Patents by Inventor Masahiko Oota

Masahiko Oota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9171244
    Abstract: Provided is an RFID tag, wherein a communication distance of several centimeter or more can be secured and the cost of which can be reduced in comparison to conventional on-chip antennas, even when being compact in size (square shaped with a side of 1.9 to 13 mm). The RFID tag (80) comprises an antenna (20), an IC chip (30) connected to the antenna (20), and a sealing material (10) that seals the IC chip (30) and the antenna (20). The antenna (20) is a coil antenna or a loop antenna, and the resonance frequency (f0) of an electric circuit constituted by the inductance (L) of the antenna (20) and the capacitance (C) of the IC chip (30) is equal to the operation frequency of the IC chip (30), or in the vicinity thereof.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: October 27, 2015
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Toshihiro Endou, Hironori Ishizaka, Masahiko Oota, Kouji Tasaki, Hiroyuki Hosoi, Jo Kakuta, Hiroaki Narita, Hiroki Sato
  • Publication number: 20150097521
    Abstract: Provided are an antenna sheet for a non-contact charging device and a charging device using the antenna sheet. The antenna sheet is configured to allow for a high degree of freedom in respect of arrangement of a transmitting side and a receiving side during power charging. The antenna sheet is an antenna sheet for a non-contact charging device, and is usable as a transmitting-side resonator for a transmitting-side device or a receiving-side resonator for a receiving-side device. The antenna sheet comprises: a substrate; and a coil-shaped antenna formed on the substrate, wherein the coil-shaped antenna is configured to function as a pickup coil operable to resonate at a resonant frequency f, when a resonance capacitor is set to have a capacitance C. The resonant frequency (f) is 13.56 MHz, the transmitting-side resonator comprises a resonance capacitor having a capacitance of 1 to 5 pF, and the receiving-side resonator comprises a resonance capacitor having a capacitance of 70 to 100 pF.
    Type: Application
    Filed: May 14, 2013
    Publication date: April 9, 2015
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Toshihiro Endou, Kazuhito Kobayashi, Masahiko Oota
  • Publication number: 20140339308
    Abstract: An RFID tag having a resin substrate, an IC chip positioned in the center section on the substrate, a single-layer antenna for forming an electric closed circuit by connecting with the IC chip and positioned in the peripheral section of the IC chip, and a sealing material for sealing the IC chip and the antenna, wherein the antenna is a coil antenna or a loop antenna, the resonant frequency (f0) of the antenna is the operating frequency of the IC chip or thereabouts, the operating frequency of the IC chip is 13.56 MHz-2.45 GHz, or 0.86-0.96 GHz, and the size of the RFID tag is 13 mm or less in length, 13 mm or less in width, and 1.0 mm or less in height; and an automatic recognition system using the same.
    Type: Application
    Filed: September 7, 2012
    Publication date: November 20, 2014
    Inventors: Toshihiro Endou, Hironori Ishizaka, Masahiko Oota, Kouji Tasaki, Hiroyuki Hosoi
  • Patent number: 8847841
    Abstract: Provided is a multi-beam antenna device capable of achieving two independent multi-beam characteristics using a single antenna unit, and enhanced gain. The multi-beam antenna device comprises a first antenna section, a second antenna section, a first Rotman lens section and a second Rotman lens section, which are laminated together in this order to form a planar antenna module. A first multi-beam characteristic is achieved by the first antenna section and the first Rotman lens section, and a second multi-beam characteristic is achieved by the second antenna section and the second Rotman lens section, independently.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: September 30, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Masahiko Oota, Taketo Nomura
  • Publication number: 20140224887
    Abstract: Provided is an RFID tag, wherein a communication distance of several centimeter or more can be secured and the cost of which can be reduced in comparison to conventional on-chip antennas, even when being compact in size (square shaped with a side of 1.9 to 13 mm). The RFID tag (80) comprises an antenna (20), an IC chip (30) connected to the antenna (20), and a sealing material (10) that seals the IC chip (30) and the antenna (20). The antenna (20) is a coil antenna or a loop antenna, and the resonance frequency (f0) of an electric circuit constituted by the inductance (L) of the antenna (20) and the capacitance (C) of the IC chip (30) is equal to the operation frequency of the IC chip (30), or in the vicinity thereof.
