Patents by Inventor Masahiro Kondou

Masahiro Kondou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240059865
    Abstract: A shaped body of a fluororesin obtained using a shaping material comprising a powder of a fluororesin. The powder of the fluororesin has a static bulk density of 0.3 g/ml or more and 1.5 g/ml or less, and a particle diameter of 10 ?m or more and 300 ?m or less in terms of D50. Also disclosed is a three-dimensional structure containing the shaped body, and a method of shaping the shaping material.
    Type: Application
    Filed: November 2, 2023
    Publication date: February 22, 2024
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiroyuki SENDAN, Tadahiro YABU, Yukihiro FUKAGAWA, Kenta MURAYAMA, Tomohiro SHIROMARU, Toshio MIYATANI, Masahiro KONDOU, Hiroyuki HAMADA
  • Patent number: 11866570
    Abstract: A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 ?m or more and 200 ?m or less and a D10 of 12 ?m or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: January 9, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirokazu Komori, Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa, Kenta Murayama, Tomohiro Shiromaru, Toshio Miyatani, Masahiro Kondou, Hiroyuki Hamada
  • Patent number: 11845847
    Abstract: A shaping material for a powder bed fusion method, containing a powder of a fluororesin.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: December 19, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa, Kenta Murayama, Tomohiro Shiromaru, Toshio Miyatani, Masahiro Kondou, Hiroyuki Hamada
  • Publication number: 20230167269
    Abstract: A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 µm or more and 200 µm or less and a D10 of 12 µm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.
    Type: Application
    Filed: January 9, 2023
    Publication date: June 1, 2023
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hirokazu KOMORI, Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa, Kenta Murayama, Tomohiro Shiromaru, Toshio Miyatani, Masahiro Kondou, Hiroyuki Hamada
  • Patent number: 11555098
    Abstract: A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 ?m or more and 200 ?m or less, and the fluororesin has a D10 of 12 ?m or more.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: January 17, 2023
    Assignee: DAIKIN INDUSTRIES. LTD.
    Inventors: Hirokazu Komori, Junpei Terada, Hiroyuki Sendan, Tadahiro Yabu, Yukihiro Fukagawa, Kenta Murayama, Tomohiro Shiromaru, Toshio Miyatani, Masahiro Kondou, Hiroyuki Hamada
  • Patent number: 11413798
    Abstract: A vehicle interior board which is thin, lightweight, has high strength, has less degradation, peeling and the like near an end portion of a metal plate, and has high quality and excellent productivity; and a method for manufacturing the same. The vehicle interior board includes a pair of metal plates and a foamed polyurethane layer formed between the pair of metal plates. A projecting ridge projecting outwardly and extending in a predetermined direction along the outer surface is formed on an outer surface of the metal plate. Thus, it is possible to obtain desired strength and rigidity even when the metal plates or the foamed polyurethane layer are thinned or when a lightweight aluminum plate or the like is adopted as the metal plates. Therefore, it is possible to reduce weight of a vehicle interior board.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: August 16, 2022
    Assignee: MORIDEN Co., Ltd.
    Inventors: Junichi Ishii, Masahiro Kondou, Takumi Ono, Yoshihisa Tokutomi
  • Publication number: 20210087354
    Abstract: A shaping material for a powder bed fusion method, containing a powder of a fluororesin.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 25, 2021
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Hiroyuki SENDAN, Tadahiro YABU, Yukihiro FUKAGAWA, Kenta MURAYAMA, Tomohiro SHIROMARU, Toshio MIYATANI, Masahiro KONDOU, Hiroyuki HAMADA
  • Publication number: 20210047497
    Abstract: A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 ?m or more and 200 ?m or less, and the fluororesin has a D10 of 12 ?m or more.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 18, 2021
    Applicant: Daikin Industries, LTD.
