Patents by Inventor Masahiko Ando

Masahiko Ando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100116807
    Abstract: The present invention relates to a disassemblable structure including: a double-coated pressure-sensitive adhesive tape or a double-coated pressure sensitive adhesive sheet including a substrate and pressure-sensitive adhesive layers formed on both surfaces of the substrate, at least one of the pressure-sensitive adhesive layers being a thermal foaming agent-containing pressure-sensitive adhesive layer; a heating element which foams the thermal foaming agent-containing pressure-sensitive adhesive layer by heating; and a pair of adherends joined to each other through the pressure-sensitive adhesive tape or sheet and the heating element.
    Type: Application
    Filed: November 10, 2009
    Publication date: May 13, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Eiji YAMANAKA, Michirou KAWANISHI, Masahiko ANDO, Yasuyuki TOKUNAGA, Tooru NAKASHIMA
  • Publication number: 20100090220
    Abstract: The present invention aims at providing a high-performance semiconductor device such as display, IC tag, sensor or the like at a low cost by using an organic thin film transistor most members of which can be formed by printing, as a switching element. The present invention relates to a thin film transistor composed of members on a dielectric substrate, which are a gate electrode, a dielectric film, source/drain electrodes, and a semiconductor layer, wherein on said semiconductor layer there are formed at least two passivation films of a first passivation film capping said semiconductor layer to protect it and a second passivation film covering larger area than that of said first passivation film to protect all of said members.
    Type: Application
    Filed: December 15, 2009
    Publication date: April 15, 2010
    Applicant: HITACHI, LTD.
    Inventors: Masahiro KAWASAKI, Shuji Imazeki, Masahiko Ando, Yoshifumi Sekiguchi, Shoichi Hirota
  • Patent number: 7691925
    Abstract: An object of the present invention is to provide a pressure-sensitive adhesive composition in which electrification of a pressure-sensitive adhesive sheet can be prevented upon peeling, and staining property on an adherend can be reduced, and an antistatic pressure-sensitive sheet and surface protecting film using this. There is provided a pressure-sensitive composition comprising an ionic liquid and a polymer having a glass transition temperature Tg of 0° C. or lower as a base polymer.
    Type: Grant
    Filed: March 7, 2005
    Date of Patent: April 6, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Tatsumi Amano, Masahiko Ando, Kazuhito Okumura, Natsuki Kobayashi
  • Patent number: 7655947
    Abstract: The present invention provides a thin film transistor comprising a drain electrode and a source electrode separated by a channel region formed over a contact portion with an amorphous silicon layer and wherein an impurity from the channel region is removed and a remaining impurity is diffused into the contact portion to form a contact layer wherein the contact layer has a second resistance at least lower than the first resistance.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: February 2, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Masahiko Ando, Masahiro Kawasaki, Masatoshi Wakagi
  • Publication number: 20100003441
    Abstract: Disclosed is a release liner having a multilayer structure of at least three layers including two surface layers and an intermediate layer, in which one of the two surface layers contains a high-density polyethylene, the other contains a low-density polyethylene, and the intermediate layer contains a low-density polyethylene alone as its resin component. Also disclosed is a pressure-sensitive adhesive sheet including the release liner and at least one pressure-sensitive adhesive layer, in which a release force X (N/mm) between the release liner and the pressure-sensitive adhesive layer and a rigidity Y of the release liner [(Young's modulus of the release liner)×(thickness)3] (N·mm) satisfy the following conditions: 0<X?0.285 and 0<Y<180X4+0.1. The release liner and pressure-sensitive adhesive sheet excel in releasability and do not suffer from liner pop-off even when, for example, stored in a curved state. The release liner excels also in recyclability.
    Type: Application
    Filed: November 30, 2007
    Publication date: January 7, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akiko Nonaka, Shinji Inokuchi, Masahiko Ando
  • Publication number: 20090317635
    Abstract: An object of the present invention is to provide a pressure-sensitive adhesive composition which is excellent in antistatic property of a non-electrification-prevented adherend (subject to be protected) upon peeling, and has reduced stainability in an adherend and is excellent in adhesion reliance, and electrification preventing pressure-sensitive adhesive sheets using the same. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.1 to 100% by weight of a (meth)acrylic acid alkylene oxide. There is provided a pressure-sensitive composition comprising an ionic liquid, and a polymer containing, as a monomer component, 0.5 to 30% by weight of a nitrogen-containing monomer and having a glass transition temperature Tg of no higher than 0° C. There is provided a pressure-sensitive composition comprising an ionic liquid, and a (meth)acryl-based polymer containing, as a monomer component, 0.
