Patents by Inventor Masahito Ohkido

Masahito Ohkido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8273456
    Abstract: It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.
    Type: Grant
    Filed: October 3, 2007
    Date of Patent: September 25, 2012
    Assignee: Mitsubishi Gas Chemical Company, Inc
    Inventors: Masahito Ohkido, Wataru Ueno, Jitsuo Oishi, Shuta Kihara
  • Publication number: 20100029893
    Abstract: It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.
    Type: Application
    Filed: October 3, 2007
    Publication date: February 4, 2010
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Masahito Ohkido, Wataru Ueno, Jitsuo Oishi, Shuta Kihara
  • Publication number: 20090306306
    Abstract: Disclosed is a highly heat-resistant thermosetting polyimide resin composition having long pot life, which enables to obtain a cured product having flexibility and adhesiveness. The thermosetting polyimide resin composition can be obtained through the following steps (1)-(3). Step (1): A step wherein a polyimide (A) is synthesized by a thermal reaction by blending a tetracarboxylic acid component, which is composed of a tetracarboxylic acid dianhydride represented by the formula (1) and one or more compounds selected from tetracarboxylic acids represented by the formula (2) and derivatives of such tetracarboxylic acids, with an aliphatic diamine represented by the formula (3) in such a ratio that the mole number of the tetracarboxylic acid component is higher than the mole number of the aliphatic diamine. Step (2): A step wherein a polyimide (B) is synthesized by a thermal reaction by blending the polyimide (A) obtained in the step (1) with an aromatic diamine represented by the formula (4).
    Type: Application
    Filed: April 17, 2007
    Publication date: December 10, 2009
    Inventors: Masahito Ohkido, Wataru Ueno, Jitsuo Oishi, Shuta Kihara