Patents by Inventor Masahiko Toyosumi

Masahiko Toyosumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6565938
    Abstract: A resin composition comprising a saponified ethylene-vinyl acetate copolymer (A), a polyamide resin having a melting point not exceeding 160° C. (B), and a small proportion of a boron compound (C) and a laminate comprising a multi-lamellar shaped article comprised of the above resin composition layer (X) and a thermoplastic resin layer (Y).
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: May 20, 2003
    Assignee: Nippon Gohsei Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masahiko Toyosumi, Kenji Ninomiya