Patents by Inventor MASAHIKO AKASAKA

MASAHIKO AKASAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component mounting method, component mounting system, and manufacturing method of component mounting board
    Patent number: 11140788
    Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 5, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tetsuya Tanaka, Masahiko Akasaka, Koji Sakurai, Toshihiko Nagaya
  • Component mounting method and method for manufacturing component-mounted board
    Patent number: 11013160
    Abstract: There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: May 18, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tetsuya Tanaka, Masahiko Akasaka, Koji Sakurai, Toshihiko Nagaya
  • COMPONENT MOUNTING METHOD, COMPONENT MOUNTING SYSTEM, AND MANUFACTURING METHOD OF COMPONENT MOUNTING BOARD
    Publication number: 20190254174
    Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 15, 2019
    Inventors: TETSUYA TANAKA, MASAHIKO AKASAKA, KOJI SAKURAI, TOSHIHIKO NAGAYA
  • COMPONENT MOUNTING METHOD AND METHOD FOR MANUFACTURING COMPONENT-MOUNTED BOARD
    Publication number: 20190090393
    Abstract: There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 21, 2019
    Inventors: TETSUYA TANAKA, MASAHIKO AKASAKA, KOJI SAKURAI, TOSHIHIKO NAGAYA