Abstract: A hybrid thermoplastic-thermosettable resin composition may include a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic. A method of forming a hybrid thermoplastic-thermosettable resin composition may include reacting a thermoplastic to introduce a cross-linkable group to form the thermoplastic-thermosettable resin composition. A method of forming a hybrid thermoplastic-thermoset resin may include providing a hybrid thermoplastic-thermosettable resin composition comprising a polymeric backbone formed from a thermoplastic unit, and at least one crosslinkable group bonded to the thermoplastic; and curing the hybrid thermoplastic-thermosettable resin composition by an external stimulus to form the hybrid thermoplastic-thermoset resin.

Abstract: A crosslinkable thermoplastic resin composition may include a polymer formed from the reaction between a bis-benzoxazine monomer and a bifunctional comonomer having phenol, amine, and/or thiol functional groups, wherein the polymer contains at least one crosslinkable group. A method of forming a crosslinkable thermoplastic resin composition may include reacting a bis-benzoxazine monomer and a bifunctional comonomer to form a polymer containing at least one crosslinkable group. A method of forming a cured thermoplastic resin may include curing the crosslinkable thermoplastic resin composition by applying an external stimulus.

Abstract: An amide acid oligomer (AAO) solution, methods of making the same, powder, AAO solution prepregs, AAO dry prepreg, imide prepregs, and fiber reinforced polyimide composites with high temperature resistance and excellent mechanical properties are disclosed herein. In some embodiments, a method of making an AAO solution includes dissolving an aromatic diamine and an aromatic tetracarboxylic compound in a solvent to form a mixture, wherein the solvent has a boiling point of less than 150° C.; stirring the mixture at a temperature ranging from about 5° C. to about 60° C. for about I hour to about 24 hours to form a reaction solution; adding unsaturated acid anhydride to the reaction solution; and stirring the reaction solution at a temperature ranging from about 5° C. to about 60° C. for about 1 minute to about 180 minutes to form an amide acid oligomer solution, the amide acid oligomer solution having amide acid oligomer in the solvent.

Abstract: An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1, n?0, 1?m+n?20, and 0.05?m/(m+n)?1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1 and n?0, and an arrangement of repeating units may be either a block or random.

Abstract: A terminally modified imide oligomer is represented by a specific formula including a 2-phenyl-4,4?-diaminodiphenylether residue or a 4-phenoxy-1,3-diaminobenzene residue. A varnish is obtained by dissolving the terminally modified imide oligomer. A cured product is obtained by heat-curing the terminally modified imide oligomer, and a film including the cured product has a tensile elongation at break of 10% or more. An imide prepreg is obtained by impregnating fibers with the varnish and then drying the impregnated fibers. A fiber-reinforced composite material is obtained by layering and then heat-curing the imide prepreg.

Abstract: A terminally modified imide oligomer is represented by a specific formula including a 2-phenyl-4,4?-diaminodiphenylether residue or a 4-phenoxy-1,3-diaminobenzene residue. A varnish is obtained by dissolving the terminally modified imide oligomer. A cured product is obtained by heat-curing the terminally modified imide oligomer, and a film including the cured product has a tensile elongation at break of 10% or more. An imide prepreg is obtained by impregnating fibers with the varnish and then drying the impregnated fibers. A fiber-reinforced composite material is obtained by layering and then heat-curing the imide prepreg.

Abstract: An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1, n?0, 1?m+n?20, and 0.05?m/(m+n)?1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1 and n?0, and an arrangement of repeating units may be either a block or random.

Abstract: Provided is a varnish including 1 to 500 parts by weight of an aromatic tetracarboxylic acid diester (A) represented by General Formula (1), 1 to 450 parts by weight of 2-phenyl-4,4?-diaminodiphenyl ether (B), 1 to 100 parts by weight of a 4-(2-phenylethynyl)phthalic acid monoester (C) represented by General Formula (2), and 100 parts by weight of an organic solvent having a boiling point of 150° C. or less at 1 atmosphere or a mixture of two or more of the organic solvents (D). The components (A), (B), and (C) are dissolved in the varnish. (In the formula, R1 is an aromatic tetracarboxylic acid diester residue; R2 and R3 are the same or different and are an aliphatic organic group or an aromatic organic group.) (In the formula, R4 and R5 are a hydrogen atom, an aliphatic organic group, or an aromatic organic group).

Abstract: An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1, n?0, 1?m+n?20, and 0.05?m/(m+n)?1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1 and n?0, and an arrangement of repeating units may be either a block or random).

