Patents by Inventor Masaharu Ito

Masaharu Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163977
    Abstract: A wiring sheet for three-dimensional molding includes a pseudo-sheet structure including a plurality of conductive linear bodies arranged at an interval; a first embedding layer; and a second embedding layer, the pseudo-sheet structure being sandwiched between the first embedding layer and the second embedding layer. The conductive linear bodies have a wave shape when viewed from above. A storage shear modulus at 23° C. of each of the first embedding layer and the second embedding layer is from 1×104 to 3×106 Pa. When a thickness of the first embedding layer is T1, a thickness of the second embedding layer is T2, and a thickness of the pseudo-sheet structure is T3, a specific relational equation is satisfied.
    Type: Application
    Filed: March 4, 2022
    Publication date: May 16, 2024
    Applicant: LINTEC Corporation
    Inventors: Tatsuki HASEGAWA, Masaharu ITO, Takashi MORIOKA
  • Publication number: 20240153663
    Abstract: A radionuclide production system is a system for producing a radionuclide by irradiating a liquid containing a raw material nuclide with bremsstrahlung radiation, the radionuclide production system including: a circulation path configured to allow a liquid containing a raw material nuclide to circulate; and a radiation generation unit configured to generate bremsstrahlung radiation to irradiate the liquid. A metal member containing a pure metal of a platinum group or an alloy of the platinum group is provided at an upper portion in the circulation path. In a radionuclide production method, the raw material nuclide contained in the liquid is transformed to the radionuclide by irradiating the liquid with the bremsstrahlung radiation while circulating the liquid containing the raw material nuclide in the circulation path, and oxygen and hydrogen generated due to radiolysis of the liquid are removed by a recombination reaction with a metal member formed of the pure metal.
    Type: Application
    Filed: March 17, 2022
    Publication date: May 9, 2024
    Inventors: Takahiro TADOKORO, Yuichiro UENO, Yuuko KANI, Kento NISHIDA, Takahiro WATANABE, Takahiro SASAKI, Masaharu ITO
  • Patent number: 11940564
    Abstract: A laser radar device includes: a light source for outputting laser light; a scanner for causing the laser light to scan; a first optical system for receiving the laser light caused to scan by the scanner and incident on the first optical system and emitting the incident laser light in such a manner that a horizontal component of the incident laser light is different from a horizontal component of the laser light to be emitted; and a second optical system for receiving the laser light caused to scan by the scanner and incident on the second optical system and emitting the incident laser light in such a manner that an incident area of the incident laser light in the horizontal direction is the same as an incident area of the first optical system in the horizontal direction, and an emission area of the incident laser light is different from an emission area of the first optical system.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: March 26, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yusuke Ito, Takayuki Yanagisawa, Hiroshi Aruga, Masaharu Imaki, Wataru Yoshiki, Shumpei Kameyama
  • Publication number: 20240023205
    Abstract: A wiring sheet includes a pair of electrodes and a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals, in which the pseudo sheet structure is electrically connected to the electrodes, and the conductive linear bodies and the electrodes are fixed with contact fixing members.
    Type: Application
    Filed: March 31, 2021
    Publication date: January 18, 2024
    Inventors: Takashi MORIOKA, Yuma KATSUTA, Masaharu ITO
  • Publication number: 20230298962
    Abstract: A power module (10) includes a power semiconductor chip (1) and a Cu circuit (3) having the power semiconductor chip (1) provided on one surface. The power module (10) includes: a sintering layer (2) joining the power semiconductor chip (1) and the Cu circuit (3) by using a sintering paste; and a heat dissipation sheet (4) provided for joining a Cu base plate (5) to the other surface of the Cu circuit (3), in which in a first laminated structure in which the power semiconductor chip (1), the sintering layer (2), the Cu circuit (3), and the heat dissipation sheet (4) are laminated, the total thermal resistance XA in the direction of lamination is equal to or less than 0.30 (K/W).
    Type: Application
    Filed: July 2, 2021
    Publication date: September 21, 2023
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Takahiro HARADA, Wataru KOSAKA, Shinya YAMAMOTO, Atsunori NISHIKAWA, Masaharu ITO
  • Publication number: 20230249434
    Abstract: A sheet includes a pseudo-sheet structure including a plurality of linear-bodies with a volume resistivity R of from 1.0 × 10-7 ?cm to 1.0 × 10-1 extending in one direction, aligned parallel to one another, and spaced apart from one another, satisfies the relation: L/D ? 3, wherein D represents the diameter of the linear-bodies, and L represents the spacing between adjacent ones of the linear-bodies, and also satisfies the relation: (D2/R) × (?L) ? 0.003, wherein D represents the diameter of the linear-bodies, L represents the spacing between adjacent ones of the linear-bodies, R represents the volume resistivity of the linear-bodies, and D and L are in units of cm. A heating element and a heating device each include the sheet.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 10, 2023
    Inventors: Masaharu ITO, Kanzan INOUE
  • Patent number: 11654651
    Abstract: A sheet includes a pseudo-sheet structure including a plurality of linear-bodies with a volume resistivity R of from 1.0×10?7 ?cm to 1.0×10?1 extending in one direction, aligned parallel to one another, and spaced apart from one another, satisfies the relation: L/D?3, wherein D represents the diameter of the linear-bodies, and L represents the spacing between adjacent ones of the linear-bodies, and also satisfies the relation: (D2/R)×(1/L)?0.003, wherein D represents the diameter of the linear-bodies, L represents the spacing between adjacent ones of the linear-bodies, R represents the volume resistivity of the linear-bodies, and D and L are in units of cm. A heating element and a heating device each include the sheet.
