Patents by Inventor Masakatsu Kuroki

Masakatsu Kuroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200399404
    Abstract: The present invention relates to a petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm; and a hydrogenated petroleum resin having the content of a volatile organic compound component of less than 100 wt ppm.
    Type: Application
    Filed: March 8, 2019
    Publication date: December 24, 2020
    Applicant: IDEMITSU KOSAN CO.,LTD.
    Inventors: Kiyohiko YOKOTA, Kenji KOBAYASHI, Masakatsu KUROKI
  • Patent number: 8728355
    Abstract: The invention relates to an electrode that can be formed by firing in air a conductive paste comprising a copper powder, a boron powder, an additional inorganic powder, a glass frit, and an organic medium, wherein the additional inorganic powder is selected from the group consisting of silica powder, indium tin oxide powder, zinc oxide powder, alumina powder, and mixture thereof.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: May 20, 2014
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Masakatsu Kuroki
  • Patent number: 8709294
    Abstract: The invention relates to an electrode that can be formed by firing in air a conductive paste comprising a copper powder, a boron powder, an additional inorganic powder, a glass frit, and an organic medium, wherein the additional inorganic powder is zirconia powder.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: April 29, 2014
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Masakatsu Kuroki
  • Patent number: 8691326
    Abstract: A method for manufacturing a solar cell electrode, comprising the steps of: (a) applying a conductive paste for bus electrode to a wafer in order to form a bus electrode pattern; (b) depositing onto the wafer a photocurable conductive paste for finger electrode from a discharge slot of a dispenser nozzle to thereby form an uncured finger electrode pattern on the wafer, wherein the nozzle moves parallel to the wafer; and (c) curing the uncured finger electrode pattern by exposing the uncured finger electrode pattern to UV light either after forming the uncured finger electrode pattern on the wafer in the step (b), or concurrent with the step (b).
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: April 8, 2014
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Hiroki Kojo, Masakatsu Kuroki, Hisashi Matsuno
  • Patent number: 8647815
    Abstract: A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising; (i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO2), zinc oxide (ZnO), aluminum oxide (Al2O3), titanium oxide (TiO2), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: February 11, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Masakatsu Kuroki, Takeshi Kono
  • Publication number: 20140030658
    Abstract: A method for manufacturing an electrode comprising the steps of: applying onto a substrate a conductive paste to form a conductive paste layer comprising; (i) 100 parts by weight of a copper powder coated with a metal oxide selected from the group consisting of silicon oxide (SiO2), zinc oxide (ZnO), aluminum oxide (Al2O3), titanium oxide (TiO2), magnesium oxide (MgO) and a mixture thereof; (ii) 5 to 30 parts by weight of a boron powder; and (iii) 0.1 to 10 parts by weight of a glass frit; dispersed in (iv) an organic vehicle; and firing the conductive paste in air.
    Type: Application
    Filed: July 26, 2012
    Publication date: January 30, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Masakatsu Kuroki, Takeshi Kono
  • Publication number: 20130160836
    Abstract: A method for manufacturing a solar cell electrode, comprising the steps of: (a) applying a conductive paste for bus electrode to a wafer in order to form a bus electrode pattern; (b) depositing onto the wafer a photocurable conductive paste for finger electrode from a discharge slot of a dispenser nozzle to thereby form an uncured finger electrode pattern on the wafer, wherein the nozzle moves parallel to the wafer; and (c) curing the uncured finger electrode pattern by exposing the uncured finger electrode pattern to UV light either after forming the uncured finger electrode pattern on the wafer in the step (b), or concurrent with the step (b).
    Type: Application
    Filed: March 28, 2012
    Publication date: June 27, 2013
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: HIROKI KOJO, MASAKATSU KUROKI, HISASHI MATSUNO
  • Publication number: 20130025664
    Abstract: The invention relates to a paste for forming a solar cell electrode, comprising electrically conductive metal particles, glass frit, a cross-linkable agent, a photo polymerization initiator and organic solvent, wherein the content of the cross-linkable agent is 1.0 to 20.0 wt %, the content of the photo polymerization initiator is 0.2 to 15.0 wt %, the content of the organic solvent is greater than 1.0 wt %, based on the total weight of the paste, and wherein over 90 wt % of the organic solvent based on the total weight of the organic solvent has a boiling point at 85° C. or higher.
    Type: Application
    Filed: February 1, 2012
    Publication date: January 31, 2013
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Hiroki Kojo, Masakatsu Kuroki, Hisashi Matsuno
  • Publication number: 20130026424
    Abstract: The invention relates to an electrode that can be formed by firing in air a conductive paste comprising a copper powder, a boron powder, an additional inorganic powder, a glass frit, and an organic medium, wherein the additional inorganic powder is zirconia powder.
    Type: Application
    Filed: January 30, 2012
    Publication date: January 31, 2013
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventor: MASAKATSU KUROKI
  • Publication number: 20130017483
    Abstract: The invention relates to an electrode that can be formed by firing in air a conductive paste comprising a copper powder, a boron powder, an additional inorganic powder, a glass frit, and an organic medium, wherein the additional inorganic powder is selected from the group consisting of silica powder, indium tin oxide powder, zinc oxide powder, alumina powder, and mixture thereof.
    Type: Application
    Filed: January 16, 2012
    Publication date: January 17, 2013
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventor: Masakatsu Kuroki
  • Publication number: 20120255765
    Abstract: Disclosed is an electrode, including a conductive layer containing a conductive component selected from the group consisting of copper, nickel, iron, cobalt, titanium, lead, aluminum, tin, and alloys comprising one of these metals as the principal ingredient thereof, and an oxidation protection layer containing boron oxide, said oxidation protection layer covering the top surface of the conductive layer, or covering both the top surface and the sides of the conductive layer, or covering all locations where the conductive layer has been formed; the electrode being formed by air firing the conductive layer and the oxidation protection layer simultaneously.
