Patents by Inventor Masahiro Hirai

Masahiro Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9530907
    Abstract: An optical module includes an optical semiconductor device and a stem including a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device. The optical module also includes a substrate having a ground layer, a first opening through which the lead terminal passes, and a connecting portion configured to electrically connect the stem and the ground layer. The connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: December 27, 2016
    Assignee: OCLARO JAPAN, INC.
    Inventors: Daisuke Noguchi, Masahiro Hirai, Hiroshi Yamamoto
  • Publication number: 20160006210
    Abstract: An optical module includes an optical semiconductor device and a stem including a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device. The optical module also includes a substrate having a ground layer, a first opening through which the lead terminal passes, and a connecting portion configured to electrically connect the stem and the ground layer. The connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem.
    Type: Application
    Filed: July 6, 2015
    Publication date: January 7, 2016
    Inventors: Daisuke NOGUCHI, Masahiro HIRAI, Hiroshi YAMAMOTO
  • Patent number: 8971725
    Abstract: An optical communication module includes a laser that emits laser light, and an electro-absorber that absorbs the laser light, which is emitted from the laser, according to a voltage modulated based on a modulating signal and a bias voltage. The optical communication module detects data that varies correlatively with the temperature of the electro-absorber, and sets the bias voltage, which is associated with the detected data, on the basis of relational data specifying at least the relationship between the bias voltage and the data.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: March 3, 2015
    Assignee: Oclaro Japan, Inc.
    Inventors: Satoshi Motohiro, Kohsuke Shimodate, Masahiro Hirai
  • Patent number: 8218973
    Abstract: Provided are an optical transmitter device and an optical transmitter module which are capable of reducing the optical transmitter module size while maintaining a state where an excellent optical transmission waveform quality is obtained over a wide range of frequencies. The optical transmission module (2) includes a semiconductor laser diode device (10), an optical modulator device (12), and a first termination resistor circuit (14-1). A printed circuit board (4) includes a driver IC (16) and a second termination resistor circuit (14-2). A lower cutoff frequency of the first termination resistor circuit (14-1) and an upper cutoff frequency of the second termination resistor circuit (14-2) correspond to each other. An impedance of the first termination resistor circuit (14-1) in a pass frequency band thereof and an impedance of the second termination resistor circuit (14-2) in a pass frequency band thereof correspond to each other.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: July 10, 2012
    Assignee: Opnext Japan, Inc.
    Inventors: Osamu Kagaya, Satoshi Motohiro, Masahiro Hirai
  • Patent number: 8213472
    Abstract: Disclosed is an optical transmission module in which effects of conductive heat from sides of a metal case upon a thermistor are reduced, thereby allowing steady optical beam wavelengths to be obtained over a wide range of temperatures, regardless of the temperature of the usage environment. Specifically, the optical transmission module includes Peltier elements disposed inside a metal case, a metal base disposed upon the Peltier elements, a laser diode substrate disposed upon the metal base, a laser diode disposed upon the laser diode substrate, a thermistor substrate disposed upon the metal base, a thermistor disposed upon the thermistor substrate, and a thermally conductive member, disposed in the vicinity of the thermistor, that has a height greater than the height of the thermistor.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: July 3, 2012
    Assignee: Opnext Japan, Inc.
    Inventors: Masahiro Hirai, Takeshi Yamashita, Hideyuki Kuwano
  • Patent number: 8077750
    Abstract: An optical transmitting module of a coaxial type is provided in which a disturbance in a waveform of light which is output from a semiconductor laser element due to a signal which is output from an optical modulator unit can be suppressed. The optical transmitting module comprises an optical transmitting package of a coaxial type and a line board (40) connected to the optical transmitting package. The optical transmitting package comprises a semiconductor laser element, an optical modulator unit, and a conductor board (21). A drive current supply line (42) and a common ground line are formed over the line board (40), and a signal attenuation circuit (60) having one end electrically connected to the common ground line and the other end electrically connected to the drive current supply line (42) is provided over the line board (40).
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: December 13, 2011
    Assignee: OpNext Japan, Inc.