    Type: Application
    Filed: September 27, 2012
    Publication date: August 14, 2014
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Toshihiro Endou, Hironori Ishizaka, Masahiko Oota, Kouji Tasaki, Hiroyuki Hosoi, Jo Kakuta, Hiroaki Narita, Hiroki Sato
  • Patent number: 8698689
    Abstract: A multi-beam antenna suppressing an increase in loss of a Rotman lens to achieve enhanced gain. ?<?, where: ? is a spatial beam-forming angle of an array antenna viewed from the a front of the antenna; and ? is an angle between a center line of a Rotman lens, and a line segment connecting one of the input ports and an intersecting point S2 of the center line with a curve segment having a plurality of output ports A shape of the Rotman lens such that: ?=(?/?)(Ln/F)<1, and G is less than when ?=?, where: F is a distance between one input port and S2; 2 Ln is an aperture length of the array antenna; and G is a size of the Rotman lens, defined as a distance between S2 and an intersecting point of the center line with a curve segment having input ports.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: April 15, 2014
    Assignee: Hitachi Chemical, Ltd.
    Inventors: Masahiko Oota, Taketo Nomura
  • Patent number: 8643564
    Abstract: A triplate line inter-layer connector and a planar array antenna are provided. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line, a first patch pattern formed at a connection-side terminal end of a first feeder line, a first feed substrate having a first shield spacer disposed therebeneath, and a second shield spacer disposed thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics. A second feeder line is provided on a second feed substrate together with a second patch pattern, and a second ground conductor has a first slit formed in a portion thereof located approximately intermediate between the first and second patch patterns.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: February 4, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yuuichi Shimayama, Masahiko Oota, Takashi Saitou
  • Patent number: 8253511
    Abstract: A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64).
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: August 28, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Masahiko Oota, Hisayoshi Mizugaki, Keisuke Iijima, Takashi Saitou, Masaya Kirihara
  • Patent number: 8188805
    Abstract: A ground conductor (1) has a through hole provided through an area thereof for connection with a waveguide (6), with dimensions substantially equal to cavity dimensions of the waveguide (6), and a metallic spacer (7a) is provided as a holding element for a film substrate (4), with an even thickness to a dielectric substrate (2a), the metallic spacer (7a) having dimensions E1 and E2 of cavity walls thereof changed in accordance with a desirable frequency, and cooperating with another metallic spacer (7b) having substantially equal dimensions to the metallic spacer (7a), to sandwich the film substrate (4) in between, and in addition, an upper ground conductor (5) is arranged on the other metallic spacer (7b), and a quadrate resonant patch pattern (8) is formed at an end of the strip line conductor (3) formed to the film subs ate (4), on an area corresponding to a transducer end of the waveguide (6), while a combination of the quadrate resonant patch pattern (8) and the waveguide (6) is arranged such that the qu
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: May 29, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Taketo Nomura, Masahiko Oota, Hisayoshi Mizugaki, Yuichi Shimayama, Takashi Saitou, Masaya Kirihara, Keisuke Iijima
  • Patent number: 8163120
    Abstract: A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: April 24, 2012
    Assignee: Emulsion Technology Co., Ltd.
    Inventors: Koichiro Higasa, Yoshinori Ito, Masahiko Oota, Yoshinori Igarashi
  • Publication number: 20110285598
    Abstract: Provided is a multi-beam antenna device capable of achieving two independent multi-beam characteristics using a single antenna unit, and enhanced gain. The multi-beam antenna device comprises a first antenna section, a second antenna section, a first Rotman lens section and a second Rotman lens section, which are laminated together in this order to form a planar antenna module. A first multi-beam characteristic is achieved by the first antenna section and the first Rotman lens section, and a second multi-beam characteristic is achieved by the second antenna section and the second Rotman lens section, independently.
    Type: Application
    Filed: January 29, 2010
    Publication date: November 24, 2011
    Inventors: Masahiko Oota, Taketo Nomura
  • Publication number: 20110241968
    Abstract: Provided is a multi-beam antenna device capable of suppressing an increase in loss of a Rotman lens so as to achieve enhanced gain. ? with respect to ? is set to satisfy the following relation: ?<?, where: ? is a spatial beam-forming angle of an array antenna when viewed from a direction facing a front of the array antenna; and ? is an angle between a center line (8) of a Rotman lens, and a line segment which connects one of a plurality of input ports and an intersecting point S2 of the center line (8) with a curve segment having a plurality of output ports (31), (32), - - - , (3n) arranged thereon.
