Patents by Inventor Masahiro Hirayama
Masahiro Hirayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240099155Abstract: A memory includes: a magnet including a first and second portions adjacent in a first direction. The first portion has a first dimension in a second direction at a first position at which a dimension of the magnet in the second direction is maximum, the second direction perpendicular to the first direction, the second portion has a second dimension in the second direction at a second position at which a dimension of the magnet in the second direction is minimum, the second dimension smaller than the first dimension, the first portion is continuous to the second portion via a third position between the first and second positions, a curve corresponding to an outer of the magnet extends between the first and third positions, and the curve passes through a side closer to the central axis of the magnet than a straight line connecting the first and second positions.Type: ApplicationFiled: September 11, 2023Publication date: March 21, 2024Applicant: Kioxia CorporationInventors: Masahiro KOIKE, Michael Arnaud QUINSAT, Nobuyuki UMETSU, Tsutomu NAKANISHI, Agung SETIADI, Megumi YAKABE, Shigeyuki HIRAYAMA, Masaki KADO, Yasuaki OOTERA, Shiho NAKAMURA, Susumu HASHIMOTO, Tsuyoshi KONDO
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Patent number: 11811191Abstract: Disclosed is an optical semiconductor device including a semiconductor laser chip, an insulation substrate, a ground pattern, a mounted pattern, a resistor and an extension ground pattern. The insulation substrate has a surface mounting the semiconductor laser chip thereon. The ground pattern and the mounted pattern are provided on the surface. The mounted pattern has an opposite side opposite to the ground pattern. The resistor is disposed such that a side edge of the resistor separates from an extension region of the opposite side. The extension ground pattern is positioned in the extension region of the opposite side and is electrically connected to the ground pattern. The capacitor is disposed on the mounted pattern.Type: GrantFiled: August 20, 2020Date of Patent: November 7, 2023Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro Hirayama
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Patent number: 11604370Abstract: An optical modulator carrier assembly includes a optical modulator, a transmission line substrate, a first via, a second via and a wire having an inductor component provided on a second surface of the transmission line substrate, and electrically connecting between the another end of the first via and the another end of the second via. The one end of the first via, the cathode electrode pad, the terminating resistor, the one end of the second via are arranged on the in this order.Type: GrantFiled: April 14, 2020Date of Patent: March 14, 2023Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro Hirayama
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Publication number: 20220415833Abstract: A 2nd signal line has impedance lower than impedance of a 1st signal line. A capacitor includes a 1st extension part and a 2nd extension part, a 1st ground part and a 2nd ground part. The 1st extension part and the 2nd extension part are connected to a 2nd signal line and are provided on an insulation substrate to extend along a longitudinal direction of the 2nd signal line. The 1st ground part and the 2nd ground part are at least a part of a ground pattern, and are provided between the 1st extension part and the 2nd extension part and the 2nd signal line, and between the 1st extension part and the 2nd extension part and an end part of the insulation substrate, to be electrically coupled with the 1st extension part and the 2nd extension part.Type: ApplicationFiled: August 30, 2022Publication date: December 29, 2022Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro HIRAYAMA
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Patent number: 11469192Abstract: A 2nd signal line has impedance lower than impedance of a 1st signal line. A capacitor includes a 1st extension part and a 2nd extension part, a 1st ground part and a 2nd ground part. The 1st extension part and the 2nd extension part are connected to a 2nd signal line and are on an insulation substrate to extend along a longitudinal direction of the 2nd signal line. The 1st ground part and the 2nd ground part are at least a part of a ground pattern, and are between the 1st extension part and the 2nd extension part and the 2nd signal line, and between the 1st extension part and the 2nd extension part and an end part of the insulation substrate, to be electrically coupled with the 1st extension part and the 2nd extension part.Type: GrantFiled: March 6, 2019Date of Patent: October 11, 2022Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro Hirayama
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Publication number: 20220040787Abstract: A laser beam machine includes: a processor to machine a workpiece as the processor moves; a saddle that holds the processor, and moves the processor in a Y direction by moving in the Y direction along a guide extending in the Y direction; a cross rail on which the saddle is placed, the cross rail moving the saddle and the processor in an X direction by moving in the X direction along a guide extending in the X direction; and a bed on which the cross rail is placed via the guide extending in the X direction. The bed includes bases and beams, one of longitudinal end portions of the base is joined to a side surface of the beam, one of longitudinal end portions of the beam is joined to a side surface of the base.Type: ApplicationFiled: April 25, 2019Publication date: February 10, 2022Applicant: Mitsubishi Electric CorporationInventors: Masahiro HIRAYAMA, Takeshi KITAGAWA