    Inventors: Masahiro Hirai, Hiroshi Yamamoto
  • Publication number: 20110085796
    Abstract: An optical communication module includes a laser that emits laser light, and an electro-absorber that absorbs the laser light, which is emitted from the laser, according to a voltage modulated based on a modulating signal and a bias voltage. The optical communication module detects data that varies correlatively with the temperature of the electro-absorber, and sets the bias voltage, which is associated with the detected data, on the basis of relational data specifying at least the relationship between the bias voltage and the data.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 14, 2011
    Inventors: Satoshi MOTOHIRO, Kohsuke Shimodate, Masahiro Hirai
  • Publication number: 20100232806
    Abstract: Provided are an optical transmitter device and an optical transmitter module which are capable of reducing the optical transmitter module size while maintaining a state where an excellent optical transmission waveform quality is obtained over a wide range of frequencies. The optical transmission module (2) includes a semiconductor laser diode device (10), an optical modulator device (12), and a first termination resistor circuit (14-1). A printed circuit board (4) includes a driver IC (16) and a second termination resistor circuit (14-2). A lower cutoff frequency of the first termination resistor circuit (14-1) and an upper cutoff frequency of the second termination resistor circuit (14-2) correspond to each other. An impedance of the first termination resistor circuit (14-1) in a pass frequency band thereof and an impedance of the second termination resistor circuit (14-2) in a pass frequency band thereof correspond to each other.
    Type: Application
    Filed: November 25, 2009
    Publication date: September 16, 2010
    Inventors: Osamu Kagaya, Satoshi Motohiro, Masahiro Hirai
  • Publication number: 20090196628
    Abstract: An optical transmitting module of a coaxial type is provided in which a disturbance in a waveform of light which is output from a semiconductor laser element due to a signal which is output from an optical modulator unit can be suppressed. The optical transmitting module comprises an optical transmitting package of a coaxial type and a line board (40) connected to the optical transmitting package. The optical transmitting package comprises a semiconductor laser element, an optical modulator unit, and a conductor board (21). A drive current supply line (42) and a common ground line are formed over the line board (40), and a signal attenuation circuit (60) having one end electrically connected to the common ground line and the other end electrically connected to the drive current supply line (42) is provided over the line board (40).
    Type: Application
    Filed: January 23, 2009
    Publication date: August 6, 2009
    Inventors: Masahiro Hirai, Hiroshi Yamamoto
  • Publication number: 20080175601
    Abstract: Disclosed is an optical transmission module in which effects of conductive heat from sides of a metal case upon a thermistor are reduced, thereby allowing steady optical beam wavelengths to be obtained over a wide range of temperatures, regardless of the temperature of the usage environment. Specifically, the optical transmission module includes Peltier elements disposed inside a metal case, a metal base disposed upon the Peltier elements, a laser diode substrate disposed upon the metal base, a laser diode disposed upon the laser diode substrate, a thermistor substrate disposed upon the metal base, a thermistor disposed upon the thermistor substrate, and a thermally conductive member, disposed in the vicinity of the thermistor, that has a height greater than the height of the thermistor.
    Type: Application
    Filed: January 23, 2008
    Publication date: July 24, 2008
    Inventors: Masahiro Hirai, Takeshi Yamashita, Hideyuki Kuwano
  • Patent number: 6937406
    Abstract: The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: August 30, 2005
    Assignee: OpNext Japan, Inc.
    Inventors: Naoki Matsushima, Hideo Sotokawa, Hideyuki Kuwano, Yoshiaki Niwa, Keiichi Yamada, Masahiro Hirai, Kazumi Kawamoto, Shohei Hata, Toshiaki Takai
  • Publication number: 20040240087
    Abstract: The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.
    Type: Application
    Filed: August 22, 2003
    Publication date: December 2, 2004
    Applicant: OpNext Japan, Inc.
    Inventors: Naoki Matsushima, Hideo Sotokawa, Hideyuki Kuwano, Yoshiaki Niwa, Keiichi Yamada, Masahiro Hirai, Kazumi Kawamoto, Shohei Hata, Toshiaki Takai