Patents by Inventor Masahito Ide
Masahito Ide has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230155034Abstract: A thin-film transistor element including a gate layer, an oxide semiconductor thin-film, a gate insulating film disposed between the gate layer and the oxide semiconductor thin-film, a pair of source-drain electrodes electrically connected to the oxide semiconductor thin-film, and a resin film covering the oxide semiconductor thin-film is provided. The oxide semiconductor thin-film contains two or more metal elements selected from indium, gallium, zinc, and tin. The resin film is in contact with the oxide semiconductor thin-film. The resin film may include a compound that contains a SiH group. The resin film may be formed by applying a composition including a SiH group-containing compound onto the oxide semiconductor thin-film, and heating the composition.Type: ApplicationFiled: January 20, 2023Publication date: May 18, 2023Applicant: KANEKA CORPORATIONInventors: Hirofumi Inari, Hiroshi Yoshimoto, Masahito Ide, Takao Manabe
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Publication number: 20210359276Abstract: The present disclosure is directed to a light-shielding colored resin layer formed on a substrate, and a patterned protective layer formed on the colored resin layer. By removing the colored resin layer exposed in an opening of the protective layer by dry etching, thereby patterning the colored resin layer, a partition wall in which the protective layer is provided on a patterned colored resin layer is formed. This partition wall partitions the display surface of an image display device into a plurality of regions; and an image display device is formed by filling spaces, which are partitioned by the partition wall, with a color developing material.Type: ApplicationFiled: September 5, 2019Publication date: November 18, 2021Applicant: KANEKA CORPORATIONInventors: Hirofumi Inari, Hiroshi Yoshimoto, Masahito Ide, Takao Manabe
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Patent number: 10976663Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.Type: GrantFiled: September 21, 2017Date of Patent: April 13, 2021Assignee: KANEKA CORPORATIONInventors: Hirofumi Inari, Susumu Amano, Aki Kitajima, Yoshikatsu Ichiryu, Masahito Ide, Takao Manabe
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Publication number: 20190235383Abstract: A photosensitive composition contains a polysiloxane compound, a photoacid generator, a coloring agent and a solvent. A content of the coloring agent with respect to a total solid content of the composition is 5% by weight or more. The polysiloxane compound contains a cyclic polysiloxane structure and a cationically polymerizable functional group. The polysiloxane compound may further have an alkali-soluble functional group. A content of the polysiloxane compound with respect to the total solid content of the composition is preferably 20-80% by weight. The photosensitive composition is used, for example, in formation of a colored pattern.Type: ApplicationFiled: September 21, 2017Publication date: August 1, 2019Applicant: KANEKA CORPORATIONInventors: Hirofumi INARI, Susumu AMANO, Aki KITAJIMA, Yoshikatsu ICHIRYU, Masahito IDE, Takao MANABE
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Patent number: 9588425Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.Type: GrantFiled: October 7, 2016Date of Patent: March 7, 2017Assignee: Kaneka CorporationInventors: Masahito Ide, Hirofumi Inari, Aki Kitajima, Komei Tahara, Takao Manabe
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Publication number: 20170023861Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.Type: ApplicationFiled: October 7, 2016Publication date: January 26, 2017Inventors: Masahito IDE, Hirofumi INARI, Aki KITAJIMA, Komei TAHARA, Takao MANABE
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Patent number: 9494861Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.Type: GrantFiled: July 2, 2013Date of Patent: November 15, 2016Assignee: KANEKA CORPORATIONInventors: Masahito Ide, Hirofumi Inari, Aki Kitajima, Komei Tahara, Takao Manabe
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Patent number: 9464172Abstract: An object of the present invention is to provide a polysiloxane compound that can be developed in an aqueous alkali solution and can yield a cured product or thin film having superior heat-resistant transparency and insulating properties, a curable composition thereof, and a thin film transistor provided with a passivation layer or gate insulator using the same, and the present invention relates to a polysiloxane compound having at least one photopolymerizable functional group in a molecule thereof, and having at least one member selected from the group consisting of an isocyanuric acid backbone structure, a phenolic hydroxyl group and a carboxyl group within the same molecule, to a curable composition containing the polysiloxane compound, and to a cured product thereof.Type: GrantFiled: December 5, 2008Date of Patent: October 11, 2016Assignee: Kaneka CorporationInventors: Masahito Ide, Takao Manabe, Makoto Seino
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Publication number: 20150192850Abstract: The present invention aims to provide positive photosensitive compositions that have excellent patterning properties and can exhibit excellent electrical insulation reliability when cured (as thin films). The positive photosensitive composition according to a first aspect of the present invention is characterized by including (A) a compound that contains an alkenyl group or a SiH group within a molecule and has a structure that decomposes in the presence of acid to generate an acidic group or a hydroxyl group; (B) a compound that contains a SiH group or an alkenyl group within a molecule; (C) a hydrosilylation catalyst; and (D) a photoacid generator.Type: ApplicationFiled: July 2, 2013Publication date: July 9, 2015Inventors: Masahito Ide, Hirofumi Inari, Aki Kitajima, Komei Tahara, Takao Manabe