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Publication number: 20210057877Abstract: Disclosed is an optical semiconductor device including a semiconductor laser chip, an insulation substrate, a ground pattern, a mounted pattern, a resistor and an extension ground pattern. The insulation substrate has a surface mounting the semiconductor laser chip thereon. The ground pattern and the mounted pattern are provided on the surface. The mounted pattern has an opposite side opposite to the ground pattern. The resistor is disposed such that a side edge of the resistor separates from an extension region of the opposite side. The extension ground pattern is positioned in the extension region of the opposite side and is electrically connected to the ground pattern. The capacitor is disposed on the mounted pattern.Type: ApplicationFiled: August 20, 2020Publication date: February 25, 2021Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro HIRAYAMA
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Publication number: 20210028132Abstract: A 2nd signal line has impedance lower than impedance of a 1st signal line. A capacitor includes a 1st extension part and a 2nd extension part, a 1st ground part and a 2nd ground part. The 1st extension part and the 2nd extension part are connected to a 2nd signal line and are on an insulation substrate to extend along a longitudinal direction of the 2nd signal line. The 1st ground part and the 2nd ground part are at least a part of a ground pattern, and are between the 1st extension part and the 2nd extension part and the 2nd signal line, and between the 1st extension part and the 2nd extension part and an end part of the insulation substrate, to be electrically coupled with the 1st extension part and the 2nd extension part.Type: ApplicationFiled: March 6, 2019Publication date: January 28, 2021Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro HIRAYAMA
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Publication number: 20200333639Abstract: An optical modulator carrier assembly includes a optical modulator, a transmission line substrate, a first via, a second via and a wire having an inductor component provided on a second surface of the transmission line substrate, and electrically connecting between the another end of the first via and the another end of the second via. The one end of the first via, the cathode electrode pad, the terminating resistor, the one end of the second via are arranged on the in this order.Type: ApplicationFiled: April 14, 2020Publication date: October 22, 2020Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro HIRAYAMA
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Patent number: 10411432Abstract: An optical module with a semiconductor element, which integrates a semiconductor laser diode with an electro-absorption modulator, mounted on a carrier; and an optical transmitter apparatus implementing the optical modules are disclosed. The carrier of the optical module has a back metal connected to the ground on the top thereof through a metal provided in a side surface of the carrier but electrically isolated from the chassis ground of the optical transmitter apparatus. The optical transmitter apparatus installs a plurality of the optical modules on a thermos-electric cooler (TEC) in a top plate thereof. The top plate is electrically isolated from the chassis ground.Type: GrantFiled: December 4, 2018Date of Patent: September 10, 2019Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro Hirayama
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Patent number: 10396898Abstract: An optical module installed within an optical transmitter apparatus is disclosed. The optical module provides an electrically insulating carrier, a semiconductor element, and a capacitor. The carrier provides a ground pattern and a bias pad. The ground pattern mounts the capacitor and the semiconductor element thereon. The bias pad is electrically isolated from the ground pattern thereby forming a parasitic capacitor against the ground pattern. The optical module further includes at least two bonding wires among a first bonding wire connecting the semiconductor element with the bias pad, a second bonding wire connecting the bias pad with the capacitor, and an additional bonding wire connecting the capacitor with the semiconductor element. The semiconductor element is supplied with a bias current through the at least two bonding wires.Type: GrantFiled: November 1, 2017Date of Patent: August 27, 2019Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventors: Shuichi Kubota, Masahiro Hirayama
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Publication number: 20190131762Abstract: An optical module with a semiconductor element, which integrates a semiconductor laser diode with an electro-absorption modulator, mounted on a carrier; and an optical transmitter apparatus implementing the optical modules are disclosed. The carrier of the optical module has a back metal connected to the ground on the top thereof through a metal provided in a side surface of the carrier but electrically isolated from the chassis ground of the optical transmitter apparatus. The optical transmitter apparatus installs a plurality of the optical modules on a thermos-electric cooler (TEC) in a top plate thereof. The top plate is electrically isolated from the chassis ground.Type: ApplicationFiled: December 4, 2018Publication date: May 2, 2019Inventor: Masahiro Hirayama
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Patent number: 10177529Abstract: An optical module with a semiconductor element, which integrates a semiconductor laser diode with an electro-absorption modulator, mounted on a carrier; and an optical transmitter apparatus implementing the optical modules are disclosed. The carrier of the optical module has a back metal connected to the ground on the top thereof through a metal provided in a side surface of the carrier but electrically isolated from the chassis ground of the optical transmitter apparatus. The optical transmitter apparatus installs a plurality of the optical modules on a thermos-electric cooler (TEC) in a top plate thereof. The top plate is electrically isolated from the chassis ground.Type: GrantFiled: April 25, 2017Date of Patent: January 8, 2019Assignee: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Masahiro Hirayama
