Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.

Abstract: An electromagnetic relay which is provided with an armature, a moving electrode which has a moving plate and a moving contact and a fixed electrode which faces the moving electrode and has a fixed plate and a fixed contact. At least a portion of the moving plate onto which the moving contact is arranged and at least a portion of the fixed plate onto which the fixed contact is arranged are inclined in width direction.

Abstract: At occurrence of jamming, a downstream-side conveying roller pair is stopped, while an upstream-side conveying roller pair continuously rotates, whereby a sheet between the downstream-side conveying roller pair and the upstream-side conveying roller pair is ejected from a sheet conveying path opened by a movable guide portion. At this time, a conveying force of a stepping motor driving the upstream-side conveying roller pair is made larger than the conveying force before the occurrence of jamming.

Abstract: An electromagnetic relay which is provided with an armature, a moving electrode which has a moving plate and a moving contact and a fixed electrode which faces the moving electrode and has a fixed plate and a fixed contact. At least a portion of the moving plate onto which the moving contact is arranged and at least a portion of the fixed plate onto which the fixed contact is arranged are inclined in width direction.

Abstract: An electromagnetic relay includes a coil, an armature, an iron core, a card, a first contact, and a second contact. The card is connected to the armature and formed of an insulating material. The first contact and the second contact are in contact when there is no flow of electric current through the coil. The first contact and the second contact are separated with the armature being attracted to the iron core to interpose the card between the first contact and the second contact when there is a flow of electric current through the coil.

Abstract: A substrate with a built-in capacitor includes an insulating base material layer, a build-up layer formed on the insulating base material layer and including a conductor layer and an insulating layer, and a multilayer ceramic capacitor positioned in an opening of the base material layer and including internal electrodes, ceramic dielectric layers and a pair of external electrodes. The ceramic capacitor has a cuboid shape having long sides and short sides, the pair of external electrodes is formed on opposing long-side sides such that the external electrodes are separated by a distance in range of 30 ?m to 200 ?m and that each external electrode includes a conductive paste layer connected to a respective group of the internal electrodes and a copper plated layer covering the conductive paste layer, and the conductive paste layer includes Ni paste or Cu paste including glass component in range of 5% to 40%.

Abstract: Provided is a printer capable of enhancing the cutting efficiency of printing paper. A printer, includes a printing unit; a fixed blade; a movable blade provided to be movable relative to the fixed blade, and cut the printing medium with the fixed blade; and a tension mechanism applying a tensional force to the printing medium. The tension mechanism includes a receiving member disposed on the discharge side of the fixed blade; and a pressing member extending from the movable blade toward the discharge side, moving with the movable blade. The pressing member includes a pressing part configured to press the printing medium against the receiving member and move toward the discharge side while holding the printing medium between the pressing part and the receiving member, as the movable blade moves toward the fixed blade.

Abstract: At occurrence of jamming, a downstream-side conveying roller pair is stopped, while an upstream-side conveying roller pair continuously rotates, whereby a sheet between the downstream-side conveying roller pair and the upstream-side conveying roller pair is ejected from a sheet conveying path opened by a movable guide portion. At this time, a conveying force of a stepping motor driving the upstream-side conveying roller pair is made larger than the conveying force before the occurrence of jamming.

Abstract: A semiconductor mounting device including a first substrate having insulation layers, conductor layers formed on the insulation layers, and via conductors connecting the conductor layers, a second substrate having insulation layers and conductor layers formed on the insulation layers of the second substrate, first bumps connecting the first substrate and the second substrate and formed on an outermost conductor layer of the first substrate formed on an outermost insulation layer of the first substrate, and second bumps positioned to mount a semiconductor element to the second substrate and formed on an outermost conductor layer of the second substrate formed on an outermost insulation layer of the second substrate. The second substrate has a thickness which is greater than a thickness of the first substrate.

Abstract: A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer.

Abstract: A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure.

Abstract: Provided is a printer capable of enhancing the cutting efficiency of printing paper. A printer, includes a printing unit; a fixed blade; a movable blade provided to be movable relative to the fixed blade, and cut the printing medium with the fixed blade; and a tension mechanism applying a tensional force to the printing medium. The tension mechanism includes a receiving member disposed on the discharge side of the fixed blade; and a pressing member extending from the movable blade toward the discharge side, moving with the movable blade. The pressing member includes a pressing part configured to press the printing medium against the receiving member and move toward the discharge side while holding the printing medium between the pressing part and the receiving member, as the movable blade moves toward the fixed blade.

Abstract: A cutting device includes a cutting blade configured to cut a recording medium; a support unit that supports the cutting blade to be movable in an inclined direction with respect to a surface of the recording medium such that the cutting blade is moved toward the recording medium while moving in a width direction of the recording medium; and a movable unit that causes the cutting blade supported by the support unit to be moved in the inclined direction to cut the recording medium.

Abstract: A method for manufacturing a printed wiring board includes forming a removable layer on a support substrate, forming an interlayer resin insulation layer on the removable layer, forming a penetrating hole in the interlayer resin insulation layer, forming a first conductive layer on the interlayer resin insulation layer and on a side wall of the penetrating hole, forming a conductive circuit on the interlayer resin insulation layer, forming a via conductor in the penetrating hole, removing the support substrate from the interlayer resin insulation layer by using the removable layer, forming a protruding portion of the via conductor protruding from a surface of the interlayer resin insulation layer, and forming a surface-treatment coating on a surface of the protruding portion of the via conductor.

Abstract: A pivotal manipulation type writing instrument includes a pivotable body pivotable relative to a container main body and a writing element ejecting unit configured to actuate and move a slider to urge a writing element to be ejected from the container main body as the pivotable body is pivoted. The pivotable body is pivotable relative to the container main body by 360° in either left or right direction, and the writing element can be returned to a retracted state in which the writing element is retracted into the container main body from an ejected state in which the writing element is ejected from the container main body by moving the pivotable body in either left or right direction.

Abstract: An electromagnetic relay which is provided with an armature, a moving electrode which has a moving plate and a moving contact and a fixed electrode which faces the moving electrode and has a fixed plate and a fixed contact. At least a portion of the moving plate onto which the moving contact is arranged and at least a portion of the fixed plate onto which the fixed contact is arranged are inclined in width direction.

Abstract: A relay includes: a fixed terminal on which a fixed contact is provided; a movable terminal on which a movable contact is provided; a cam that has an elliptical circumference shape, and is rotatable while a portion of the circumference shape is contacting a surface of the movable terminal; and a driving unit that rotates the cam so that respective portions located at one ends of a major axis and a minor axis of the elliptical circumference shape alternately contact the surface of the movable terminal; wherein when the portion located at one end of the major axis of the elliptical circumference shape of the cam contacts the surface of the movable terminal, the movable terminal is deformed elastically so that the movable contact contacts the fixed contact.

Abstract: A perpendicular substrate antenna 7 is fixed vertically on an upper surface of a baseplate 3. An antenna pattern 18 is formed on the surface of the perpendicular substrate antenna 7 and a coil is 13 mounted. A plate shaped antenna 8 is attached to an upper edge of the perpendicular substrate antenna 7. The plate shaped antenna 8 includes a structure in which a pair of flat parts 81, 82 are connected via clip parts 83˜86 and contact arms 93, 84, 62, 64 which contact the surface of the perpendicular substrate antenna 7 and latching arms 96, 97, 61, 62 which pass through perpendicular substrate antenna 7 and contact the opposite side surface each protrude from a lower edge of each flat part 81, 82.

Abstract: A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer.

Abstract: A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer.