Patents by Inventor Masahiro Hatanai

Masahiro Hatanai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
    Patent number: 8633511
    Abstract: A semiconductor device provided with: an island and an island which are separated from each other; leads which approach the islands at one end; a control element which is attached to the island and is connected to a lead through a thin metal wire; and a switching element which is attached to the island and is connected to the lead through a metal wire. Further, the thin metal wire and the thin metal wire are arranged so as to the intersect.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: January 21, 2014
    Assignee: ON Semiconductor Trading, Ltd.
    Inventors: Masakazu Watanabe, Takashi Kuramochi, Masahiro Hatanai
  • SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME
    Publication number: 20110309408
    Abstract: A semiconductor device provided with: an island and an island which are separated from each other; leads which approach the islands at one end; a control element which is attached to the island and is connected to a lead through a thin metal wire; and a switching element which is attached to the island and is connected to the lead through a metal wire. Further, the thin metal wire and the thin metal wire are arranged so as to the intersect.
    Type: Application
    Filed: February 25, 2010
    Publication date: December 22, 2011
    Applicant: ON Semiconductor Trading, Ltd.
    Inventors: Masakazu Watanabe, Takashi Kuramochi, Masahiro Hatanai