Patents by Inventor Masakatsu Urairi

Masakatsu Urairi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9028647
    Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: May 12, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Tetsurou Ikeda, Masakatsu Urairi, Akinobu Souma, Shigenori Morita, Chieko Kitaura, Junichi Fujisawa, Reiko Akari, Shigeki Kawabe, Masayuki Satake
  • Patent number: 8778118
    Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: July 15, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Publication number: 20140060734
    Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.
    Type: Application
    Filed: November 12, 2013
    Publication date: March 6, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tetsurou Ikeda, Masakatsu Urairi, Akinobu Souma, Shigenori Morita, Chieko Kitaura, Junichi Fujisawa, Reiko Akari, Shigeki Kawabe, Masayuki Satake
  • Patent number: 8624156
    Abstract: Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: January 7, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naoyuki Matsuo, Masakatsu Urairi, Atsushi Hino
  • Patent number: 8609236
    Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: December 17, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsurou Ikeda, Masakatsu Urairi, Akinobu Souma, Shigenori Morita, Chieko Kitaura, Junichi Fujisawa, Reiko Akari, Shigeki Kawabe, Masayuki Satake
  • Patent number: 8168030
    Abstract: Providing a method of manufacturing a laser processed part capable of processing at high speed and high precision when processing a workpiece by optical absorption ablation of laser beam, effectively suppressing contamination of a workpiece surface by decomposition products, and recovering the workpiece easily after processing. Another object is to present an adhesive sheet for laser processing preferably used in the method of manufacturing a laser processed part.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: May 1, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Naoyuki Matsuo, Masakatsu Urairi, Atsushi Hino
  • Patent number: 8128787
    Abstract: Processes for removing water from organic solvents, such as ethanol. The processes include distillation in two columns operated at sequentially higher pressure, followed by treatment of the overhead vapor by one or two membrane separation steps.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: March 6, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Nicholas P. Wynn, Yu Huang, Masakatsu Urairi, Richard W Baker
  • Patent number: 8030127
    Abstract: Embodiments of the present invention relate to semiconducting carbon-containing devices and methods of making thereof. The semi-conducting carbon containing devices comprise an n-type semiconducting layer and a p-type semiconducting layer, both of which are positioned over a substrate. The n-type semiconducting layer can be formed by pyrolyzing a carbon- and nitrogen-containing polymer, and the p-type semiconducting layer can be formed by pyrolyzing an aromatic- and aliphatic-group-containing polymer. In some embodiments, the devices are solar cell devices.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: October 4, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Amane Mochizuki, Toshitaka Nakamura, Masakatsu Urairi, Guang Pan
  • Publication number: 20100273313
    Abstract: A manufacturing method of laser processed parts in which at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet for laser processing, using a material having specified physical properties. This method comprises adhering the pressure-sensitive adhesive sheet for laser processing to the laser beam exit side of the work by way of the pressure-sensitive adhesive layer, processing the work by irradiating the work with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in the work, at higher than the irradiation intensity of threshold for inducing ablation of the work, and peeling the pressure-sensitive adhesive sheet for laser processing from the work after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
    Type: Application
    Filed: June 22, 2010
    Publication date: October 28, 2010
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Publication number: 20100221850
    Abstract: Embodiments of the present invention relate to semiconducting carbon-containing devices and methods of making thereof. The semi-conducting carbon containing devices comprise an n-type semiconducting layer and a p-type semiconducting layer, both of which are positioned over a substrate. The n-type semiconducting layer can be formed by pyrolyzing a carbon- and nitrogen-containing polymer, and the p-type semiconducting layer can be formed by pyrolyzing an aromatic- and aliphatic-group-containing polymer. In some embodiments, the devices are solar cell devices.
    Type: Application
    Filed: April 2, 2010
    Publication date: September 2, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Amane Mochizuki, Toshitaka Nakamura, Masakatsu Urairi, Guang Pan
  • Patent number: 7665208
    Abstract: A first through hole is formed in a laminate by trepanning machining using laser light, for example. The trepanning machining refers to a process for irradiating laser light along such a trajectory that the laser light is first irradiated onto a substantially central area of a first through hole to be formed, the laser light is irradiated along a circumference corresponding to the bore diameter of the first through hole to be formed, and the laser light is finally irradiated onto the substantially central area of the first through hole to be formed again. A second through hole being substantially concentric with and having a larger bore diameter than the first through hole is formed by irradiating the laser light, similarly to the first through hole.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: February 23, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Kanji Nishida, Naoyuki Matsuo, Masakatsu Urairi
  • Patent number: 7586060
    Abstract: A laser processing protection sheet (2) capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed (1) is processed by the UV absorption ablation of a laser beam (7). A production method for a laser processed article (10) using the laser processing protection sheet (2). The laser processing protection sheet (2) is provided on the laser beam incident surface side of the article to be processed (1) when the article (1) is processed by the UV absorption ablation of the laser beam (7).
    Type: Grant
    Filed: November 2, 2004
    Date of Patent: September 8, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Publication number: 20090004713
    Abstract: Processes for removing water from organic solvents, such as ethanol. The processes include distillation in two columns operated at sequentially higher pressure, followed by treatment of the overhead vapor by one or two membrane separation steps.