    Type: Application
    Filed: August 26, 2009
    Publication date: December 24, 2009
    Inventors: Tatsumi Amano, Natsuki Kobayashi, Masahiko Ando
  • Patent number: 7635860
    Abstract: To increase productivity of organic thin-film transistors, in an organic thin-film transistor manufacturing equipment, a liquid containing at least either one of a wiring material and a semiconductor material is coated on a substrate to form a number of organic thin-film transistors. Substrate carrying means carry the substrate. The substrate is heated by a first heating means, and the temperature of the substrate is controlled by a controller. The liquid containing at least either one of the wiring material and the semiconductor material is heated by a second heating means, and the temperature of this liquid is controlled also by the controller.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: December 22, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Tomohiro Inoue, Akira Doi, Masahiko Ando
  • Patent number: 7622734
    Abstract: Disclosed are a method for inexpensively reducing the contact resistance between an electrode and an organic semiconductor upon a p-type operation of the organic semiconductor; and a method for inexpensively operating, as an n-type semiconductor, an organic semiconductor that is likely to work as a p-type semiconductor. In addition, also disclosed are a p-cannel FET, an n-channel FET, and a C-TFT which can be fabricated inexpensively. Specifically, a p-type region and an n-type region is inexpensively prepared on one substrate by arranging an organic semiconductor that is likely to work as a p-type semiconductor in a p-channel FET region and an n-channel FET region of a C-TFT; and arranging a self-assembled monolayer between an electrode and the organic semiconductor in the n-channel FET region, which self-assembled monolayer is capable of allowing the organic semiconductor to work as an n-type semiconductor.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: November 24, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Yuji Suwa, Tomihiro Hashizume, Masahiko Ando, Takeo Shiba
  • Patent number: 7608857
    Abstract: A TFT having a large mobility of carriers that are conducted through a channel as compared with a conventional organic TFT, and a method of manufacturing the TFT inexpensively and easily are provided. The channel is formed of a semiconductor organic molecular crystal thin film which is highly oriented, and a TFT that is large in the mobility of the carriers that are conducted through the channel, and a lyophilic TFT pattern that is surrounded by a lyophobic region on a substrate are formed, and the configuration of the pattern is featured, whereby a solution of the semiconductor organic molecules which is supplied to an appropriate region of a substrate surface including the channel is spontaneously dried in an anisotropic fashion, and highly oriented crystal is grown in the drying process.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: October 27, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Masaaki Fujimori, Tomihiro Hashizume, Masahiko Ando
  • Publication number: 20090258176
    Abstract: A first release liner of the present invention comprises a single- or multilayered film having a releasable layer in which the peel strength in application to an acrylic plate (23 DEG C.) is 0.02-0.5 N/20 mm. Also provided is a second release liner which comprises a single- or multilayered film having a releasable layer comprising an ethylene/vinyl acetate resin. The release liners each may be a multilayered film composed of a substrate and a releasable layer. When each of the release liners is used as a release liner in winding a pressure-sensitive adhesive tape on a bobbin, the tape winding operation is free from troubles that the release liner undesirably peels off, tape shifting occurs, and air inclusion occurs between tape layers. When the pressure-sensitive adhesive tape is used, the release liner can be easily peeled from the pressure-sensitive adhesive layer.
    Type: Application
    Filed: June 29, 2007
    Publication date: October 15, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shigeki Muta, Masahiko Ando
  • Patent number: 7585713
    Abstract: A disclosed technology is a method for exposing a photo-sensitive SAM film, wherein a self-assembled-monolayer (photo-sensitive SAM film) having photo-sensitivity, exhibiting hydrophobicity before exposure, and exhibiting hydrophilicity after exposure is formed on a substrate, exposure is performed to the substrate in a state in which a surface of the substrate on which the film has been formed is dipped in liquid or in a state in which a light-sensitive surface of the substrate faces downward to be in contact with liquid, exposure light is ultraviolet light, visible light, or light with an exposure-wavelength of 350 nm or more to 800 nm or less, and the liquid is at least one of organic solvent containing an aromatic group and organic solvent of alcohols, ethers, or ketones.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: September 8, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Tadashi Arai, Takeo Shiba, Masahiko Ando
  • Publication number: 20090163626
    Abstract: Disclosed is a pressure sensitive adhesive composition characterized by containing an ionic liquid and a polymer which contains, as a monomer unit, 0.1-10% by weight of a (meth)acrylate with a hydroxyalkyl group having 3-12 carbon atoms. The present invention provides a pressure sensitive adhesive composition which is excellent in antistatic property of a no-electrification-prevented adherend upon peeling, and has reduced staining of an adherend and is excellent in adhesion reliance. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition.
    Type: Application
    Filed: September 5, 2006
    Publication date: June 25, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Natsuki Ukei, Tatsumi Amano, Masahiko Ando
  • Publication number: 20090134386
    Abstract: An organic field-effect transistor has a gate insulating layer comprising a cured epoxy resin. The epoxy resin has a lower concentration of trapping centres compared with a conventional epoxy resin in which trapping centres are provided by hydroxyl (OH) groups. The lower concentration of trapping centres can be achieved by reducing the number of hydroxyl groups throughout the layer and/or by reducing the number of hydroxyl groups in a surface region.
