Abstract: A semiconductor device equipped with an integrated circuit including a metal thin-film-resistor object is disclosed. The semiconductor device includes a lower layer side insulator film formed on a semiconductor substrate, a metal wiring pattern formed on the lower layer side insulator film, an underground insulator film having a silicon oxide-film that contains at least phosphor, or phosphor and boron in the uppermost layer formed on the lower layer side insulator film and the metal wiring pattern, and a connection hole formed in the underground insulator film on the metal wiring pattern. The metal thin-film-resistor object is formed covering the underground insulator film, and inside of the connection hole, and is electrically connected to the metal wiring pattern in the connection hole.

Abstract: A semiconductor device equipped with an integrated circuit including a metal thin-film-resistor object is disclosed. The semiconductor device includes a lower layer side insulator film formed on a semiconductor substrate, a metal wiring pattern formed on the lower layer side insulator film, an underground insulator film having a silicon oxide-film that contains at least phosphor, or phosphor and boron in the uppermost layer formed on the lower layer side insulator film and the metal wiring pattern, and a connection hole formed in the underground insulator film on the metal wiring pattern. The metal thin-film-resistor object is formed covering the underground insulator film, and inside of the connection hole, and is electrically connected to the metal wiring pattern in the connection hole.

Abstract: A semiconductor device includes a base insulation film formed on a semiconductor substrate via another layer, a metal thin-film resistance formed on the base insulation film, and a laser beam interruption film of a metal material interposed between the semiconductor substrate and the base insulation film.

Abstract: A cost data management system of the present invention has the following devices, so that it allows to easily obtain cost data on a designing component basis even though the production data is modified. That is, the design management computer 16 in the design data management system 10 is provided for managing design data of each designing component for a design subject. Also, the computer terminal 21 in the production management system 20 is provided for managing cost data of each manufacturing component in production data prepared on the basis of the design data. The external storage device 27 is provided for storing relationship-defining information that defines the relationship between a manufacturing component where a modification is made on its production data and a designing component in design data that corresponds to the manufacturing component.