Abstract: The present invention provides a sample holding carrier that can accurately measure a sample with a simple configuration, and a fluorescence detection system and device that use the same. Biosensor substrate includes: base substrate on which excitation light is incident from a lower surface; reflecting film that is arranged on an upper surface of base substrate to partially reflect the excitation light; and plural wells that are arranged on an upper surface side of reflecting film and have bottom surface portions. The excitation light is converged to be incident on base substrate. Distance from reflecting surface that is of a boundary between reflecting film and base substrate to bottom surface portion of well is less than or equal to a focal depth of the excitation light. Therefore, the sample accommodated in bottom surface portion of well can surely and efficiently be irradiated with the excitation light, and accurately be measured.

Abstract: The present invention provides a sample holding carrier that can accurately measure a sample with a simple configuration, and a fluorescence detection system and device that use the same. Biosensor substrate includes: base substrate on which excitation light is incident from a lower surface; reflecting film that is arranged on an upper surface of base substrate to partially reflect the excitation light; and plural wells that are arranged on an upper surface side of reflecting film and have bottom surface portions. The excitation light is converged to be incident on base substrate. Distance from reflecting surface that is of a boundary between reflecting film and base substrate to bottom surface portion of well is less than or equal to a focal depth of the excitation light. Therefore, the sample accommodated in bottom surface portion of well can surely and efficiently be irradiated with the excitation light, and accurately be measured.

Abstract: A measurement plate 10 for MALDI mass spectrometry consists of a base plate 11 having an upper surface and a carbon sheet 12 laid on at least a portion of the upper surface. The carbon sheet 12 is a highly-oriented graphite sheet with the orientation direction being parallel to the upper surface. The highly-oriented graphite sheet has a high thermal conductivity in the in-plane direction and a low thermal conductivity in the perpendicular direction. Therefore, the thermal energy generated in a matrix substance by laser irradiation is quickly transferred through the highly-oriented graphite sheet in the in-plane direction. As a result, the thermal energy is uniformly distributed within the laser-irradiated area, so that the reaction of sublimation and ionization of the target sample assisted by the matrix substance uniformly takes place. Thus, a decrease in the detection sensitivity is prevented.

Abstract: A diagnosis kit is configured to detect whether or not an extraneous organism exists in a red blood cell by using a biological specimen containing the red blood cell, and a stain solution capable of staining nucleic acid. The kit includes at least one diagnosis plate. The diagnosis plate includes a first chamber configured to store the stain solution and to have the biological specimen injected into the stain solution, a channel connected to the first chamber, and a test plate connected to the channel. A second chamber is connected with the test plate. The channel is configured to extract the red blood cell. The second chamber can collect a part of the biological specimen and a part of the stain solution. This diagnosis kit can detect extraneous organisms in the red blood cells easily with a small amount of the biological specimen.

Abstract: A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Abstract: An electrostatic discharge protection component comprises a ceramic sintered body having ceramic substrate 12, varistor portion 10 formed thereon, and glass ceramic layer 14 formed further thereon, a pair of terminal electrodes 13a, 13b provided on the surface of this ceramic sintered body, a pair of external electrodes 16a, 16b, and heat conducting portion 15 penetrating through the ceramic sintered body vertically, and therefore by mounting the light-emitting diode on heat conducting portion 15 of this electrostatic discharge protection component, the size is reduced, and the heat generated from the component may be released efficiently.

Abstract: An electrostatic discharge protection component comprising a ceramic sintered body having ceramic substrate 12, varistor portion 10 formed thereon excluding some non-formed portion 18, and glass ceramic layer 14 further formed thereon, a pair of terminal electrodes 13a, 13b disposed by exposing a part thereof at non-formed portion 18 on ceramic substrate 12 of the ceramic sintered body, a pair of external electrodes 16a, 16b, and heat conducting portion 15 vertically penetrating ceramic substrate 12, a light-emitting diode or the like mounted on heat conducting portion 15 at non-formed portion 18, it is possible to reduce the size and to efficiently dissipate the heat generated by the component mounted.

Abstract: An electrostatic discharge protection component comprises a ceramic sintered body having ceramic substrate 12, varistor portion 10 formed thereon by avoiding a part of non-forming area 18, and glass ceramic layer 14 formed thereon, a par of terminal electrodes 13a, 13b provided on the surface of glass ceramic layer 14 of the ceramic sintered body, a pair of external electrodes 16a, 16b, and heat conducting portion 15 penetrating through ceramic substrate 12 vertically, and therefore by installing and mounting a light-emitting diode on heat conducting portion 15 in non-forming area 18 of the electrostatic discharge protection component, the size can be reduced, and the heat generated by the mounted component may be released efficiently.

Abstract: A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

Abstract: A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

Abstract: The present invention provides a circuit substrate which has a substrate including a first surface and a second surface opposite to the first surface. A first and a second conductor patterns are formed on the first and the second surface respectively. The second surface has larger surface roughness than the first surface. When the circuit substrate is mounted on another substrate, it is mounted to the other substrate via the second surface. The circuit substrate is capable of mounting a device or being mounted on another substrate to form an apparatus.

Abstract: An LED assembly including a wiring substrate with an opening at its center; a heat sink housed inside the opening; an LED chip mounted on the heat sink; a connecting section for electrically coupling the LED chip and wiring substrate; and a transparent resin covering the LED chip and connecting section. Heat generated from the LED chip is efficiently dissipated, and high productivity is also achievable.

Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

Abstract: A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

Abstract: A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

Abstract: A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

Abstract: A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

Abstract: A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

Abstract: A circuit component built-in module is provided in which a solder that is remelted when the circuit component built-in module is mounted on a motherboard by using the solder is prevented from flowing to the outside of the prescribed electrodes. A first groove (116) is formed in a solder resist (106) located between two electrodes (103) to which a circuit component (104) is connected. A configuration is used in which the space between the first groove (116) and circuit component (104) is filled with a first insulating resin (107).

Abstract: A multilayer ceramic substrate has a first conductive pattern that is transfer-printed on a ceramic substrate using an intaglio plate made of a flexible resin. The intaglio plate has a plurality of grooves with different depts. A first insulation layer is on the first conductive pattern, and a second conductive pattern is on the insulating layer. The two conductive patterns are coupled by a via.