Patents by Inventor Masaharu Toyama

Masaharu Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sheet manufacturing method and sheet manufacturing die
    Publication number: 20020036362
    Abstract: An object of the present invention to provide a sheet manufacturing method and a sheet manufacturing die, in which a process of extruding a molten material from the die and winding it around a cooling roller can be performed at a high speed such as 60 m/min or more, and with which a sheet having a uniform thickness and a smooth surface can be obtained. In order to effectively charge the sheet with static electricity, the distance between paths of product portion and end portions of the sheet from a die to a cooling roller is reduced by adjusting the temperature of the sheet at the end portions thereof. The die is constructed such that the sheet is not influenced by deformation of a slit formed in the die, which is caused by heat expansion of the die and adjustment operations.
    Type: Application
    Filed: September 17, 2001
    Publication date: March 28, 2002
    Inventors: Nobutsugu Chigira, Fumiyasu Nomura, Hidetoshi Okashiro, Takao Sano, Masaharu Toyama
  • Method of producing thermoplastic resin films and apparatus for producing the same
    Patent number: 6221301
    Abstract: Method and apparatus for producing thermoplastic resin film which allows a biaxially oriented polyester film to be formed at a high speed of 400 m/min or more. In the method, a molten thermoplastic resin film is brought into contact with a cooling medium, to be cooled and solidified, for producing a cast film. The method is characterized by keeping the surface temperature of the cooling medium in the region immediately before the melt reaching position at not lower than the glass transition temperature and not higher than the melting point of the thermoplastic resin. The apparatus is characterized by a cooling medium having a heater and a cooler to ensure that the surface temperature of the cooling medium in the region immediately before the melt reaching position is kept at the requisite temperature, and by a surface temperature of the cooling drum in the region immediately before the film leaving position being maintained lower than the glass transition temperature of the thermoplastic resin.
    Type: Grant
    Filed: March 9, 1999
    Date of Patent: April 24, 2001
    Assignee: Toray Industries, Inc.
    Inventors: Kenji Tsunashima, Masaharu Toyama, Katsutoshi Miyakawa, Shunichi Osada, Nobutsugu Chigira, Hiroshi Yoshimura
  • Method of manufacturing a stacked semiconductor device
    Patent number: 4569700
    Abstract: The invention provides a stacked semiconductor device having a plurality of monocrystalline semiconductor films of the same material which are formed on a monocrystalline semiconductor substrate and between which insulating films are sandwiched wherein the semiconductor device comprises at least one connecting region, and wherein the semiconductor substrate and the semiconductor films are vertically connected at the one connecting region.
    Type: Grant
    Filed: July 1, 1985
    Date of Patent: February 11, 1986
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventor: Masaharu Toyama
  • Apparatus for liquid-phase epitaxial growth
    Patent number: 4033291
    Abstract: An apparatus for liquid-phase epitaxial growth is characterized in that the greater part of that surface of a well, made of carbon, which contacts with a solution for liquid-phase epitaxial growth is covered with a fused quartz layer.
    Type: Grant
    Filed: July 10, 1975
    Date of Patent: July 5, 1977
    Assignee: Tokyo Shibaura Electric Co., Ltd.
    Inventors: Makoto Naito, Masaru Kawachi, Tetuo Sekiwa, Minoru Akatsuka, Akinobu Kasami, Masaharu Toyama