Abstract: Coating equipment, which is installed in a clean room where air flows in a vertical laminar flow, comprises coating apparatus, for applying a resist, having a spin chuck connected to a motor and used to hold a semiconductor wafer and a cup with an inlet port to draw in a vertical laminar flow from the clean room and enclosing the wafer held on the spin chuck, and a control apparatus to control the temperature and humidity of the vertical laminar flow supplied to the coating apparatus. A vertical laminar flow control in temperature and humidity by the control apparatus is always supplied to the wafer in the cup during the coating process of a semiconductor wafer.