transferring designs onto articles. The laminate is formed of a transfer substrate affixed to a support member. The transfer substrate is composed of a protective layer, an ink layer and a resinous coating layer. Optionally, a barrier layer is provided beteen the resinous layer and the ink layer. In many applications the protective coating layer may be omitted. The laminate is applied to an article using a heated silicone rubber transfer pad to which the transfer substrate adheres during the transfer process.
    Type: Grant
    Filed: July 30, 1981
    Date of Patent: July 12, 1983
    Assignee: Dennison Manufacturing Company
    Inventors: Mary G. Boyd, Donald R. Smith