Abstract: A substrate (120) includes a base (100) made of a metal material, a thermally conductive, light-reflective ceramic insulating layer (150), and a buffer layer (250) formed between the base (100) and the ceramic insulating layer (150) and having a smaller linear expansion coefficient than the base (100).

Abstract: There is provided a substrate excellent in high reflectance, high heat dissipation, withstand voltage property, and thermal and light stability. A substrate (5) includes an aluminum base (10), a reflective layer (17) which is formed between the aluminum base (10) and an electrode pattern (20) for electrical connection with a light emitting element to contain ceramic and reflects light from the light emitting element, and an intermediate layer (16) containing resin and having high thermal conductibility which is formed to reinforce withstand voltage performance of the reflective layer (17).

Abstract: In order to provide a substrate for light emitting devices having high heat radiating properties, dielectric strength voltage properties, light reflectivity, and excellent mass productivity, a substrate (5) includes an intermediate layer (11) containing ceramic which is formed on the surface of the aluminum base (10) by using an aerosol deposition method.

Abstract: A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Abstract: By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Abstract: A substrate (5A) includes an aluminum substrate body (10), a reflection layer (12) that is formed between an electrode pattern (20) which obtains electrical connection with a light emitting element (6) and the aluminum substrate body (10) and that contains first ceramics which reflect light from the light emitting element (6), and an intermediate layer (11) that contains second ceramics which are formed by thermal spraying and reinforces dielectric strength performance of the reflection layer (12).

Abstract: By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Abstract: Provided is a substrate for a light emitting device having high reflectivity, high heat radiating properties, dielectric strength voltage properties, long-term reliability including heat resistance and light resistance, and excellent mass productivity. A substrate (20) for a light emitting device includes: a first insulating layer (11) having thermal conductivity which is formed on a surface of one side of a metal base (2); a wiring pattern (3) which is formed on the first insulating layer (11); and a second insulating layer (12) having light reflectivity which is formed on the first insulating layer (11) and on some parts of the wiring pattern (3), so that some parts of the wiring pattern (3) are exposed, in which the first insulating layer (11) is a layer of ceramic formed by thermal spraying.

Abstract: A fluorescent material-containing sealing resin (20) production method of the present invention includes: a kneading step of kneading a powder mixture (24), which has been obtained by mixing a powder of silicone resins (21) and a powder of fluorescent materials (22) together, while melting the powder mixture (24) by heat, so that a kneaded mixture (25) is obtained; and an extruding step of extruding the kneaded mixture (25) in a form of a cord from an output port (37b) of a twin screw extruder (37).

Abstract: A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.

Abstract: In a light-emitting device substrate (2), a light reflecting surface covered with an anodized aluminum layer (12) is formed on one side of a base (14), and a glass-based insulator layer (11) and electrode patterns (5-6) disposed on the first insulating layer (11) are formed on the one side of the base (14) in a region not covered with the anodized aluminum layer (12). A glass-based insulator layer (13) is formed at least on the other side of the base (14) that is opposite the one side of the base (14). Therefore, a light-emitting device substrate having high reflectivity, high heat dissipation capability, dielectric withstand capability, and long-term reliability and excellent in mass productivity can be realized.

Abstract: A high heat dissipation effect and a high light utilization efficiency are realized. A substrate for a light emitting device includes an aluminum substrate (1), a high heat dissipation ceramic layer (2) disposed on the aluminum substrate (1), an etching frame (3) disposed on the high heat dissipation ceramic layer (2), and a highly reflective ceramic layer (4) disposed on the high heat dissipation ceramic layer (2) and the etching frame (3).

Abstract: A fluorescent material-containing sealing resin (20) production method of the present invention includes: a kneading step of kneading a powder mixture (24), which has been obtained by mixing a powder of silicone resins (21) and a powder of fluorescent materials (22) together, while melting the powder mixture (24) by heat, so that a kneaded mixture (25) is obtained; and an extruding step of extruding the kneaded mixture (25) in a form of a cord from an output port (37b) of a twin screw extruder (37).

Abstract: A substrate (5) in which a surface of an aluminum base (10) other than a surface on which an insulating thin film layer (17) is formed is covered with a protective layer (19) which is an aluminum anodic oxide film.

Abstract: A lighting reflector 10 includes a base member 11, made of metal, having an inner circumferential surface 13a expanding toward a light exit aperture 14 open at an end in an axial direction. A thin-film layer 17 which is formed from a thin film containing ceramic and which scatters light is placed on an end portion of the inner circumferential surface 13a that is on the opposite side to the light exit aperture 14.

Abstract: A ceramic insulating film (150) having a heat conducting property and a light reflecting property is formed on a front surface of a substrate (100), and a light emitting element (110) is provided on the ceramic insulating film. This makes it possible to improve a heat dissipation characteristic and a light utilization efficiency of a light emitting apparatus (10) having the light emitting element (101) provided on the substrate (110).

Abstract: By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.

Abstract: A method for manufacturing a light-emitting device of the present invention includes a step in which solid-state sealing resin (17) containing a phosphor (18) and the solid-state sealing resin (17) containing a phosphor (19) are arranged in recesses in package resin (14) having LED chips placed thereon, are thereafter melted by heating, and, in addition, are cured by heating.

Abstract: An open reel (1) according to the present invention includes a reel (30) and a phosphor-containing resin (20) in the form of a cord wound around the reel (30).

Abstract: A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.