Abstract: Provided are an imaging apparatus, an imaging method, and a program capable of accurately and simply controlling a movement sensitivity of an index displayed on a finder monitor to a sensitivity desired by a user by using a touch panel installed on a rear monitor. The imaging apparatus (10) has a finder that includes the finder monitor (13), the touch panel (31) that receives a swipe operation for moving the index, and an image processing unit (24). The image processing unit (24) includes a sensitivity setting unit that sets a first sensitivity for coarsely moving the index by the swipe operation or a second sensitivity for finely moving the index by detecting a contact operation to the touch panel in the swipe operation, and a movement control unit that moves the index on the basis of the swipe operation on the touch panel and the sensitivity set by the sensitivity setting unit.

Abstract: A semiconductor device includes a semiconductor chip, an insulating base film and first projecting electrodes. The first projecting electrodes are formed in a single row on one face of the semiconductor chip along the edge of the semiconductor chip. This face of the semiconductor chip faces a semiconductor chip mounting face of the base film. The semiconductor device also includes second projecting electrodes formed in a single row outside the row of first projecting electrodes. The height of the second projecting electrodes is smaller than the first projecting electrodes. The semiconductor device also includes first inner leads formed on the semiconductor chip mounting face of the base film. The first inner lead extend to the first projecting electrodes. The semiconductor device also includes an insulating film formed between the first inner leads and the semiconductor chip. The semiconductor device also includes second inner leads formed on the insulating film.

Abstract: A semiconductor device includes a semiconductor chip, an insulating base film and first projecting electrodes. The first projecting electrodes are formed in a single row on one face of the semiconductor chip along the edge of the semiconductor chip. This face of the semiconductor chip faces a semiconductor chip mounting face of the base film. The semiconductor device also includes second projecting electrodes formed in a single row outside the row of first projecting electrodes. The height of the second projecting electrodes is smaller than the first projecting electrodes. The semiconductor device also includes first inner leads formed on the semiconductor chip mounting face of the base film. The first inner lead extend to the first projecting electrodes. The semiconductor device also includes an insulating film formed between the first inner leads and the semiconductor chip. The semiconductor device also includes second inner leads formed on the insulating film.