Abstract: Alignment method and apparatus for aligning a cutting blade with a selected street on a semiconductor wafer. It has square chip areas defined by crossing streets and alignment spots formed on its surface. Two street lines with at least one street intervening therebetween are selected, and linear functions ƒ(x) and g(x) are determined on the basis of the coordinates of their alignment spots according to the least squares method. The linear functions ƒ(x) and g(x) run among the alignment spots at the closest distances thereto to represent the two selected streets. Another linear functions ƒ′(x) and g′(x) are determined by putting the linear functions f(x) and g(x) into parallelism with the X-axis.

Abstract: Alignment method and apparatus for aligning a cutting blade with a selected street on a semiconductor wafer. It has square chip areas defined by crossing streets and alignment spots formed on its surface. Two street lines with at least one street intervening therebetween are selected, and linear functions f(x) and g(x) are determined on the basis of the coordinates of their alignment spots according to the least squares method. The linear functions f(x) and g(x) run among the alignment spots at the closest distances thereto to represent the two selected streets. Another linear functions f′(x) and g′(x) are determined by putting the linear functions f(x) and g(x) into parallelism with the X-axis.

Abstract: An apparatus for cutting CSP plates into individual pellets to put them on carrier trays for transportation includes a jig rack for the storing of jigs for holding CSP plates. A taking-in and -out table takes a selected jig out from the jig rack to transport it to an area in which CSP plates are brought and laid. The apparatus also includes a cassette table on which a CSP plate cassette is put. The selected CSP plate is taken out from the cassette and is put on an associated jig, which is laid on the table. A first transport transports the CSP plate-and-jig combination from the taking-in and -out table to a working table. The CSP plate is cut with a cutting blade, while the CSP plate-and-jig combination is held on the working table. The CSP plate is cut into individual pellets. A second transport transports the jig holding the CSP plate from the working table to a washing table where the cut CSP plate-and-jig combination are washed.