Patents by Inventor Masaaki Ooga

Masaaki Ooga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7087126
    Abstract: A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: August 8, 2006
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shinichi Sugimoto, Katsunori Nagata, Masaaki Ooga, Toshihiko Nakagawa
  • Patent number: 6722411
    Abstract: A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: April 20, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shinichi Sugimoto, Katsunori Nagata, Masaaki Ooga, Toshihiko Nakagawa
  • Publication number: 20040050475
    Abstract: A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.
    Type: Application
    Filed: August 18, 2003
    Publication date: March 18, 2004
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Shinichi Sugimoto, Katsunori Nagata, Masaaki Ooga, Toshihiko Nakagawa
  • Publication number: 20010051840
    Abstract: A mounting apparatus includes: a heater head for bonding a liquid crystal display and a flexible printed circuit board by thermocompression; a cylinder as a heater head driving means for driving heater head to compress the liquid crystal display and flexible printed circuit board by a prescribed load; and a control mechanism as a stretch amount controlling means for adjusting a load change per unit of time after the heater head starts compressing the flexible printed circuit board by the cylinder as well as a time at which a required load is attained to control the stretch amount of the flexible printed circuit board by thermocompression. Preferably, the mounting apparatus is provided with a mechanism which performs measurement after preliminary bonding and which performs regular bonding while controlling based on the obtained information.
    Type: Application
    Filed: May 29, 2001
    Publication date: December 13, 2001
    Inventors: Shinichi Sugimoto, Katsunori Nagata, Masaaki Ooga, Toshihiko Nakagawa
  • Patent number: 5768105
    Abstract: A flexible wiring board is adapted to be connected with a circuit board by means of an anisotropic conductive film. A flexible substrate of the flexible wiring board is mounted with an integrated circuit and has a generally rectangular connection portion. The connection portion includes a first edge of the substrate and parts of second and third edges adjoining the first edge of the substrate. A plurality of connection terminals are provided in the connection portion of the substrate. These connection terminals extend perpendicular to and arranged along the first edge of the substrate. Opposite end parts including the parts of the second and third edges of the connection portion do not extend beyond the connection terminals located closest to the second and third edges, respectively.
    Type: Grant
    Filed: May 7, 1996
    Date of Patent: June 16, 1998
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Keiji Aota, Masaaki Ooga, Yasunobu Tagusa
  • Patent number: 5546279
    Abstract: A flexible wiring board is adapted to be connected with a circuit board by means of an anisotropic conductive film. A flexible substrate of the flexible wiring board is mounted with an integrated circuit and has a generally rectangular connection portion. The connection portion includes a first edge of the substrate and parts of second and third edges adjoining the first edge of the substrate. A plurality of connection terminals are provided in the connection portion of the substrate. These connection terminals extend perpendicular to and arranged along the first edge of the substrate. Opposite end parts including the parts of the second and third edges of the connection portion do not extend beyond the connection terminals located closest to the second and third edges, respectively.
    Type: Grant
    Filed: November 10, 1994
    Date of Patent: August 13, 1996
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Keiji Aota, Masaaki Ooga, Yasunobu Tagusa