    Type: Application
    Filed: June 22, 2012
    Publication date: October 11, 2012
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: MASAKATSU KUROKI
  • Patent number: 8221958
    Abstract: Disclosed is a photosensitive paste including glass frit; organic binder; polymerizable monomer; photopolymerization initiator; and organic solvent, wherein at least a part of the polymerizable monomer contains phosphorus atom within the structure.
    Type: Grant
    Filed: May 28, 2009
    Date of Patent: July 17, 2012
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Kazushige Ito, Masakatsu Kuroki
  • Patent number: 8129088
    Abstract: A low-resistance, fine electrode is formed by baking in air a photosensitive paste which has an inorganic component containing copper powder, boron powder, and glass frit, and an organic component containing a photopolymerization initiator, monomer, and organic vehicle, and in which the average particle size of the copper powder is 2.5 ?m or less, and the content of boron powder based on the total amount of copper powder and boron powder is 8 to 25 wt %.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: March 6, 2012
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Masakatsu Kuroki
  • Publication number: 20110083874
    Abstract: Disclosed is an electrode, including a conductive layer containing a conductive component selected from the group consisting of copper, nickel, iron, cobalt, titanium, lead, aluminum, tin, and alloys comprising one of these metals as the principal ingredient thereof, and an oxidation protection layer containing boron oxide, said oxidation protection layer covering the top surface of the conductive layer, or covering both the top surface and the sides of the conductive layer, or covering all locations where the conductive layer has been formed; the electrode being formed by air firing the conductive layer and the oxidation protection layer simultaneously.
    Type: Application
    Filed: October 9, 2009
    Publication date: April 14, 2011
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventor: Masakatsu Kuroki
  • Publication number: 20110003246
    Abstract: A low-resistance, fine electrode is formed by baking in air a photosensitive paste which has an inorganic component containing copper powder, boron powder, and glass frit, and an organic component containing a photopolymerization initiator, monomer, and organic vehicle, and in which the average particle size of the copper powder is 2.5 ?m or less, and the content of boron powder based on the total amount of copper powder and boron powder is 8 to 25 wt %.
    Type: Application
    Filed: July 2, 2009
    Publication date: January 6, 2011
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventor: Masakatsu KUROKI
  • Publication number: 20100136484
    Abstract: Disclosed is a photosensitive paste including glass frit; organic binder; polymerizable monomer; photopolymerization initiator; and organic solvent, wherein at least a part of the polymerizable monomer contains phosphorus atom within the structure.
    Type: Application
    Filed: May 28, 2009
    Publication date: June 3, 2010
    Applicant: E.I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Kazushige Ito, Masakatsu Kuroki
  • Patent number: 7678457
    Abstract: This invention provides a thick-film type dielectric with desired adhesivity to the base and very good insulation properties. The dielectric of the present invention includes a lower dielectric layer made of a photosensitive composition and an upper dielectric layer which is made of a photosensitive composition and formed on the aforementioned lower dielectric layer. The softening point (T1) of the primary glass powder used for the aforementioned lower dielectric layer, the softening point (T2) of the primary glass powder used for the aforementioned upper dielectric layer, and the firing temperature (T3) of the aforementioned primary glass powder satisfy the following relationship: T1<T3<T2<T3+30° C.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: March 16, 2010
    Assignee: E.I. du Pont de Nemours and Company
    Inventors: Keiichiro Hayakawa, Masakatsu Kuroki
  • Publication number: 20070238036
    Abstract: The present invention provides ern. The dielectric has a lower dielectric layer composed of a photosensitive composition and an upper dielectric layer, composed of a photosensitive composition formed on the above-mentioned lower dielectric layer, are included, with the transmittance of the above-mentioned upper dielectric layer to light used in a certain pattern exposure being lower than the transmittance of the above-mentioned lower dielectric layer to the light used in said pattern exposure.
    Type: Application
    Filed: March 19, 2007
    Publication date: October 11, 2007
    Inventors: Keiichiro Hayakawa, Masakatsu Kuroki
  • Publication number: 20070224429
    Abstract: This invention provides a thick-film type dielectric with desired adhesivity to the base and very good insulation properties. The dielectric of the present invention includes a lower dielectric layer made of a photosensitive composition and an upper dielectric layer which is made of a photosensitive composition and formed on the aforementioned lower dielectric layer. The softening point (T1) of the primary glass powder used for the aforementioned lower dielectric layer, the softening point (T2) of the primary glass powder used for the aforementioned upper dielectric layer, and the firing temperature (T3) of the aforementioned primary glass powder satisfy the following relationship: T1<T3<T2<T3+30° C.
    Type: Application
    Filed: March 20, 2007
    Publication date: September 27, 2007
    Inventors: Keiichiro Hayakawa, Masakatsu Kuroki
  • Publication number: 20070140934
    Abstract: A catalyst supply device (1) has a catalyst vessel (2) in which catalyst slurry (10) is placed; an automatic suction valve (3) connected to the downstream side of the catalyst slurry supply vessel (2); three-way piping (4) for connecting the automatic suction valve (3), automatic discharge valve (6), and a positive displacement pump (5); and the positive displacement pump (5) and the automatic discharge valve (6) that are connected to the three-way piping (4). The catalyst supply device (1) supplies the catalyst slurry (10) to a reaction vessel (7) without causing a catalyst (11) to enter into the inside of the positive displacement pump (5).
    Type: Application
    Filed: December 3, 2004
    Publication date: June 21, 2007
    Applicant: Idemitsu Kosan Co., Ltd
    Inventors: Masahiro Okamura, Masakatsu Kuroki, Yasunobu Kaneko