Abstract: A game device according to the present embodiment includes a camera as image pick-up means. An inner camera is accommodated in an upper housing. In addition, a microphone hole is provided in an inner surface of the upper housing so as to sense external sound through a microphone.

Abstract: A liquid crystal sealing material comprising (a) a radiation curable resin represented by the general formula (1) below, (b) a photopolymerization initiator and (c) a filler having an average particle diameter of not more than 3 ?m. (In the formula (1), R1 represents a hydrogen atom or a methyl group; R2 may be the same or different and represents a hydrogen atom, a halogen atom, a hydroxyl group, a monovalent linear, branched or cyclic alkyl group having 1-10 carbon atoms or an alkoxy group having 1-10 carbon atoms; m represents an integer of 1-4; R3 represents a hydrogen atom or a methyl group; R4 represents a linear, branched or cyclic alkyl group having 1-10 carbon atoms; 1 represents a range of positive numbers from 1 to 5; and the repeating unit number n represents a range of positive numbers from 0 to 20.

Abstract: An objective of this application is to provide a sealant for liquid crystals witch is extremely less apt to contaminate liquid crystals and has high adhesion strength. This application discloses a sealant for liquid crystals comprising as essential ingredients (a) a radiation-curable resin represented by the general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a halogen atom, a hydroxyl group, a linear, branch or cyclic monovalent alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, m represents an integer of 1 to 4, and may be the same or different, R3 represents a hydrogen atom or a methyl group, and the number n of the repeating units is a positive number in the range of 0 to 20; (b) a photopolymerization initiator; and (c) an inorganic filler having an average particle diameter of 3 ?m or less.

Abstract: Identification information of another image communication apparatus is received, as transmitter information indicating a transmitter, from the another image communication apparatus, and display is performed so as to indicate the transmitter on display means in accordance with the transmitter information having been received, and a user is allowed to select whether or not an image is to be received from the another image communication apparatus having transmitted the transmitter information. Next, its own identification information is transmitted, as destination information indicating a destination, to the another image communication apparatus which is selected as the transmitter from which an image is to be received. An image is received from the another image communication apparatus to which the destination information is transmitted, and the received image is stored in storage means.

Abstract: A hand-held imaging apparatus 10 comprises a lower housing 11, an upper housing 21, an outer camera 25, a lower LCD 12, a touch panel 13, and change means. The upper housing 21 is foldably connected to the lower housing 11. The outer camera 25 is provided in an outer surface of the upper housing 21 when folded. The lower LCD 12 has a display screen which is provided in an inner surface of the lower housing 11 when folded, and displays a live image which is currently taken by the outer camera 25. The touch panel 13 is provided on the display screen of the lower LCD 12. The change means makes a change to the live image based on an input with respect to the touch panel 13.

Abstract: [Problems] To provide a liquid crystal sealing material having an extremely low possibility of contaminating liquid crystals and a high bond strength. [Means For Solving Problems] A liquid crystal sealing material comprising: (a) a resin obtained by (meth)acryloylating an epoxy resin (A) represented by formula (1); (b) a photopolymerization initiator; and (c) an inorganic filler having a mean particle diameter of 3 ?m or less, wherein a ratio of a p,p? isomer in a bisphenol F monomer unit constituting the epoxy resin (A) accounts for 40% or more, (wherein a repeating unit number z is in a range of 0 to 2).

Abstract: Disclosed is a sealing material for liquid crystals having high adhesion strength and excellent gap-forming power at bonding of panels. Also disclosed are a method for producing such a sealing material and a method for producing a liquid crystal display cell which is improved in productivity, high-speed response and reliability. The sealing material for liquid crystals is produced through a step wherein fine particles (D) having an average particle size of not more than 3 ?m are dispersed, using a wet dispersion unit (A), in a reactive resin (C) having an epoxy group and/or a (meth)acryloyl group which resin has been dissolved in a solvent (B) and a following step wherein the solvent (B) is removed.

Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.

