Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: A method of processing a patch includes mounting the patch on a surface of a caul plate having at least one suction hole, and drawing a vacuum through the suction hole to maintain the patch in contact with the caul plate.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.

Abstract: A method of processing a patch includes mounting the patch on a surface of a caul plate having at least one suction hole, and drawing a vacuum through the suction hole to maintain the patch in contact with the caul plate.

Abstract: A tool comprises a caul plate having at least one suction hole and a vacuum port fluidly coupled to the suction hole for drawing a patch against the caul plate under vacuum.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: A tool comprises a caul plate having at least one suction hole and a vacuum port fluidly coupled to the suction hole for drawing a patch against the caul plate under vacuum.

Abstract: A surrogate patch assembly for a rework area of a structure comprises a surrogate patch body which may be formed of a material for drawing moisture from the rework area. The patch assembly may include a sensor mounted to the surrogate patch body. The sensor may comprise a thermal sensor for sensing the temperature of the rework area and the surrogate patch body. The sensor may comprise a moisture sensor for sensing moisture drawn into the surrogate patch body.