Abstract: A probe card is for testing a wafer which allows for stable contact with electrode pads of a wafer simultaneously under small contact pressure in wafer test procedures. A probe card includes a frame plate which is provided with a plurality of through-holes corresponding to semiconductor chips of a wafer, a wiring substrate, an anisotropic conductive membrane which has a size corresponding to that of the through-hole and is fixed in the through-hole or on a periphery of the through-hole in the frame plate, and a contact membrane which also has a size corresponding to that of the through-hole and is fixed on the periphery of the through-hole in the frame plate. The contact membrane includes an insulating membrane, a conductive electrode provided in the insulating membrane and on a reverse face of the insulating membrane, and a bump. The bump is formed by plating an upper end of an electrode body which is exposed by half-etching the insulating membrane.

Abstract: A probe card is for testing a wafer which allows for stable contact with electrode pads of a wafer simultaneously under small contact pressure in wafer test procedures. A probe card includes a frame plate which is provided with a plurality of through-holes corresponding to semiconductor chips of a wafer, a wiring substrate, an anisotropic conductive membrane which has a size corresponding to that of the through-hole and is fixed in the through-hole or on a periphery of the through-hole in the frame plate, and a contact membrane which also has a size corresponding to that of the through-hole and is fixed on the periphery of the through-hole in the frame plate. The contact membrane includes an insulating membrane, a conductive electrode provided in the insulating membrane and on a reverse face of the insulating membrane, and a bump. The bump is formed by plating an upper end of an electrode body which is exposed by half-etching the insulating membrane.

Abstract: A probe card is used for a burn-in screening or inspection applied to a semiconductor wafer. The probe includes a pressure substrate. An elastic member is disposed on the pressure substrate. A wiring substrate is disposed on the elastic member. A spacer is disposed on the pressure substrate and spaced radially outward from a periphery of the wiring substrate. A plurality of bumps are formed on a membrane disposed on the wiring substrate, with electric connection between the bumps and a wiring of the wiring substrate. A ceramic ring is disposed on the spacer for tightly holding a periphery of the membrane.

Abstract: A probe card is used in testing an electric characteristic of plural semiconductor chips formed on a semiconductor wafer in a batch at a wafer level through application of a voltage to electrodes of the semiconductor chips. The probe card includes a card body, plural probe terminals, a wiring and a control element. The plural probe terminals are disposed on one surface of the card body in positions corresponding to the electrodes of the semiconductor chips. The wiring is disposed on the other surface of the card body and electrically connected with the probe terminals. The control element is disposed on the latter surface of the card body between the wiring and the probe terminals and controls input/output of the semiconductor chips.

Abstract: A probe card is used for a burn-in screening or inspection applied to a semiconductor wafer. The probe includes a pressure substrate. An elastic member is disposed on the pressure substrate. A wiring substrate is disposed on the elastic member. A spacer is disposed on the pressure substrate and spaced radially outward from a periphery of the wiring substrate. A plurality of bumps are formed on a membrane disposed on the wiring substrate, with electric connection between the bumps and a wiring of the wiring substrate. A ceramic ring is disposed on the spacer for tightly holding a periphery of the membrane.

Abstract: A graphic display control method and apparatus wherein illumination of pixels on a display screen of an interlace type CRT in a first field and a second field is controlled so that each point on a line is displayed on the display screen of the interlace type CRT by a combined illumination of a pixel in the first field and the second field or a combined illumination of one of two vertically adjacent pixels in the first field or the second field and the second pixel in the second field or the first field. The smooth line is displayed by a series of points.