Patents by Inventor Mary W. Hartnett

Mary W. Hartnett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming an adhesive connection
    Patent number: 6077380
    Abstract: Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: June 20, 2000
    Assignee: MicroFab Technologies, Inc.
    Inventors: Donald J. Hayes, Mary W. Hartnett
  • Manufacture of coated spheres
    Patent number: 5736074
    Abstract: Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.
    Type: Grant
    Filed: June 30, 1995
    Date of Patent: April 7, 1998
    Assignee: Micro Fab Technologies, Inc.
    Inventors: Donald J. Hayes, Mary W. Hartnett