    Type: Grant
    Filed: November 17, 2016
    Date of Patent: May 23, 2023
    Assignees: LINTEC CORPORATION, LINTEC OF AMERICA, INC.
    Inventors: Masaharu Ito, Kanzan Inoue
  • Patent number: 11658375
    Abstract: An electromagnetic bandgap structure includes a plurality of resonators. Each of the resonators includes a dielectric substrate, a patch conductor formed on an upper surface of the dielectric substrate, and a conductor layer formed on a lower surface of the dielectric substrate. The patch conductor and the conductor layer are electrically connected to each other by via holes penetrating the dielectric substrate. A plurality of long holes and are formed on the lower surface of the dielectric substrate. A long hole conductor layer is formed on an inner wall surface of the long holes and. The conductor layer and the long hole conductor layer are electrically connected to each other to thereby form an integral conductor surface. The via holes are electrically connected to the conductor surface in the long holes and.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: May 23, 2023
    Assignee: NEC CORPORATION
    Inventor: Masaharu Ito
  • Publication number: 20230139564
    Abstract: A pseudo sheet structure is usable for a sensor configured to emit an electromagnetic wave in a band ranging from 20 GHz to 100 GHz. The pseudo sheet structure includes a plurality of conductive linear bodies arranged at an interval L satisfying a formula (1) below, 0.034×?S?L?20 mm (1). In the formula (1), L is the interval between the plurality of conductive linear bodies, ?S is a wavelength of the electromagnetic wave emitted by the sensor, and a unit for each of L and ?S is mm.
    Type: Application
    Filed: March 3, 2021
    Publication date: May 4, 2023
    Inventors: Masaharu ITO, Takashi MORIOKA, Taiga MATSUSHITA, Yuma KATSUTA
  • Publication number: 20230115263
    Abstract: A sheet-shaped heat generator includes a pseudo sheet structure including a plurality of metal wires arranged at an interval, the metal wires each including a core including a first metal and a metal film provided on an exterior of the core, the metal film including a second metal different from the first metal, in which a volume resistivity of the first metal is in a range from 1.0×10?5 [?·cm] to 5.0×10?4 [?·cm], and a standard electrode potential of the second metal is +0.34 V or more.
    Type: Application
    Filed: February 25, 2021
    Publication date: April 13, 2023
    Inventors: Masaharu ITO, Takashi MORIOKA
  • Patent number: 11535003
    Abstract: The present disclosure provides an electrically conductive sheet for use in three-dimensional molding including: a pseudo-sheet structure in which plural electrically conductive linear bodies extending unidirectionally are arranged spaced apart from each other; and a resin protective layer provided on a surface of the pseudo-sheet structure. In the above mentioned electrically conductive sheet, each of the electrically conductive linear bodies in the pseudo-sheet structure includes: a first portion formed in a wave pattern having a wavelength ?1 and an amplitude A1; and a second portion formed in a wave pattern having a wavelength ?2 and an amplitude A2, at least one of which is different from the wavelength ?1 or the amplitude A1 of the first portion.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: December 27, 2022
    Assignees: LINTEC OF AMERICA, INC., LINTEC CORPORATION
    Inventors: Masaharu Ito, Kanzan Inoue
  • Patent number: 11479020
    Abstract: A carbon nanotube sheet structure includes: a carbon nanotube sheet; a first base material including a first base material surface facing the carbon nanotube sheet; and a first spacer providing a gap between the carbon nanotube sheet and the first base material. A first base material surface of the first base material includes a first region on which the first spacer is provided and a second region on which the first spacer is not provided. The first base material is spaced apart from the carbon nanotube sheet at the second region on the first base material surface.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: October 25, 2022
    Assignees: LINTEC CORPORATION, LINTEC OF AMERICA, INC.
