Patents by Inventor Masakata Koseki
Masakata Koseki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9583682Abstract: A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a phosphor-containing film on the plurality of light-emitting elements directly or via a transparent adhesive layer, a transparent plate provided on the phosphor-containing film so as to directly contact the film, and a white reflector to cover a side surface of the plurality of light-emitting elements and, of side surfaces of the phosphor-containing film, at least a side surface not located above a gap between the plurality of light-emitting elements. At least a portion of a region directly above the gap is not covered with the phosphor-containing film.Type: GrantFiled: January 14, 2015Date of Patent: February 28, 2017Assignee: TOYODA GOSEI CO., LTD.Inventors: Satoshi Wada, Masakata Koseki
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Patent number: 9240537Abstract: The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a case formed of polycyclohexylene dimethylene terephthalate, and a sealant that is charged into the case to seal the LED chip. In the light emitting device, a stabilizer having a melting point that is higher than a junction temperature of the LED chip by 80° C. or more exists at a boundary surface between an inner wall surface of the case and the sealant or within 300 ?m of the boundary surface.Type: GrantFiled: November 7, 2013Date of Patent: January 19, 2016Assignee: TOYODA GOSEI CO., LTD.Inventors: Masakata Koseki, Yuichi Yano, Akio Namiki
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Publication number: 20150364657Abstract: A method of manufacturing a light-emitting device includes providing an LED chip mounted on a base substrate, and dripping a droplet of a phosphor-containing resin to cover the LED chip. The droplet is dot-printed on the base substrate and/or the LED chip by inkjet printing.Type: ApplicationFiled: May 28, 2015Publication date: December 17, 2015Inventors: Takashi NONOGAWA, Masakata KOSEKI, Kosei FUKUI, Toshimasa HAYASHI
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Patent number: 9123646Abstract: A light-emitting device includes a light-emitting element, and a sealing material for sealing the light-emitting element. The sealing material includes a first layer including a radical polymerizable resin and a second layer including a non-radical polymerizable resin, the first layer being in contact with the light-emitting element and the second layer covering an upper surface of the first layer.Type: GrantFiled: May 10, 2013Date of Patent: September 1, 2015Assignee: TOYODA GOSEI CO., LTD.Inventors: Masakata Koseki, Yuichi Yano
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Publication number: 20150207045Abstract: A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a phosphor-containing film on the plurality of light-emitting elements directly or via a transparent adhesive layer, a transparent plate provided on the phosphor-containing film so as to directly contact the film, and a white reflector to cover a side surface of the plurality of light-emitting elements and, of side surfaces of the phosphor-containing film, at least a side surface not located above a gap between the plurality of light-emitting elements. At least a portion of a region directly above the gap is not covered with the phosphor-containing film.Type: ApplicationFiled: January 14, 2015Publication date: July 23, 2015Inventors: Satoshi WADA, Masakata KOSEKI
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Patent number: 9024348Abstract: A light-emitting device includes an LED chip, and a case including a sidewall portion that surrounds the LED chip so as to reflect a light emitted from the LED chip. The case further includes a resin that includes a glass fiber and is integrally formed by injection molding. An average length of the glass fiber is greater than a thickness of the sidewall portion. The resin has a refractive index different from the glass fiber.Type: GrantFiled: June 18, 2013Date of Patent: May 5, 2015Assignee: Toyoda Gosei Co., Ltd.Inventors: Masakata Koseki, Makoto Sato
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Patent number: 9018659Abstract: A light-emitting device includes a light-emitting element mounted on a lead frame, and a sealing material sealing the light-emitting element and having a thickness of not more than 1 mm and including a silicone resin as a main component. The sealing material includes a first gas barrier layer that a physical property value obtained by dividing a difference between a value of an average spin-spin relaxation time of 1H nuclei at a resonance frequency of 25 MHz at 140° C. and that at 25° C. by 115 is not more than 3.5 and the average spin-spin relaxation time at 140° C. is not more than 500 ?sec.Type: GrantFiled: December 17, 2012Date of Patent: April 28, 2015Assignee: Toyoda Gosei Co., Ltd.Inventors: Masakata Koseki, Makoto Sato, Tomoko Suzuki, Takeshi Matsushima, Hiroyuki Tajima, Yuichi Yano
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Publication number: 20140131756Abstract: The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a case formed of polycyclohexylene dimethylene terephthalate, and a sealant that is charged into the case to seal the LED chip. In the light emitting device, a stabilizer having a melting point that is higher than a junction temperature of the LED chip by 80° C. or more exists at a boundary surface between an inner wall surface of the case and the sealant or within 300 ?m of the boundary surface.Type: ApplicationFiled: November 7, 2013Publication date: May 15, 2014Applicant: Toyoda Gosei Co., Ltd.Inventors: Masakata KOSEKI, Yuichi YANO, Akio NAMIKI
