Abstract: In a position detecting apparatus, according to this invention, a convexly and concavely patterned wafer mark is imaged on an image pickup surface via an imaging optical system, and the image on the image pickup surface is detected. The position detecting apparatus defocuses the average surface of the wafer mark from the optimum focusing surface depending on the pitch and difference in level of the wafer mark, etc., in the direction of the optical axis of the imaging optical system, and varies an illumination .sigma. value definded as the ratio of the numerical aperture of the illumination optical system and the numerical aperture of the imaging optical system. Then the position detecting apparatus provides lights from the wafer mark to the image pickup surface with rotation-symmetric wave aberration to allow the resulting image to have the highest contrast for positional detection.

Abstract: The present invention relates to inspection apparatus and method in which, based on images under a plurality of focus conditions formed by way of an optical system to be inspected, namely, using images under a plurality of defocal conditions, tendency in positional change or change of asymmetry between the images is calculated so as to specify at least one of aberration condition and optical adjustment condition of the optical system to be inspected as well as to exposure apparatuses and overlay accuracy measurement apparatuses provided with the inspection apparatus. In addition, the present invention relates to an image-forming optical system suitable to an alignment apparatus which is applicable to the exposure apparatuses.

Abstract: A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; e transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting subs

Abstract: A document conveying apparatus for a document processor has a pair of width restriction members for correctly positioning documents to be processed. The width restriction members are movable in the width direction of the document processor. First and second rack-and-pinion mechanisms are spaced apart in the document conveying direction and are interlocked so that the racks of both mechanisms move together in a synchronized manner. Each width restriction member is coupled to two of the racks that move in the same direction.

Abstract: A document conveying apparatus has a document pushing-down/adjusting mechanism disposed at an upper position on the downstream side of a document discharge port. The document pushing-down/adjusting mechanism acts on the rear end of the document on delivery after its rear end is substantially liberated from being nipped by a pair of document discharge rollers, forcibly pushes the rear end of the document down toward the upstream end position on the document-placing plate means, and holds the document for the document-placing plate means for a predetermined period of time.

Abstract: A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; a transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting subs

Abstract: A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel. 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.

Abstract: A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated

Abstract: A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated

Abstract: A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel, 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness, wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.

Abstract: A light exposure system is for exposure of a pattern on a first object to form an image thereof on a second object, which comprises an illumination optical system for illuminating the first object, a projection optical system for projecting the pattern on the first object onto the second object, a stage device for two-dimensionally moving the second object while holding the second object, a reference member mounted on the stage device, a detecting device for detecting light from the reference member, and a measuring device for carrying out a predetermined measurement, based on an output of the detecting device.

Abstract: Disclosed is a method of making a huge elongated space of square or rectangular cross section under the ground. The outer shell of the huge elongated space is built in the form of integral arrangement of lateral shell-units having shielded passages therein. Such a huge underground space can be made without requiring any large-scale equipments on the ground. The huge outer shell can be made with accuracy and efficiency by skiving and jointing adjacent parallel lateral shell-units and by using selected lateral passage of shell-units to discharge the soil or mud removed in making the underground space.

Abstract: A projection exposure apparatus comprises a projection optical system for forming an image of a predetermined pattern on a mask onto a photosensitive substrate under exposure light having a first wavelength, an illumination system for illuminating a mask on the photosensitive substrate with light having a second wavelength different from the first wavelength through the projection optical system so as to attain alignment, and a detection system for detecting light reflected by the mark. The illumination system comprises a light source for emitting the light having the second wavelength, a first field stop for defining an illumination field on the photosensitive substrate and a second field stop for defining an illumination field on the photosensitive substrate.

Abstract: An ink-jet recording sheet that contains as main ingredients 69-95% wood pulp and 4-30 wt % precipitated calcium carbonate and which has a Stockigt sizing degree of 2-25 seconds as measured for a basis weight of 64 g/m.sup.2, or a Stockigt sizing degree ranging from 5.times.(basis weight/64).sup.2 to 25.times.(basis weight/64).sup.2 at a water extracting pH of 4.5-7.5. This sheet allows a clear color to develop and provides an image having circular dots and sharply defined edges. This sheet may also incorporate a cationic synthetic polymer and an alkylketene dimer.

Abstract: A dyeing method for dyeing plastic lenses or the like employed as lenses for eye glasses and exhibiting excellent dyeability. The lens is dipped into a dyeing solution while being moved by a combination of a small-amplitude short-cycle time up and down reciprocating motion superimposed on a large-amplitude long-cycle time up and down reciprocating motion. The lens is minutely oscillated according to the small-amplitude short-cycle time up and down reciprocating motion while being periodically moved up and down in the dyeing solution according to the large-amplitude long-cycle time up and down reciprocating motion. The lowest position of the lens obtained by the large-amplitude long-cycle time up and down reciprocating motion is raised gradually. Also disclosed is a dyeing apparatus which is used to carry out that dyeing method.

Abstract: An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.

Abstract: An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.

Abstract: An illumination optical apparatus includes secondary light source forming means for forming a plurality of light source images from collimated light beams emitted from a light source, tertiary light source forming means arranged midway along an optical path from the secondary light source forming means, and a condenser lens arranged midway along an optical path from the tertiary light source forming means. The secondary light source forming means includes an optical integrator having entrance and exit surface. A plurality lens surface having a larger focal length than a distance between the entrance and exit surfaces are formed on the entrance sarfaces. Thus, a plurality of secondary light source images are formed by the secondary light source forming means in a space behind the exit surface of the optical integrator.

Abstract: An ink jet recording sheet includes a sheet-like substrate composed mainly of 70 to 100 wt % of wood pulp and 0 to 30 wt % of precipitated calcium carbonate and having a Stockigt sizing degree of not less than 2 seconds and not more than 25 seconds when formed into a sheet having a basis weight of 64 g/m.sup.2, and a coating layer composed mainly of white pigment, with the coating layer being formed on at least one side of the substrate at a weight of 1 to 10 g/m.sup.2. This sheet has a high ink absorption rate and is able to develop bright colors and sharp images.

Abstract: Image sensor wherein there are provided a charge storage type photoelectric conversion section and a drive circuit including an integrated circuit on a substrate, and with these being connected by conductive strips, characterized in that capacitance adjustment conductive strips extend from the drive circuit section, and are arranged so as to pass underneath or close to the photoelectric conversion section and reduce variations in stray capacitances in the conductive strips.