Abstract: A connector comprises a dielectric block (20) having an inner cover section (23) having a length smaller than the diameter of a cylindrical section (31) of an outer conductor (30). The height of a connection section (12) of a terminal (10) placed on the top face (25) of the dielectric block (200 is smaller than the diameter of a dielectric member (C2) of a cable. An annular space (2) is formed between the cylindrical section (31) and the body section (21) to receive the contact section of a mating connector. The annular space communicates with the cable accommodation space of the connector, and the cable (C) is exposed to the annular space.

Abstract: A connector comprises a dielectric block (20) having an inner cover section (23) having a length smaller than the diameter of a cylindrical section (31) of an outer conductor (30). The height of a connection section (12) of a terminal (10) placed on the top face (25) of the dielectric block (200 is smaller than the diameter of a dielectric member (C2) of a cable. An annular space (2) is formed between the cylindrical section (31) and the body section (21) to receive the contact section of a mating connector. The annular space communicates with the cable accommodation space of the connector, and the cable (C) is exposed to the annular space.

Abstract: A pharmaceutical composition which comprises an insulin sensitizer in combination with an anorectic, which is useful as an agent for preventing or treating diabetes.

Abstract: A pharmaceutical composition which comprises an insulin sensitizer in combination with an anorectic, which is useful as an agent for preventing or treating diabetes.

Abstract: A PC card (1) includes a plate-like body having a front face (2) and at least one side face (4) extending in a card insertion direction; a plurality of signal contact elements (3) provided at the front face (2) for coupling to (10) a connector; and at least one signal connection member (6) provided on the side face (4) for receiving and sending signals from and to a movable external signal connection member (15). The external signal connection member is mounted on a guide track (11), biased by a spring (22) and may include a pin (21) for engaging a retaining hole (7) in the card (1). The connection external member is movable out of the path of the card (1) by use of moving lever (31) having a cam section (37), a swinging lever (71), FIG. 9, or a cam member (85) that is actuatable by a card removing lever (81), FIG. 11.

Abstract: Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two-component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.

Abstract: The invention provides: 1) a dispersion-type resin composition including polymer particles insoluble in an organic solvent, the resin composition being prepared by polymerizing a radically polymerizable unsaturated monomer in the organic solvent in the presence of a fluorine-type resin containing silane group and epoxy group; 2) a resin composition including polymer particles insoluble in an organic solvent, the resin composition being prepared by polymerizing a radically polymerizable unsaturated monomer in the organic solvent in the presence of a dispersion stabilizer comprising at least one of a component (I) having silane group, and a component (II) having epoxy group, at least one of components (I) and (II) being a fluorine-containing resin; 3) a curable composition including one of the resin compositions 1) and 2) and a metal chelate compound; and 4) a coating composition including one of the curable composition and the resin compositions.

Abstract: Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two-component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.

Abstract: The invention provides:1) a fluorine-containing resin composition including:a) a fluorine-containing resin having (i) a hydrolyzable group attached directly to a silicon atom and/or a silanol group and (ii) an epoxy group in the molecule, orb) a mixture of a component (I) having a hydrolyzable group attached directly to a silicon atom and/or a silanol group and a component (II) having an epoxy group, such that at least one of the components (I) and (II) is a fluorine-containing resin;2) a curable composition including the resin composition and a metal chelate compound; and3) a coating composition including this resin composition or this curable composition.

Abstract: Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.

Abstract: Disclosed are:1) a three-component resin composition comprising a hydroxyl group-containing compound (A), an epoxy group-containing compound (B) and a silane group-containing compound (C);2) a two-component resin composition comprising a hydroxyl group-containing compound (A) and silane group- and epoxy group-containing compound (D);3) a two-component resin composition comprising hydroxyl group- and silane group-containing compound (E) and epoxy group-containing compound (B); and4) two-component resin composition comprising hydroxyl group- and epoxy group-containing compound (F) and silane group-containing compound (C); wherein at least one of the components in each of the resin compositions 1) to 4) is (are) fluorine-containing resin;5) a curable composition comprising one of the resin compositions 1) to 4) and a metal chelate compound as curing catalyst; and6) coating compositions comprising such curing composition and when required a pigment.

Abstract: The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.

Abstract: This invention is directed to a semiconductor device comprised of a body of semiconductor material having at least one p-n junction terminating at an exposed surface of the body. The p-n junction is passivated at its termination point by a first, thin glass layer and a second glass layer disposed over the first thin glass layer. The second glass layer is thicker than the first glass layer and includes a predetermined amount of a suitable filler material.