Abstract: Provided is a varnish including 1 to 500 parts by weight of an aromatic tetracarboxylic acid diester (A) represented by General Formula (1), 1 to 450 parts by weight of 2-phenyl-4,4?-diaminodiphenyl ether (B), 1 to 100 parts by weight of a 4-(2-phenylethynyl)phthalic acid monoester (C) represented by General Formula (2), and 100 parts by weight of an organic solvent having a boiling point of 150° C. or less at 1 atmosphere or a mixture of two or more of the organic solvents (D). The components (A), (B), and (C) are dissolved in the varnish. (In the formula, R1 is an aromatic tetracarboxylic acid diester residue; R2 and R3 are the same or different and are an aliphatic organic group or an aromatic organic group.) (In the formula, R4 and R5 are a hydrogen atom, an aliphatic organic group, or an aromatic organic group.

Abstract: An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either R1 or R2 shows a phenyl group and the other shows a hydrogen atom; R3 and R4 show a divalent residue of aromatic diamine; R5 and R6 show a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1, n?0, 1?m+n?20, and 0.05?m/(m+n)?1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), R1 and R2 show a divalent residue of aromatic diamine; R3 shows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m?1 and n?0, and an arrangement of repeating units may be either a block or random.

Abstract: A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R1 and R2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R1 and R2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, Ras are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.

Abstract: A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, R1 and R2 each represents a divalent aromatic diamine residue; R3 and R4 each represents a tetravalent aromatic tetracarboxylic acid residue; R5 and R6 each represents a hydrogen atom or a phenyl group, with R5 or R6 being a phenyl group; m and n satisfy the following relations: m?1, n?0, 1?m+n?20 and 0.

Abstract: A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, R1 and R2 are a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of R1 and R2 is the aromatic hydrocarbon group having 6 to 10 carbon atoms; R3 is an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, R3s are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.

Abstract: The invention provides a carbon fiber-reinforced composite material including reinforcing fibers which are continuous carbon fibers in the form of a unidirectional (UD) material, a woven fabric, or a knitted fabric, and a matrix resin including a modified polyolefin resin, thereby achieving better adhesion and mechanical strength. The matrix resin forms a polyphase structure having a sea-island structure which has an average island (independent phase) diameter of not greater than 0.5 ?m. The composite material includes as a matrix resin a modified polyolefin resin obtained by, for example, graft-modifying a polyolefin resin with a monomer that contains an ethylenic double bond and a polar group in the same molecule; and includes as reinforcing fibers continuous carbon fibers.

Abstract: A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, R1 and R2 each represents a divalent aromatic diamine residue; R3 and R4 each represents a tetravalent aromatic tetracarboxylic acid residue; R5 and R6 each represents a hydrogen atom or a phenyl group, with R5 or R6 being a phenyl group; m and n satisfy the following relations: m?1, n?0, 1?m+n?20 and 0.

Abstract: A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor derived from the inside to the outside of the frame body. The heat radiating plate has a metallic base body, a metallic body filling inside of the metallic base body, and a metal layer deposited on the metallic base body and the metallic body. The mounting area is formed on the metal layer so as to be located above the metallic body, both of the metallic body and the metal layer have higher thermal conductivity than the metallic body, and both of the frame body and the metallic base body have a smaller coefficient of thermal expansion than the metal layer.

Abstract: The invention provides a reaction apparatus capable of efficiently causing a reaction, and a fuel cell system and an electronic device that include such a reaction apparatus. A reaction apparatus (1) includes a reformer (4), a CO remover (5) and a connecting portion (6) that connects the reformer (4) and the remover (5). The reformer (4) has a reforming reaction chamber (31) and a reformer combustion chamber (30) that generates heat to be supplied to the reforming reaction chamber (31), which (30, 31) are adjacent to each other with a partition interposed therebetween. The CO remover (5) has a removing reaction chamber (35) and a remover combustion chamber (34) that generates heat to be supplied to the removing reaction chamber (35), which (34, 35) are adjacent to each other with a partition interposed therebetween.

Abstract: A package for receiving electronic part has a heat radiating plate having a mounting area where the electronic part is mounted at a center portion of one main surface, a frame body adhered to the one main surface to surround the mounting area, and a wiring conductor derived from the inside to the outside of the frame body. The heat radiating plate has a metallic base body, a metallic body filling inside of the metallic base body, and a metal layer deposited on the metallic base body and the metallic body. The mounting area is formed on the metal layer so as to be located above the metallic body, both of the metallic body and the metal layer have higher thermal conductivity than the metallic body, and both of the frame body and the metallic base body have a smaller coefficient of thermal expansion than the metal layer.

Abstract: A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.