Abstract: Semiconductor devices including active regions and gate electrodes are disclosed. An example semiconductor device according to the disclosure includes a gate electrode extending in a first direction, and first and second active regions extending in a second direction. The gate electrode has a side extending in the first direction. The first active region includes: a first center portion having a first width in the first direction; and a first end portion disposed at a first end of the first center portion, and having a second width in the first direction that is greater than the first width. The second active region includes: a second center portion having a third width in the first direction. The gate electrode overlaps along the side with portions of the first end portion and the second center portion.

Abstract: A tactile sensor, including: a contact part (1), configured to receive pressure transmitted when a manipulator grabs a target object, and transmit the pressure to a sensing part (2); the sensing part (2), located on one side of the contact part, the sensing part (2) moving in a direction away from the contact part (1) under an action of the pressure; and a detection part (4), located on a side of the sensing part (2) away from the contact part (1), the detection part (4) sensing a position change of the sensing part (2) to generate a sensing signal, wherein the sensing signal is configured to determine a contact parameter between the manipulator and the target object.

Abstract: In some examples, a subword driver block of a memory device includes a plurality of active regions of a first type and a plurality of active regions of a second type adjacent to the plurality of active regions of the first type. The subword driver block further includes a plurality of first gate electrodes overlapping with the plurality of active regions of the first type to form a plurality of first transistors, and a plurality of second gate electrodes overlapping with the plurality of active regions of the first type to form a plurality of second transistors. Each of the second transistors is shared by a first subword driver and a second subword driver. Each of the second transistors may include a drain and a source respectively coupled to a first and second word line, which are driven by the first subword driver and the second subword driver, respectively.

Abstract: Semiconductor devices including active regions and gate electrodes are disclosed. An example semiconductor device according to the disclosure includes a gate electrode extending in a first direction, and first and second active regions extending in a second direction. The gate electrode has a side extending in the first direction. The first active region includes: a first center portion having a first width in the first direction; and a first end portion disposed at a first end of the first center portion, and having a second width in the first direction that is greater than the first width. The second active region includes: a second center portion having a third width in the first direction. The gate electrode overlaps along the side with portions of the first end portion and the second center portion.

Abstract: In some examples, a subword driver block of a memory device includes a plurality of active regions of a first type and a plurality of active regions of a second type adjacent to the plurality of active regions of the first type. The subword driver block further includes a plurality of first gate electrodes overlapping with the plurality of active regions of the first type to form a plurality of first transistors, and a plurality of second gate electrodes overlapping with the plurality of active regions of the first type to form a plurality of second transistors. Each of the second transistors is shared by a first subword driver and a second subword driver. Each of the second transistors may include a drain and a source respectively coupled to a first and second word line, which are driven by the first subword driver and the second subword driver, respectively.

Abstract: Some embodiments include an integrated assembly with a semiconductor base having a horizontally-extending upper surface, and having a recessed region. A transistor gate is supported by the semiconductor base. The transistor gate has a first segment over the horizontally-extending upper surface, and has a second segment over the recessed region. The first segment has a first vertically-extending surface along an outer edge. The second segment has a ledge along an edge of the recessed region. The ledge has an upper surface which is lower than the horizontally-extending upper surface. The second segment has a second vertically-extending surface extending upwardly from an inner portion of the ledge. A first spacer is along the first vertically-extending surface. A second spacer is along the second vertically-extending surface. The second spacer has a bottom edge beneath the horizontally-extending upper surface of the base.

Abstract: Some embodiments include an integrated assembly with a semiconductor base having a horizontally-extending upper surface, and having a recessed region. A transistor gate is supported by the semiconductor base. The transistor gate has a first segment over the horizontally-extending upper surface, and has a second segment over the recessed region. The first segment has a first vertically-extending surface along an outer edge. The second segment has a ledge along an edge of the recessed region. The ledge has an upper surface which is lower than the horizontally-extending upper surface. The second segment has a second vertically-extending surface extending upwardly from an inner portion of the ledge. A first spacer is along the first vertically-extending surface. A second spacer is along the second vertically-extending surface. The second spacer has a bottom edge beneath the horizontally-extending upper surface of the base.

Abstract: A photoelectric conversion device in which a parasitic capacitance between an optical signal common output line for commonly transmitting an optical signal and a control signal line and a parasitic capacitance between an initial voltage common output line for commonly transmitting an initial voltage and the control signal line in a plurality of photoelectric conversion units are substantially equal is provided. The control signal line is arranged so that the length of the wiring part of the control signal line in parallel with the optical signal common output line and the length of the wiring part of the control signal line in parallel with the initial voltage common output line are substantially equal and the distance between the control signal line and the optical signal common output line and the distance between the control signal line and the initial voltage common output line are substantially equal.

Abstract: In one embodiment, a first insulating film is formed with a recess portion left therein in a contact hole, and the contact hole is surrounded by a first line pattern and a second line pattern, the first line pattern and the second line pattern having different heights. The recess portion is filled so as to form a first mask film, and the first insulating film except for the recess portion is etched back so as to be removed, thereby forming a second contact hole. After that, a conductive material is implanted in the second contact hole, and the top surface of the first line pattern having a low height is exposed, thereby forming a contact plug.