    Type: Application
    Filed: November 30, 2009
    Publication date: October 6, 2011
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masahiko Oota, Taketo Nomura
  • Publication number: 20110050534
    Abstract: Provided is a triplate line inter-layer connector having excellent loss suppression capability and allowing for inter-layer connection at any position, and a planar array antenna having uniform frequency characteristics in a beam direction. The triplate line inter-layer connector has an electrical connection structure between a first triplate line and a second triplate line. A first patch pattern is formed at a connection-side terminal end of a first feeder line. A first feed substrate has a first shield spacer disposed therebeneath, and a second shield spacer disposed just thereabove. Each of the first and second shield spacers has a hollow portion hollowed out to a size encompassing the first feeder line and the first patch pattern so as to define a corresponding one of first and second dielectrics in a respective one of the positions beneath and just above the first feed substrate.
    Type: Application
    Filed: August 26, 2010
    Publication date: March 3, 2011
    Inventors: Yuuichi Shimayama, Masahiko Oota, Takashi Saitou
  • Publication number: 20100085133
    Abstract: A ground conductor (1) has a through hole provided through an area thereof for connection with a waveguide (6), with dimensions substantially equal to cavity dimensions of the waveguide (6), and a metallic spacer (7a) is provided as a holding element for a film substrate (4), with an even thickness to a dielectric substrate (2a), the metallic spacer (7a) having dimensions E1 and E2 of cavity walls thereof changed in accordance with a desirable frequency, and cooperating with another metallic spacer (7b) having substantially equal dimensions to the metallic spacer (7a), to sandwich the film substrate (4) in between, and in addition, an upper ground conductor (5) is arranged on the other metallic spacer (7b), and a quadrate resonant patch pattern (8) is formed at an end of the strip line conductor (3) formed to the film subs ate (4), on an area corresponding to a transducer end of the waveguide (6), while a combination of the quadrate resonant patch pattern (8) and the waveguide (6) is arranged such that the qu
    Type: Application
    Filed: February 26, 2008
    Publication date: April 8, 2010
    Inventors: Taketo Nomura, Masahiko Oota, Hisayoshi Mizugaki, Yuichi Shimayama, Takashi Saitou, Masaya Kirihara, Keisuke Iijima
  • Publication number: 20080303721
    Abstract: The present invention provides inexpensively a planar antenna module that is able to realize a loss reduction, a reduction in characteristic variation caused by an assembling error, and an improved stability in frequency characteristics. A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64).
    Type: Application
    Filed: July 9, 2008
    Publication date: December 11, 2008
    Inventors: Masahiko OOTA, Hisayoshi MIZUGAKI, Keisuke IIJIMA, Takashi SAITOU, Masaya KIRIHARA
  • Patent number: 7411553
    Abstract: The present invention provides inexpensively a planar antenna module that is able to realize a loss reduction, a reduction in characteristic variation caused by an assembling error, and an improved stability in frequency characteristics. A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64).
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: August 12, 2008
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Masahiko Oota, Hisayoshi Mizugaki, Keisuke Iijima, Takashi Saitou, Masaya Kirihara
  • Publication number: 20080102268
    Abstract: A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.
    Type: Application
    Filed: January 26, 2006
    Publication date: May 1, 2008
    Inventors: Koichiro Higasa, Yoshinori Ito, Masahiko Oota, Yoshinori Igarashi
  • Publication number: 20070229380
    Abstract: The present invention provides inexpensively a planar antenna module that is able to realize a loss reduction, a reduction in characteristic variation caused by an assembling error, and an improved stability in frequency characteristics. A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64).
    Type: Application
    Filed: October 25, 2005
    Publication date: October 4, 2007
    Inventors: Masahiko Oota, Hisayoshi Mizugaki, Keisuke Iijima, Takashi Saitou, Masaya Kirihara
  • Publication number: 20070171127
    Abstract: A triplate-type planar array antenna is provided with an antenna circuit board (3) on which an antenna circuit including a plurality of radiating elements (5), which are vertically and horizontally arrayed in a two-dimensional manner, and feedlines (6) is formed; two pieces of dielectric substances (2a, 2b) between which the antenna circuit board (3) is sandwiched at the both sides; a ground conductor (1) laminated on one dielectric substance (2b); and a slot board (4) laminated on the other dielectric substance (2a). One or more slot openings (7) corresponding to the plurality of radiating elements (5) with a linear arrangement are formed on the slot board (4).
    Type: Application
    Filed: February 28, 2005
    Publication date: July 26, 2007
    Inventors: Hisayoshi Mizugaki, Masahiko Oota
  • Patent number: D656500
    Type: Grant
    Filed: March 23, 2011
    Date of Patent: March 27, 2012
    Assignee: Nintendo Co., Ltd.
    Inventors: Kazuhiro Maruyama, Masahiko Oota