    Inventors: Hirokazu KOMORI, Junpei TERADA, Hiroyuki SENDAN, Tadahiro YABU, Yukihiro FUKAGAWA, Kenta MURAYAMA, Tomohiro SHIROMARU, Toshio MIYATANI, Masahiro KONDOU, Hiroyuki HAMADA
  • Publication number: 20200147841
    Abstract: A vehicle interior board which is thin, lightweight, has high strength, has less degradation, peeling and the like near an end portion of a metal plate, and has high quality and excellent productivity; and a method for manufacturing the same. The vehicle interior board includes a pair of metal plates and a foamed polyurethane layer formed between the pair of metal plates. A projecting ridge projecting outwardly and extending in a predetermined direction along the outer surface is formed on an outer surface of the metal plate. Thus, it is possible to obtain desired strength and rigidity even when the metal plates or the foamed polyurethane layer are thinned or when a lightweight aluminum plate or the like is adopted as the metal plates. Therefore, it is possible to reduce weight of a vehicle interior board.
    Type: Application
    Filed: August 3, 2017
    Publication date: May 14, 2020
    Applicant: MORIDEN Co., Ltd.
    Inventors: Junichi ISHII, Masahiro KONDOU, Takumi ONO, Yoshihisa TOKUTOMI
  • Patent number: 10512199
    Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: December 17, 2019
    Assignees: DENSO CORPORATION, TOKIN CORPORATION
    Inventors: Naoki Hirasawa, Ryota Tanabe, Takashi Kawashima, Takashi Yanbe, Masahiro Kondou
  • Publication number: 20180070480
    Abstract: A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.
    Type: Application
    Filed: September 5, 2017
    Publication date: March 8, 2018
    Applicants: DENSO CORPORATION, TOKIN CORPORATION
    Inventors: Naoki HIRASAWA, Ryota TANABE, Takashi KAWASHIMA, Takashi YANBE, Masahiro KONDOU
  • Patent number: 9658525
    Abstract: The purpose of the present invention is to provide a pellicle which has, on the inner surface of the pellicle frame, a pressure-sensitive adhesive layer that has holding performance capable of satisfactorily adhering suspended substances including dust thereto and that has excellent resistance to short-wavelength light. This pellicle comprises a pellicle frame, a pellicle film stretched over the pellicle frame, and a pressure-sensitive adhesive layer disposed inside the pellicle frame, wherein the pressure-sensitive adhesive layer comprises a copolymer having structural units represented by formula (1) and structural units represented by formula (2), the amount of the copolymer being 60 mass % or more of the pressure-sensitive adhesive layer.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: May 23, 2017
    Assignee: MITSUI CHEMICALS INC.
    Inventors: Masahiro Kondou, Takamasa Tsumoto
  • Publication number: 20150212404
    Abstract: The purpose of the present invention is to provide a pellicle which has, on the inner surface of the pellicle frame, a pressure-sensitive adhesive layer that has holding performance capable of satisfactorily adhering suspended substances including dust thereto and that has excellent resistance to short-wavelength light. This pellicle comprises a pellicle frame, a pellicle film stretched over the pellicle frame, and a pressure-sensitive adhesive layer disposed inside the pellicle frame, wherein the pressure-sensitive adhesive layer comprises a copolymer having structural units represented by formula (1) and structural units represented by formula (2), the amount of the copolymer being 60 mass % or more of the pressure-sensitive adhesive layer.
    Type: Application
    Filed: July 31, 2013
    Publication date: July 30, 2015
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Masahiro Kondou, Takamasa Tsumoto
  • Patent number: 7692048
    Abstract: The present invention provides a method for producing a fluorine-containing halide, comprising reacting a fluorine-containing sulfonyl halide or fluorine-containing disulfonyl chloride with a metal halide or metal component in the present or absence of a solvent. In accordance with the present invention, a fluorine-containing bromide, fluorine-containing iodide or fluorine-containing chloride can be readily produced in high yield at low cost, using an industrially advantageous process.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: April 6, 2010
    Assignee: Daikin Industries, Ltd.
    Inventors: Akinari Sugiyama, Kazuyoshi Ichihara, Noriyuki Shinoki, Toshiya Mantani, Masahiro Kondou
  • Publication number: 20090042107
    Abstract: A pellicle that is used in a semiconductor lithography process and that can be used in an exposure device with an optical system having a numerical aperture of 1.0 or above, is provided. The pellicle of the present invention uses a pellicle film that has had its film thickness adjusted so as to exhibit transmittance of 95% or above at angles of incidence of exposure light with respect to the pellicle film in the range of from 0° to 20°. By using the pellicle of the present invention, it is possible to produce a semiconductor having an unprecedented fine circuit pattern at good yield while preventing adherence of dust to a reticle.