    Inventors: Akio Kabuto, Masaharu Ito, Kanzan Inoue
  • Publication number: 20220322496
    Abstract: A thermal radiation heater includes: a heater element layer including a planar conductive body; at least one front surface side layer including an outermost layer and provided close to a front surface of the heater element layer; and at least one back surface side layer including an outermost layer and provided close to a back surface of the heater element layer. The outermost layer close to the front surface has an emissivity of 0.7 or more, and the outermost layer close to the back surface has an emissivity of 0.6 or less.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 6, 2022
    Inventors: Masaharu ITO, Takashi MORIOKA
  • Publication number: 20220242099
    Abstract: A manufacturing method of a sheet-shaped conductive member includes: providing a pseudo sheet structure to a first film, the pseudo sheet structure including a plurality of conductive linear bodies arranged at an interval therebetween, the first film including a process film and a first resin layer; attaching a second film including a second resin layer to the first film with the second resin layer in contact with the pseudo sheet structure; and drying or curing at least one of the first resin layer or the second resin layer.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 4, 2022
    Inventors: Takashi MORIOKA, Masaharu ITO
  • Patent number: 11404759
    Abstract: A connection structure includes a dielectric waveguide line and a rectangular waveguide. The dielectric waveguide line transmits a high-frequency signal in a transmission region surrounded by a first conductor layer, a second conductor layer, and two arrays of via hole groups. A coupling window is formed in the second conductor layer. The rectangular waveguide is disposed in such a way that an open end surface of the rectangular waveguide faces the coupling window, and that the transmission direction of the dielectric waveguide line becomes orthogonal to the transmission direction of the rectangular waveguide. A plurality of recesses are formed on a first substrate surface in the vicinity of the coupling window. A recessed conductor layer electrically connected to the first conductor layer is formed on inner wall surfaces of the plurality of recesses.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: August 2, 2022
    Assignee: NEC CORPORATION
    Inventor: Masaharu Ito
  • Patent number: 11405985
    Abstract: The present disclosure provides a heat-generating sheet for use in three-dimensional molding including: a pseudo-sheet structure in which plural electrically conductive linear bodies extending unidirectionally are arranged spaced apart from each other, each of the electrically conductive linear bodies having a diameter of from 7 ?m to 75 ?m; and a resin protective layer provided at a side of one surface of the pseudo-sheet structure. In this heat-generating sheet for use in three-dimensional molding, the total thickness of layers provided at the side of the pseudo-sheet structure at which the resin protective layer is provided is from 1.5 times to 80 times the diameter of the electrically conductive linear bodies. The present disclosure also provides a surface heat-generating article in which the heat-generating sheet for use in three-dimensional molding is used.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: August 2, 2022
    Assignees: LINTEC OF AMERICA, INC., LINTEC CORPORATION
    Inventors: Masaharu Ito, Kanzan Inoue
  • Publication number: 20220183113
    Abstract: A sheet-shaped conductive member includes: a base material; a resin layer; and a pseudo sheet structure in which a plurality of conductive linear bodies are arranged at an interval, wherein each of the conductive linear bodies has a wavy shape in a plan view of the sheet-shaped conductive member, and in a direction orthogonal to an axial direction of the conductive linear bodies, any adjacent ones of the conductive linear bodies differ from each other in at least one of a wavelength, amplitude, phase or thickness.
    Type: Application
    Filed: February 20, 2020
    Publication date: June 9, 2022
    Inventors: Takashi MORIOKA, Masaharu ITO
  • Publication number: 20220166121
    Abstract: An electromagnetic bandgap structure includes a plurality of resonators. Each of the resonators includes a dielectric substrate, a patch conductor formed on an upper surface of the dielectric substrate, and a conductor layer formed on a lower surface of the dielectric substrate. The patch conductor and the conductor layer are electrically connected to each other by via holes penetrating the dielectric substrate. A plurality of long holes and are formed on the lower surface of the dielectric substrate. A long hole conductor layer is formed on an inner wall surface of the long holes and. The conductor layer and the long hole conductor layer are electrically connected to each other to thereby form an integral conductor surface. The via holes are electrically connected to the conductor surface in the long holes and.
    Type: Application
    Filed: December 13, 2019
    Publication date: May 26, 2022
    Applicant: NEC Corporation
    Inventor: Masaharu ITO
  • Patent number: 11300219
    Abstract: A variable-capacity compressor control valve is configured for easily regulating the opening degree of an in-valve release passage, and thus can effectively reduce internal circulation of refrigerant within the compressor and effectively improve the operation efficiency of the compressor. An in-valve large-opening release passage with a relatively large opening degree, which is used during the compressor actuation time, and an in-valve small-opening release passage with a relatively small opening degree, which is used during both the compressor actuation time and the normal control time (i.e., Pd?Pc control time), are formed using different passages.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 12, 2022
    Assignees: MAHLE International GmbH, Fujikoki Corporation
    Inventors: Masaharu Ito, Yoshiyuki Kume, Matthew R. Warren, Ernesto Jose Gutierrez
  • Publication number: 20220034414
    Abstract: A variable-capacity compressor control valve is configured for easily regulating the opening degree of an in-valve release passage, and thus can effectively reduce internal circulation of refrigerant within the compressor and effectively improve the operation efficiency of the compressor. An in-valve large-opening release passage with a relatively large opening degree, which is used during the compressor actuation time, and an in-valve small-opening release passage with a relatively small opening degree, which is used during both the compressor actuation time and the normal control time (i.e., Pd?Pc control time), are formed using different passages.
    Type: Application
    Filed: July 28, 2020
    Publication date: February 3, 2022
    Inventors: Masaharu Ito, Yoshiyuki Kume, Matthew R. Warren, Ernesto Jose Gutierrez