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Patent number: 8809414Abstract: It is an object of the present invention to provide: a curable composition that has photocurability and provides a cured product excellent in insulating properties; and the cured product. This can be achieved by a photocurable composition that contains, as essential components, (A) a modified polyorganosiloxane compound having a photopolymerizable functional group and an SiH group, (B) a compound having a carbon-carbon double bond, and (C) a photopolymerization initiator. A thin film produced from the curable composition of the present invention has excellent insulating properties. Since the curable composition of the present invention can form a film by solution coating, it is applicable to provide thin-film insulating materials that can be formed by solution coating.Type: GrantFiled: September 30, 2009Date of Patent: August 19, 2014Assignee: Kaneka CorporationInventors: Masahito Ide, Takao Manabe
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Publication number: 20110237702Abstract: It is an object of the present invention to provide: a curable composition that has photocurability and provides a cured product excellent in insulating properties; and the cured product. This can be achieved by a photocurable composition that contains, as essential components, (A) a modified polyorganosiloxane compound having a photopolymerizable functional group and an SiH group, (B) a compound having a carbon-carbon double bond, and (C) a photopolymerization initiator. A thin film produced from the curable composition of the present invention has excellent insulating properties. Since the curable composition of the present invention can form a film by solution coating, it is applicable to provide thin-film insulating materials that can be formed by solution coating.Type: ApplicationFiled: September 30, 2009Publication date: September 29, 2011Applicant: KANEKA CORPORATIONInventors: Masahito Ide, Takao Manabe
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Publication number: 20110001190Abstract: An object of the present invention is to provide a polysiloxane compound that can be developed in an aqueous alkali solution and can yield a cured product or thin film having superior heat-resistant transparency and insulating properties, a curable composition thereof, and a thin film transistor provided with a passivation layer or gate insulator using the same, and the present invention relates to a polysiloxane compound having at least one photopolymerizable functional group in a molecule thereof, and having at least one member selected from the group consisting of an isocyanuric acid backbone structure, a phenolic hydroxyl group and a carboxyl group within the same molecule, to a curable composition containing the polysiloxane compound, and to a cured product thereof.Type: ApplicationFiled: December 5, 2008Publication date: January 6, 2011Applicant: KANEKA CORPORATIONInventors: Masahito Ide, Takao Manabe, Makoto Seino
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Patent number: 7785715Abstract: A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components or which contains a thermosetting resin and an inorganic member as essential components is provided. A curable composition and light-shielding paste comprising the composition are provided which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member. The curable composition can further contain (G) silica. Also provided is a method of forming a light-shielding resin layer on a LED package having an aperture comprising a bottom and sidewalls. The curable composition is excellent in light-shielding ability.Type: GrantFiled: February 25, 2004Date of Patent: August 31, 2010Assignees: Kaneka Corporation, Nichia CorporationInventors: Manabu Tsumura, Masahito Ide, Katsuya Ouchi, Masafumi Kuramoto, Tomohide Miki
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Patent number: 7371462Abstract: The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.Type: GrantFiled: April 23, 2003Date of Patent: May 13, 2008Assignee: Kaneka CorporationInventors: Manabu Tsumura, Masahito Ide, Katsuya Ouchi, Masafumi Kuramoto, Tomohide Miki, Ikuya Nii
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Publication number: 20060243947Abstract: The invention aims at providing A light-shielding paste which contains a thermoplastic resin and an inorganic member as essential components; A light-shielding paste which contains a thermosetting resin and an inorganic member as essential components; A curable composition which contains, as essential components, (A) an organic compound comprising an organic main chain containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, (E) a silanol condensation catalyst, and (F) an inorganic member; The above curable composition which further contains (G) silica; The above curable composition which shows such a flow leveling property that when the composition is allowed to stand on a glass substrate inclined at an angle of 80 degrees at 100° C.Type: ApplicationFiled: February 25, 2004Publication date: November 2, 2006Inventors: Manabu Tsumura, Masahito Ide, Katsuya Ouchi, Masafumi Kuramoto, Tomohide Miki
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Publication number: 20050209400Abstract: The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.Type: ApplicationFiled: April 23, 2003Publication date: September 22, 2005Inventors: Manabu Tsumura, Masahito Ide, Katsuya Ouchi, Masufumi Kuramoto, Tomohide Miki, Ikuya Nii