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Patent number: 8669584Abstract: A light emitting device, comprises a LED chip, and a case having an accommodating recession accommodating the LED chip, wherein the light emitting device emits light from an opening portion of the accommodating recession, the case is monolithically formed by injection molding of a resin composition preparing by mixing fine grains of specular reflection material and glass fibers as diffusion reflecting material as fillers therein, an inner surface of a side wall portion of the case works as a reflector that reflects the light emitted from the LED chip so that the light is output from the opening portion, and a thickness of the side wall portion is selected to be smaller than an average length of the glass fibers.Type: GrantFiled: August 16, 2012Date of Patent: March 11, 2014Assignee: Toyoda Gosei Co., Ltd.Inventors: Makoto Sato, Satoshi Ota, Masakata Koseki
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Publication number: 20140014993Abstract: A light-emitting device includes an LED chip, and a case including a sidewall portion that surrounds the LED chip so as to reflect a light emitted from the LED chip. The case further includes a resin that includes a glass fiber and is integrally formed by injection molding. An average length of the glass fiber is greater than a thickness of the sidewall portion. The resin has a refractive index different from the glass fiber.Type: ApplicationFiled: June 18, 2013Publication date: January 16, 2014Inventors: Masakata Koseki, Makato Sato
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Publication number: 20130320391Abstract: A light-emitting device includes a light-emitting element, and a sealing material for sealing the light-emitting element. The sealing material includes a first layer including a radical polymerizable resin and a second layer including a non-radical polymerizable resin, the first layer being in contact with the light-emitting element and the second layer covering an upper surface of the first layer.Type: ApplicationFiled: May 10, 2013Publication date: December 5, 2013Applicant: TOYODA GOSEI CO., LTD.Inventors: Masakata KOSEKI, Yuichi YANO
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Publication number: 20130077321Abstract: A light emitting device, comprises a LED chip, and a case having an accommodating recession accommodating the LED chip, wherein the light emitting device emits light from an opening portion of the accommodating recession, the case is monolithically formed by injection molding of a resin composition preparing by mixing fine grains of specular reflection material and glass fibers as diffusion reflecting material as fillers therein, an inner surface of a side wall portion of the case works as a reflector that reflects the light emitted from the LED chip so that the light is output from the opening portion, and a thickness of the side wall portion is selected to be smaller than an average length of the glass fibers.Type: ApplicationFiled: August 16, 2012Publication date: March 28, 2013Applicant: Toyoda Gosei Co., Ltd.Inventors: Makoto Sato, Satoshi Ota, Masakata Koseki
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Patent number: 8242524Abstract: A light emitting device includes a light emitting element, a sealing material for sealing the light emitting element, a first filler included in the sealing material, and a second filler included in the sealing material. The second filler includes a particle diameter smaller than that of the first filler.Type: GrantFiled: July 23, 2009Date of Patent: August 14, 2012Assignee: Toyoda Gosei Co., Ltd.Inventors: Masakata Koseki, Eiki Kawano
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Patent number: 7888699Abstract: A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.Type: GrantFiled: May 29, 2008Date of Patent: February 15, 2011Assignees: Kabushiki Kaisha Toshiba, Toyoda Gosei Co., Ltd.Inventors: Hiroaki Oshio, Kazuhiro Tamura, Masakata Koseki, Hiroko Tsukamoto, Tatsuichiro Maki
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Publication number: 20100025709Abstract: A light emitting device includes a light emitting element, a sealing material for sealing the light emitting element, a first filler included in the sealing material, and a second filler included in the sealing material. The second filler includes a particle diameter smaller than that of the first filler.Type: ApplicationFiled: July 23, 2009Publication date: February 4, 2010Applicant: Toyoda Gosei Co., Ltd.Inventors: Masakata Koseki, Eiki Kawano
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Publication number: 20080296605Abstract: A light emitting device includes a resin case including a concave portion with a reflector portion surrounding a light emitting element, a first lead and a second lead that are formed of a metal, exposed at a bottom of the concave portion of the case, and disposed away from each other in a predetermined direction, and a resin sealing material filled in the concave portion. The first lead includes a light emitting element mounting portion, a first wire connection portion, a first bleed-out preventing notch, and an opposite notch. The second lead includes a protective device mounting portion, a second wire connection portion, and a second bleed-out preventing notch. The first lead and the second lead are arranged such that, in the predetermined direction, the light emitting element mounting portion is opposed to the second bleed-out preventing notch, the first wire connection portion is opposed to the protective device mounting portion, and the opposite notch is opposed to the second wire connection portion.Type: ApplicationFiled: May 29, 2008Publication date: December 4, 2008Applicants: KABUSHIKI KAISHA TOSHIBA, TOYODA GOSEI CO., LTD.Inventors: Hiroaki Oshio, Kazuhiro Tamura, Masakata Koseki, Hiroko Tsukamoto, Tatsuichiro Maki