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Publication number: 20180123697Abstract: An optical module installed within an optical transmitter apparatus is disclosed. The optical module provides an electrically insulating carrier, a semiconductor element, and a capacitor. The carrier provides a ground pattern and a bias pad. The ground pattern mounts the capacitor and the semiconductor element thereon. The bias pad is electrically isolated from the ground pattern thereby forming a parasitic capacitor against the ground pattern. The optical module further includes at least two bonding wires among a first bonding wire connecting the semiconductor element with the bias pad, a second bonding wire connecting the bias pad with the capacitor, and an additional bonding wire connecting the capacitor with the semiconductor element. The semiconductor element is supplied with a bias current through the at least two bonding wires.Type: ApplicationFiled: November 1, 2017Publication date: May 3, 2018Inventors: Shuichi Kubota, Masahiro Hirayama
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Publication number: 20170310078Abstract: An optical module with a semiconductor element, which integrates a semiconductor laser diode with an electro-absorption modulator, mounted on a carrier; and an optical transmitter apparatus implementing the optical modules are disclosed. The carrier of the optical module has a back metal connected to the ground on the top thereof through a metal provided in a side surface of the carrier but electrically isolated from the chassis ground of the optical transmitter apparatus. The optical transmitter apparatus installs a plurality of the optical modules on a thermos-electric cooler (TEC) in a top plate thereof. The top plate is electrically isolated from the chassis ground.Type: ApplicationFiled: April 25, 2017Publication date: October 26, 2017Inventor: Masahiro Hirayama
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Patent number: 9673496Abstract: A signal transmission line is disclosed. The signal transmission line includes a dielectric substrate, a signal line formed on a first surface of the dielectric substrate, a first conductive layer formed on a second surface of the dielectric substrate, and a first stub formed on the first surface of the dielectric substrate, the first stub being electrically connected with the signal line. The first stub includes a plurality of straight areas each extending from a different position of the signal line, a conductor part extending in parallel with the signal line, the conductor part being electrically connected with straight areas, a projection part connected with the conductor part, the projection part extending from the conductor part, and an opening provided between the conductor part and the signal line.Type: GrantFiled: September 19, 2014Date of Patent: June 6, 2017Assignee: Sumitomo Electric Device Innovations, Inc.Inventor: Masahiro Hirayama
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Patent number: 9502745Abstract: A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.Type: GrantFiled: July 23, 2014Date of Patent: November 22, 2016Assignee: Sumitomo Electric Device Innovations, Inc.Inventor: Masahiro Hirayama
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Patent number: 9270001Abstract: A flexible circuit board includes: an insulative substrate having a first surface and a second surface opposite to the first surface; a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line; a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line; a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.Type: GrantFiled: July 3, 2013Date of Patent: February 23, 2016Assignee: Sumitomo Electric Device Innovations, Inc.Inventor: Masahiro Hirayama
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Publication number: 20150084714Abstract: A signal transmission line is disclosed. The signal transmission line includes a dielectric substrate, a signal line formed on a first surface of the dielectric substrate, a first conductive layer formed on a second surface of the dielectric substrate, and a first stub formed on the first surface of the dielectric substrate, the first stub being electrically connected with the signal line. The first stub includes a plurality of straight areas each extending from a different position of the signal line, a conductor part extending in parallel with the signal line, the conductor part being electrically connected with straight areas, a projection part connected with the conductor part, the projection part extending from the conductor part, and an opening provided between the conductor part and the signal line.Type: ApplicationFiled: September 19, 2014Publication date: March 26, 2015Inventor: Masahiro HIRAYAMA
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Publication number: 20150028971Abstract: A flexible substrate is disclosed. The flexible substrate includes an insulating substrate having a first surface and a second surface opposite to the first surface, a first connection portion having a first conductor, a first ground pattern, and a second ground pattern on the first surface, the first ground pattern and the second ground pattern being spaced apart from the first conductor and respectively located at either side of the first conductor, a conductor pattern formed on the second surface, the conductor pattern being connected to the first conductor, and a third ground pattern formed on the second surface, the third ground pattern being connected to the first ground pattern, wherein a distance between the conductor pattern and the third ground pattern is smaller than a distance between the first conductor and the first ground pattern.Type: ApplicationFiled: July 23, 2014Publication date: January 29, 2015Inventor: Masahiro HIRAYAMA