    Type: Application
    Filed: August 21, 2008
    Publication date: May 28, 2009
    Inventors: Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Masahiko Ando, Takeo Shiba
  • Patent number: 7521716
    Abstract: Using a lower electrode as a photomask, a lyophobic region having generally the same pattern as that of the lower electrode and a lyophilic region having a pattern which is generally the inversion of the lower electrode pattern are formed on an insulating film. A conductive ink is applied to the lyophobic region and baked. Thus, an upper electrode having a pattern which is generally the inversion of the lower electrode pattern is formed in a self-alignment manner. Therefore no misalignment occurs even if a printing method is used. Thus, a semiconductor device such as an active-matrix thin-film transistor substrate can be fabricated by using a printing method.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: April 21, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Masahiko Ando, Masaya Adachi, Hiroshi Sasaki, Masatoshi Wakagi
  • Patent number: 7491758
    Abstract: The present invention provides a pressure-sensitive adhesive which can prevent electrification of a non-electrification-prevented adherend upon peeling, suppresses occurrence of peeling off even with time or via treatment under a high temperature, and is excellent in adhesion reliance, as well as an antistatic pressure-sensitive adhesive sheet, and surface protecting film using this. The pressure-sensitive adhesive composition of the present invention contains an ionic liquid, and a polymer having a glass transition temperature of Tg of 0° C. or lower as a base polymer, as well as an ethylene oxide group-containing compound and/or a surfactant.
    Type: Grant
    Filed: May 31, 2005
    Date of Patent: February 17, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Tatsumi Amano, Natsuki Kobayashi, Masahiko Ando, Kazuhito Okumura
  • Publication number: 20090029162
    Abstract: A pressure-sensitive adhesive composition characterized by comprising a water-dispersible (meth)acryl-based polymer containing, as a monomer component, 50 to 99.9% by weight of a (meth)acrylate having an alkyl group with a carbon number of 1 to 14, and an ionic liquid. There is provided a pressure-sensitive adhesive composition that attains static charge prevention at peeling between pressure sensitive adhesive layer and adherend not rendered antistatic, thereby reducing contamination of the adherend. Also, there are provided, making use of the same, an antistatic pressure sensitive adhesive sheet and surface protective film.
    Type: Application
    Filed: May 16, 2006
    Publication date: January 29, 2009
    Inventors: Natsuki Ukei, Tatsumi Amano, Masahiko Ando, Takeshi Sutou
  • Publication number: 20080311395
    Abstract: Disclosed is a pressure sensitive adhesive composition comprising a (meth)acrylic polymer comprising, as a monomer component, 0.1 to 4.9% by weight of a reactive monomer having an alkylene oxide group, wherein the reactive monomer has an average number of moles of an oxyalkylene unit added to the reactive monomer falls within the range from 3 to 40, and a pressure sensitive adhesive composition comprising an alkali metal salt. The present invention provides a pressure sensitive adhesive composition which is excellent in antistatic property of a no-electrification-prevented adherend upon peeling, and has reduced staining of an adherend and is excellent in adhesion reliance. Also disclosed is an antistatic pressure sensitive adhesive sheet or surface-protecting film prepared using the composition.
    Type: Application
    Filed: September 4, 2006
    Publication date: December 18, 2008
    Inventors: Natsuki Ukei, Tatsumi Amano, Masahiko Ando
  • Publication number: 20080294888
    Abstract: A deploy target computer is connected to a storage device including a replication source logical disk used to store a boot disk image. A disk mapping processing part in the deploy target computer changes over access destination so as to set the access destination to the replication source logical disk in the storage device when an I/O request is issued from the deploy target computer to the storage device and the I/O request specifies reading the boot disk image, and so as to set the access destination to a replication destination logical disk for conducting writing concerning the boot disk image when the I/O request specifies writing concerning the boot disk image.
    Type: Application
    Filed: February 1, 2008
    Publication date: November 27, 2008
    Inventors: Masahiko ANDO, Akira Kato, Sumio Goto
  • Publication number: 20080268582
    Abstract: A disclosed technology is a method for exposing a photo-sensitive SAM film, wherein a self-assembled-monolayer (photo-sensitive SAM film) having photo-sensitivity, exhibiting hydrophobicity before exposure, and exhibiting hydrophilicity after exposure is formed on a substrate, exposure is performed to the substrate in a state in which a surface of the substrate on which the film has been formed is dipped in liquid or in a state in which a light-sensitive surface of the substrate faces downward to be in contact with liquid, exposure light is ultraviolet light, visible light, or light with an exposure-wavelength of 350 nm or more to 800 nm or less, and the liquid is at least one of organic solvent containing an aromatic group and organic solvent of alcohols, ethers, or ketones.
    Type: Application
    Filed: February 15, 2008
    Publication date: October 30, 2008
    Inventors: Tadashi Arai, Takeo Shiba, Masahiko Ando
  • Patent number: 7407846
    Abstract: The present method prevents malfunctions in switching caused by a light leakage current in an active matrix type thin film transistor substrate for a liquid crystal display and prevents display failures, by selectively disposing a self assembled monolayer film in a gate electrode-projected region of the surface of an insulator film with high definition, and by selectively improving the orientation order of an organic semiconductor film only in the gate electrode-projected region without improving the order at an irradiated portion with light outside the gate electrode-projected region.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: August 5, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Masahiko Ando, Masatoshi Wakagi, Hiroshi Sasaki