Abstract: A semiconductor light-emitting element includes: a semiconductor stack including an n-type layer and a p-type layer and having at least one n exposure portion being a recess where the n-type layer is exposed; a p wiring electrode layer on the p-type layer; an insulating layer (i) continuously covering inner lateral surfaces of at least one n exposure portion and part of a top surface of the p wiring electrode layer and (ii) having an opening portion that exposes the n-type layer; an n wiring electrode layer disposed above the p-type layer and the p wiring electrode layer and in contact with the n-type layer in the opening portion; and at least one first n connecting member connected to the n wiring electrode layer in at least one first n terminal region. The n wiring electrode layer and the p-type layer are disposed below at least one first n terminal region.

Abstract: In a screw compressor, on a bearing side relative to a discharge port of a compression chamber in a casing, an intermediate-pressure chamber to which an intermediate-pressure coolant is supplied from outside of the casing is provided in a high-pressure space surrounded by an outer cylinder and an intermediate cylinder of the casing and communicating with the discharge port, and the intermediate-pressure coolant has a temperature and a pressure that are lower than those of a coolant in the high-pressure space and higher than a coolant in a low-pressure space on a motor side relative to the discharge port in the casing. The intermediate-pressure chamber and the low-pressure space communicate with each other.

Abstract: An information processing device includes an acquisition unit that acquires mobile object information, parcel information, pickup delivery information as information regarding at least one of pickup and delivery, map information, weather information, and traffic information, a calculation control unit that calculates a delivery company burden, as a cost defrayment by a delivery company, in regard to each combination of target parcels and a mobile object by using the mobile object information, the parcel information, the pickup delivery information, the map information, the weather information and the traffic information, a determination unit that determines an optimum combination out of a plurality of combinations based on the delivery company burden calculated in regard to each combination of target parcels and a mobile object, and an output unit that outputs the optimum combination.

Abstract: An object of the present invention is to provide a heat storage composition excellent in slow flame retardance and a heat storage member excellent in the slow flame retardance. Another object of the present invention is to provide an electronic device including a heat storage member, and a manufacturing method of a heat storage member. The heat storage composition according to an embodiment of the present invention contains a heat storage material and a flame retardant, in which a specific condition A is satisfied. The heat storage member according to an embodiment of the present invention contains a heat storage material and a flame retardant, in which a specific condition C is satisfied.

Abstract: The present invention is a thermosetting silicon-containing material containing one or more of a repeating unit shown by the following general formula (Sx-1), a repeating unit shown by the following general formula (Sx-2), and a partial structure shown by the following general formula (Sx-3): where R1 represents an iodine-containing organic group; and R2 and R3 are each independently identical to R1, a hydrogen atom, or a monovalent organic group having 1 to 30 carbon atoms. This provides: a thermosetting silicon-containing material used for forming a resist underlayer film which is capable of contributing to sensitivity enhancement of an upper layer resist while keeping LWR thereof from degrading; a composition for forming a silicon-containing resist underlayer film, the composition containing the thermosetting silicon-containing material; and a patterning process using the composition.

Abstract: There is disclosed a thermosetting resin injection molding machine comprising: a heating cylinder including a body having a device for introducing a resin material into said body, and a sleeve having an injection port for injecting the resin material; and a screw reciprocally movable in the heating cylinder, wherein the screw includes a body having a flight, and a piston portion provided at a front end of the screw body, and a diameter of the piston portion is smaller than a diameter of the flight; wherein an inner diameter of a working portion of the sleeve is smaller than an inner diameter of the heating cylinder body; wherein a length of the piston portion, a length of the working portion of the sleeve and an annular clearance between the working portion of the sleeve and the piston portion are so determined that a predetermined amount of the resin can remain for cushion molding at a front end of the piston portion during dwell after the injection of the resin material; and wherein a resin compressing port

Abstract: An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:(a) a bisphenol type epoxy resin or phenoxy resin having a weight average molecular weight of at least 10,000,(b) a bisphenol type epoxy resin having an epoxy equivalent of not more than 500, and(c) an epoxy resin curing agent, said insulating adhesive being excellent in storage stability in the form of a varnish or as coated on a copper foil, and when coated on an internal layer circuit board coated with an undercoating agent, being able to be well integrally cured with the undercoating agent.

Abstract: A process for producing a multilayer printed circuit board which comprises coating a light and heat curable undercoating agent on an internal layer circuit board, irradiating the undercoating agent with active energy beams to make the same tack-free, then laminating thereto a metal foil having an insulating adhesive layer and subsequently heating the resulting assembly to integrally cure the same. When the undercoating agent is coated on an internal layer circuit board and irradiated with a light to be made tack-free, and thereto is laminated a copper foil having a thermosetting insulating adhesive by a rigid roll or the like, the undercoating agent is softened or fluidized and the surface is smoothened. When the resulting laminate is thereafter heated, the undercoating agent coated on the internal layer circuit board and the insulating adhesive coated on the copper foil are integrally cured.

Abstract: An undercoating agent for a multilayer printed circuit board which comprises:(a) a normally solid epoxy resin having a softening point of 45.degree. to 120.degree. C.,(b) an epoxy resin curing agent,(c) a diluent in which the epoxy resin is dissolved and which consists of a photopolymerizable monomer, and(d) a photopolymerization initiator,said undercoating agent being effectively used in the production of a multilayer printed circuit board which utilizes making the undercoating agent tack-free by irradiation with active energy beams and the main curing of the undercoating agent by heating.