Patents by Inventor Masahiko Ohnishi

Masahiko Ohnishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6809142
    Abstract: The invention relates to a pressure sensitive sealant composition for sealing a clearance between a lamp unit housing and a vehicle body panel of an automotive vehicle. The pressure sensitive sealant composition includes (a) 10-40 wt % of a component A that is at least one copolymer selected from the group consisting of hydrogenated styrene-butadiene copolymers, hydrogenated styrene-isoprene copolymers, and modified copolymers thereof; (b) a component B that is at least one tackifier selected from the group consisting of petroleum resins, terpene resins, rosin resins, coumarone-indene resins, hydrogenated resins thereof, and modified resins thereof, and (c) a component C that is a hydrocarbonic plasticizer. The pressure sensitive sealant composition is prepared by maxing together 100 parts by weight of the component A, 20-60 parts by weight of said component B, and 150-400 parts by weight of said component C.
    Type: Grant
    Filed: October 19, 1999
    Date of Patent: October 26, 2004
    Assignees: Nissan Motor Co., Ltd., Yokohama Rubber Co., Ltd.
    Inventors: Hidekazu Takeyama, Tomohiro Kawasaki, Masahiko Ohnishi, Minoru Matano, Akira Ozaki, Katsuyuki Arima
  • Patent number: 5686509
    Abstract: An adhesion-reinforcing composition for an epoxy resin adhesive which comprises a copolymer resin particle having been ion-crosslinked with a univalent or divalent metal cation, which particle is comprised of (i) a core ingredient composed of a polymer comprising diene monomer units and optional crosslinking monomer units and having a glass transition temperature not higher than -30.degree. C. and (ii) a shell ingredient composed of a copolymer having a glass transition temperature of at least 70.degree. C. and comprising acrylate or methacrylate monomer units and 0.01-20 wt. parts, per 100 wt. parts of the shell ingredient, of units of a radically polymerizable unsaturated carboxylic acid monomer having a carboxyl group and 3-8 carbon atoms; the core/shell weight ratio being 5/1-1/4. A composition comprising 100 wt. parts of an epoxy resin, 15-60 wt.
    Type: Grant
    Filed: November 22, 1995
    Date of Patent: November 11, 1997
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Akira Nakayama, Toshio Nagase, Tadashi Ashida, Masahiko Ohnishi
  • Patent number: 5290857
    Abstract: An epoxy resin adhesive composition has excellent adhesive properties such as impact resistance, tensile shear strength and T-peel strength as well as excellent semi-gelling property. An epoxy resin adhesive composition comprising ionic crosslinking in a polymer utilized as the impact resistance modifier has not only excellent semi-gelling property and mechanical properties of cured products but also excellent storage stability for a long time and it is advantageously utilized when the application occasionally requires storage or standing of the material for one month to one year at the room temperature. The epoxy resin adhesive composition comprises an epoxy resin, a powder core/shell polymer and a heat activation type hardener for epoxy resins. The powder core/shell polymer is composed of a core comprising an acrylate polymer or a methacrylate polymer having a glass transition temperature of -30.degree. C.
    Type: Grant
    Filed: September 3, 1992
    Date of Patent: March 1, 1994
    Assignees: Nippon Zeon Co., Ltd., Nissan Motor Co., Ltd.
    Inventors: Tadashi Ashida, Masahiko Ohnishi, Toshio Nagase, Akira Nakayama