    Type: Application
    Filed: January 30, 2007
    Publication date: February 12, 2009
    Applicant: Mitsui Chemicals Inc.
    Inventors: Masahiro Kondou, Toshihiko Nakano
  • Patent number: 7423174
    Abstract: The present invention provides a process for selectively separating HF and like acids present along with water-unstable organic acid fluorides. In particular, the invention provides a process for separating an acid from a system in which the acid and an organic acid fluoride are present, the organic acid fluoride being represented by formula (I): RCOF??(I) wherein R is a fluorine atom; a C1-20 linear, branched or cyclic alkyl or halogenated alkyl group that may contain a heteroatom; or a C6-20 aryl or halogenated aryl group that may contain a heteroatom; the process comprising using as a deacidifying agent an aromatic heterocyclic compound having a boiling point of at least 50° C. and having one or more nitrogen atoms as heteroatom.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: September 9, 2008
    Assignee: Daikin Industries, Ltd.
    Inventors: Masaki Irie, Masahiro Kondou
  • Patent number: 7348386
    Abstract: The present invention relates to a method for producing a fluorocopolymer which comprises a polymerization reaction of a fluorine-containing ethylenic monomer with a fluorovinyl ether derivative represented by the following general formula (I): CF2?CF—O—[CF2CF(CF3)O]n—(CF2)m-A??(I) (wherein n represents an integer of 0 to 3, m represents an integer of 1 to 5, and A represents —SO2X or —COOY; X represents a halogen atom or —NR1R2; R1 and R2 are the same or different and each represents a hydrogen atom, an alkali metal, an alkyl group or a sulfonyl-containing group and Y represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms) to give a fluorocopolymer, said fluorine-containing ethylenic monomer being a perhaloethylenic monomer represented by the following general formula (II): CF2?CF—Rf1??(II) (wherein Rf1 represents a fluorine atom, a chlorine atom, Rf2 or ORf2; Rf2 represents a straight or branched perfluoroalkyl group having 1 to 9 carbon atoms, which may have an ether oxygen atom(s)) a
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: March 25, 2008
    Assignee: Daikin Industries, Ltd.
    Inventors: Takuya Arase, Masahiro Kondou, Kenji Ishii, Tadaharu Isaka
  • Publication number: 20080004473
    Abstract: The present invention provides a method of producing a fluorine-containing fluorosulfonylalkyl vinyl ether represented by the formula CF2=CFOCF2CF2SO2F, the method comprising reacting a fluorine-containing chlorosulfonylalkyl vinyl ether represented by the formula CF2=CFOCF2CF2SO2Cl with a fluorinating agent represented by the formula KF·(HF)n (wherein n is 0 to 5) in a polar organic solvent at a temperature not higher than 70° C. The method of the invention produces the fluorine-containing fluorosulfonylalkyl vinyl ether in high yield at low cost in a simple, industrially advantageous manner.
    Type: Application
    Filed: October 28, 2005
    Publication date: January 3, 2008
    Inventors: Akinari Sugiyama, Kazuyoshi Ichihara, Noriyuki Shinoki, Toshiya Mantani, Masahiro Kondou
  • Publication number: 20070185355
    Abstract: The present invention provides a method for producing a fluorine-containing halide, comprising reacting a fluorine-containing sulfonyl halide or fluorine-containing disulfonyl chloride with a metal halide or metal component in the present or absence of a solvent. In accordance with the present invention, a fluorine-containing bromide, fluorine-containing iodide or fluorine-containing chloride can be readily produced in high yield at low cost, using an industrially advantageous process.
    Type: Application
    Filed: March 11, 2005
    Publication date: August 9, 2007
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Akinari Sugiyama, Kazuyoshi Ichihara, Noriyuki Shinoki, Toshiya Mantani, Masahiro Kondou
  • Publication number: 20060257754
    Abstract: The present invention provides a pellicle, wherein a peel strength is from 0.004 N/mm to 0.10 N/mm when a non-surface-treated polyethylene terephthalate film having a thickness of 125 ?m is peeled in a direction of 180 degrees at a temperature of 23° C. after the polyethylene terephthalate film has been adhered to the mask adhering surface of the pellicle.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 16, 2006
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Katsuaki Harubayashi, Minoru Fujita, Masahiro Kondou, Yoshihisa Saimoto