Abstract: To provide a photopolymerization initiator having an extremely low possibility of contaminating liquid crystals, and a liquid crystal sealing material using such a photopolymerization initiator. A liquid crystal sealing material comprising (a) a reactive photopolymerization initiator represented by the general formula (1) and (b) a photocurable resin: (wherein R1 represents a divalent straight chain, branched or cyclic lower alkylene group having 1 to 10 carbon atoms or an arylene group; R2 represents a divalent straight chain, branched or cyclic lower alkylene group having 1 to 10 carbon atoms or an arylene group; Ar represents an arylene group; R3 represents a hydrogen atom or a methyl group; X and Y respectively represent O or S; and Z is a hydroxyl group or a morpholino group).

Abstract: [Problems] To provide a radiation curable resin having an extremely low possibility of contaminating liquid crystals, and a liquid crystal sealing material using such a photopolymerization initiator. [Means for Solving Problems] A liquid crystal sealing material characterized by comprising (a) a radiation curable resin represented by the general formula (1) below, (b) a photopolymerization initiator and (c) a filler having an average particle diameter of not more than 3 ?m.

Abstract: [PROBLEMS] To provide a photopolymerization initiator having an extremely low possibility of contaminating liquid crystals, and a liquid crystal sealing material using such a photopolymerization initiator. [MEANS FOR SOLVING PROBLEMS] A liquid crystal sealing material comprising (a) a reactive photopolymerization initiator represented by the general formula (1) and (b) a photocurable resin: (wherein R1 represents a divalent straight chain, branched or cyclic lower alkylene group having 1 to 10 carbon atoms or an arylene group; R2 represents a divalent straight chain, branched or cyclic lower alkylene group having 1 to 10 carbon atoms or an arylene group; Ar represents an arylene group; R3 represents a hydrogen atom or a methyl group; X and Y respectively represent O or S; and Z is a hydroxyl group or a morpholino group).

Abstract: The present invention relates to a resin composition for protective films which comprises an epoxy resin having two or more epoxy groups, a curing agent, a curing accelerator, a solvent, and a colloidal slurry of fine silica particles having an average particle diameter, as determined by conversion from the specific surface area, of 50 nm or smaller, a pH of 6 to 8, and an alkali metal content of 5 ppm or lower. The resin composition gives a protective film which satisfies adhesiveness and visible-light transmission, which are performances conventionally required. The protective film further has high surface smoothness even when the substrate surface is not smoothed. The resin composition has satisfactory storage stability and does not stain liquid crystal. Furthermore, a cured film obtained from the resin composition has excellent high-temperature resistance, especially ITO resistance.

Abstract: An objective of this application is to provide a sealant for liquid crystals witch is extremely less apt to contaminate liquid crystals and has high adhesion strength. This application discloses a sealant for liquid crystals comprising as essential ingredients (a) a radiation-curable resin represented by the general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a halogen atom, a hydroxyl group, a linear, branch or cyclic monovalent alkyl group having 1 to 10 carbon atoms, or an alkoxy group having 1 to 10 carbon atoms, m represents an integer of 1 to 4, and may be the same or different, R3 represents a hydrogen atom or a methyl group, and the number n of the repeating units is a positive number in the range of 0 to 20; (b) a photopolymerization initiator; and (c) an inorganic filler having an average particle diameter of 3 ?m or less.

Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.

Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.

Abstract: A cover-lay film comprising a heat-resistant film and an adhesive layer, wherein the adhesive layer is formed of an epoxy resin composition containing (a) an epoxy resin, (b) a curing agent, (c) a phenolic hydroxyl-containing polyamide-poly(butadiene-acrylonitrile) copolymer, and (d) an ion capturing agent and having a glass transition temperature of 80° C. or higher after cure, and the heat-resistant film mainly comprises a polyimide containing a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component and has a specific coefficient of linear thermal expansion and a specific tensile modulus in both machine and transverse directions.

Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product.

Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.

Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.

Abstract: The present invention is intended to provide cured articles which has excellent heat resistance and excellent flexibility, excellent adhesion, excellent dielectric properties and excellent toughness suitable laminates, metal foil-clad laminates, insulating materials for build-up substrates, flexible printed wiring boards, materials for flexible printed wiring boards, etc.