Patents by Inventor Masaaki Kusui

Masaaki Kusui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
    Patent number: 6441316
    Abstract: A printed-circuit board of the present invention, comprises a circuit substrate 1; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1; a plurality of lands 2, each land 2 connected to at least one of said patterned wires 3 through an end portion 3a thereof; and a protection layer 6 with a plurality of openings 7, covering the surface of said circuit substrate 1, wherein said land 2 and said end portion 3a connected thereto are exposed in the associated opening 7 of said protection layer 6.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: August 27, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masaaki Kusui
  • Printed-Circuit board and a semiconductor module, and a manufacturing process of the semiconductor module
    Publication number: 20020053466
    Abstract: A printed-circuit board of the present invention, comprises a circuit substrate 1; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1; a plurality of lands 2, each land 2 connected to at least one of said patterned wires 3 through an end portion 3a thereof; and a protection layer 6 with a plurality of openings 7, covering the surface of said circuit substrate 1, wherein said land 2 and said end portion 3a connected thereto are exposed in the associated opening 7 of said protection layer 6.
    Type: Application
    Filed: February 16, 2000
    Publication date: May 9, 2002
    Inventor: Masaaki Kusui
  • Semiconductor module
    Patent number: 6381137
    Abstract: The present invention is to provide a semiconductor module, which can effectively dissipate heat generated by the semiconductor components disposed on the circuit board, with a simple structure to manufacture inexpensively.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: April 30, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Nobuhiro Kato, Takao Nakajima, Masaaki Kusui
  • IC card and method of manufacturing the same
    Patent number: 5335145
    Abstract: An IC card exhibiting improved electrical insulation, heat radiation capability, and radiation noise resistance includes circuit boards stacked in two layers and spaced apart from each other and surface panels of the IC card while maintaining satisfactory mechanical strength in the card. Board supporting portions extending in a frame portion of a main frame and sub-frames disposed on the board supporting portions hold the circuit boards, maintain a predetermined interval between the two circuit boards and between each circuit board and the surface panels, and provide the desired mechanical strength for the card.
    Type: Grant
    Filed: June 11, 1993
    Date of Patent: August 2, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masaaki Kusui