Patents by Inventor Masaaki EIDA

Masaaki EIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Joined component
    Patent number: 11460061
    Abstract: A joined component includes a first member provided with a first joint surface having an arranging part where a brazing filler material is arranged, a second member joined to the first member by brazing, and provided with a second joint surface having an accommodating recess that opposes the arranging part, a guide groove formed in the first joint surface or the second joint surface, and extending from the arranging part or the accommodating recess toward a fringe of the first joint surface or the second joint surface, and a chamfer formed along the fringe of the first joint surface or the second joint surface, and the guide groove communicates to the chamfer.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: October 4, 2022
    Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
    Inventors: Reiko Okuno, Masaaki Eida
  • JOINED COMPONENT
    Publication number: 20210033124
    Abstract: A joined component includes a first member provided with a first joint surface having an arranging part where a brazing filler material is arranged, a second member joined to the first member by brazing, and provided with a second joint surface having an accommodating recess that opposes the arranging part, a guide groove formed in the first joint surface or the second joint surface, and extending from the arranging part or the accommodating recess toward a fringe of the first joint surface or the second joint surface, and a chamfer formed along the fringe of the first joint surface or the second joint surface, and the guide groove communicates to the chamfer.
    Type: Application
    Filed: July 23, 2018
    Publication date: February 4, 2021
    Inventors: Reiko OKUNO, Masaaki EIDA