Abstract: This method for manufacturing a semiconductor device comprises: a step for forming a first groove (51) that extends in a prescribed direction in a first insulating layer (25) on a semiconductor substrate (1); a step for forming an electrically conductive embedded layer (127) in the first groove; a step for forming a first and second plug (27b, 27c) by dividing the embedded layer in a prescribed direction; a step for forming a first conductive film (55), having lower resistance than the embedded layer, on the exposed side surfaces of the first and second plugs; a step for embedding a second insulating layer (29) in a second groove that is located between the first conductive films of the first and second plugs; and a step for forming a second conductive film (37), having lower resistance than the embedded layer, on the exposed top surfaces of the first and second plugs.

Abstract: A photoelectric conversion device in which a parasitic capacitance between an optical signal common output line for commonly transmitting an optical signal and a control signal line and a parasitic capacitance between an initial voltage common output line for commonly transmitting an initial voltage and the control signal line in a plurality of photoelectric conversion units are substantially equal is provided. The control signal line is arranged so that the length of the wiring part of the control signal line in parallel with the optical signal common output line and the length of the wiring part of the control signal line in parallel with the initial voltage common output line are substantially equal and the distance between the control signal line and the optical signal common output line and the distance between the control signal line and the initial voltage common output line are substantially equal.

Abstract: A photoelectric converter has light receiving elements, amplifier circuits connected to respective outputs of the light receiving elements, reset circuits connected to respective outputs of some of the light receiving elements, and connection circuits connected between respective outputs of adjacent ones of the light receiving elements.

Abstract: The drift region for increasing the breakdown voltage in an LDMOSFET is regarded as a resistive element. The potential distribution of the overall device is calculated by obtaining a potential distribution considering the resistance by iterative calculation. A capacitance generated in the drift region is analytically calculated assuming a linear potential distribution. A capacitance generated in the overlap region between the gate electrode and the drift region is calculated by considering the potential from the depletion region to the accumulation region.

Abstract: A scanning circuit has path switches connected between a plurality of data flip-flop circuits of the scanning circuit for sequentially reading an output signal in synchronism with a clock. A plurality of control signal lines select the path switches to arbitrarily skip reading of the flip-flop circuits that do not require the scanning circuit and always fix a potential of the skipped data flip-flop circuit. Only the arbitrary data is read, and in the case where unnecessary data exists, reading is skipped, to thereby increase the read rate.

Abstract: Provided is a photoelectric conversion device for outputting an output voltage according to incident light, including photoelectric conversion unit for holding an optical charge generated by the incident light, a signal processing circuit impressed with a reference voltage for outputting the output voltage according to the incident light by applying a predetermined process to an output signal of the photoelectric conversion unit, and a switch provided between a terminal externally supplied with the reference voltage, and the signal processing circuit.

Abstract: Provided is an image sensor capable of outputting an image signal in accordance with a data loading position of a signal processing IC. In the image sensor that can arbitrarily select the start position of an output signal of a first photoelectric conversion element, a first input terminal of a scanning circuit of a photoelectric conversion circuit is connected to a selector circuit of a signal start position, and the selector circuit is controlled by a start signal through a start signal terminal and a delay circuit according to an external control signal.

Abstract: Provided is a photoelectric conversion device, including: a plurality of photoelectric conversion blocks each including a photoelectric conversion element, photoelectric conversion element resetting means for supplying an initialization potential to the photoelectric conversion element to reset the photoelectric conversion element, and transfer means for transferring a voltage of the photoelectric conversion element, in which the photoelectric conversion element resetting means resets the photoelectric conversion element every time the voltage of the photoelectric conversion element is transferred and for a standby period, during a reading period. Therefore, it is possible to perform accurate image reading by reducing the influence of a foreign matter adhered to a light receiving surface of a photoelectric conversion device.

Abstract: The drift region for increasing the breakdown voltage in an LDMOSFET is regarded as a resistive element. The potential distribution of the overall device is calculated by obtaining a potential distribution considering the resistance by iterative calculation. A capacitance generated in the drift region is analytically calculated assuming a linear potential distribution. A capacitance generated in the overlap region between the gate electrode and the drift region is calculated by considering the potential from the depletion region to the accumulation region.

Abstract: An image sensor has image sensor ICs mounted linearly thereon. Each of the image sensor ICs comprises a light receiving device circuit array having light receiving devices, a reset circuit device array, and a plurality of switches. The light receiving devices have output terminals that output output signals in accordance with an amount of light received. The reset circuit device array initializes the output terminals of the light receiving devices in an initialization mode. The switches drive the reset circuit device array and are configured to be maintained in a conductive state during an accumulation period so that an initialization potential is outputted by the output terminal of each of the light receiving devices of one of only a first one of the linear image sensor ICs, only a last one of the linear image sensor ICs, and all of the linear image sensor ICs.

Abstract: The present invention provides an image sensor capable of making waveforms of image signals, which are outputs from photoelectric converting elements, flat, and capable of acquiring image information in high precision. The image sensor includes: a plurality of photoelectric converting elements; a plurality of selecting switches provided in correspondence with the photoelectric converting elements; a scanning circuit for ON/OFF-controlling the selecting switches; a differential amplifier for amplifying a difference voltage between an electric signal entered from the photoelectric converting elements and a reference voltage; and a resistor electrically connected to two input terminals of the differential amplifier.