    Type: Application
    Filed: August 27, 2008
    Publication date: January 1, 2009
    Applicant: Membrane Technology and Research, Inc.
    Inventors: Nicholas P. Wynn, Yu Huang, Masakatsu Urairi, Richard W. Baker
  • Publication number: 20080277652
    Abstract: Embodiments of the present invention relate to semiconducting carbon-containing devices and methods of making thereof. The semi-conducting carbon containing devices comprise an n-type semiconducting layer and a p-type semiconducting layer, both of which are positioned over a substrate. The n-type semiconducting layer can be formed by pyrolyzing a carbon- and nitrogen-containing polymer, and the p-type semiconducting layer can be formed by pyrolyzing an aromatic- and aliphatic-group-containing polymer. In some embodiments, the devices are solar cell devices.
    Type: Application
    Filed: February 22, 2008
    Publication date: November 13, 2008
    Applicant: Nitto Denko Corporation
    Inventors: Amane Mochizuki, Toshitaka Nakamura, Masakatsu Urairi, Guang Pan
  • Publication number: 20080123189
    Abstract: An adhesive of the invention is used for polarizing plate to provide a transparent protective film on at least one side of a polarizer and comprises a resin solution comprising a polyvinyl alcohol-based resin, a crosslinking agent and a colloidal metal compound with an average particle size of 1 nm to 100 nm, wherein 200 parts by weight or less of the colloidal metal compound is added to 100 parts by weight of the polyvinyl alcohol-based resin. The adhesive for polarizing plate can reduce the occurrence of knicks.
    Type: Application
    Filed: June 7, 2007
    Publication date: May 29, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tetsurou Ikeda, Masakatsu Urairi, Akinobu Souma, Shigenori Morita, Chieko Kitaura, Junichi Fujisawa, Reiko Akari, Shigeki Kawabe, Masayuki Satake
  • Publication number: 20080005898
    Abstract: A first through hole is formed in a laminate by trepanning machining using laser light, for example. The trepanning machining refers to a process for irradiating laser light along such a trajectory that the laser light is first irradiated onto a substantially central area of a first through hole to be formed, the laser light is irradiated along a circumference corresponding to the bore diameter of the first through hole to be formed, and the laser light is finally irradiated onto the substantially central area of the first through hole to be formed again. A second through hole being substantially concentric with and having a larger bore diameter than the first through hole is formed by irradiating the laser light, similarly to the first through hole.
    Type: Application
    Filed: June 21, 2007
    Publication date: January 10, 2008
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kanji NISHIDA, Naoyuki MATSUO, Masakatsu URAIRI
  • Publication number: 20070181543
    Abstract: A laser processing protection sheet (2) capable of effectively preventing contamination on the surface of an article to be processed by decomposition products when the article to be processed (1) is processed by the UV absorption ablation of a laser beam (7). A production method for a laser processed article (10) using the laser. processing protection sheet (2). The laser processing protection sheet (2) is provided on the laser beam incident surface side of the article to be processed (1) when the article (1) is processed by the UV absorption ablation of the laser beam (7).
    Type: Application
    Filed: November 2, 2004
    Publication date: August 9, 2007
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Publication number: 20060246279
    Abstract: A manufacturing method of laser processed parts is characterized in that at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet (2) for laser processing, using a material having specified physical properties, and this method comprises a step of adhering the pressure-sensitive adhesive sheet (2) for laser processing to the laser beam exit side of the work (1) by way of the pressure-sensitive adhesive layer, a step of processing the work by irradiating the work with a laser beam (6) of within 2 times of the irradiation intensity for forming a through-hole in the work (1), at higher than the irradiation intensity of threshold for inducing ablation of the work (1), and a step of peeling the pressure-sensitive adhesive sheet (2) for laser processing from the work (1) after the machining.
    Type: Application
    Filed: April 19, 2004
    Publication date: November 2, 2006
    Inventors: Masakatsu Urairi, Atsushi Hino, Naoyuki Matsuo, Tomokazu Takahashi, Takeshi Matsumura, Syouji Yamamoto
  • Publication number: 20060228650
    Abstract: Providing a method of manufacturing a laser processed part by using a protective sheet for laser processing capable of effectively suppressing contamination of surface of workpiece by decomposition product, and processing at high precision, when processing the workpiece by optical absorption ablation of laser beam. It is also an object to present a protective sheet for laser processing for use in the manufacturing method of laser processed part.
    Type: Application
    Filed: January 13, 2006
    Publication date: October 12, 2006
    Inventors: Naoyuki Matsuo, Masakatsu Urairi, Atsushi Hino
  • Publication number: 20060157191
    Abstract: Providing a method of manufacturing a laser processed part capable of processing at high speed and high precision when processing a workpiece by optical absorption ablation of laser beam, effectively suppressing contamination of a workpiece surface by decomposition products, and recovering the workpiece easily after processing. Another object is to present an adhesive sheet for laser processing preferably used in the method of manufacturing a laser processed part.
    Type: Application
    Filed: January 13, 2006
    Publication date: July 20, 2006
    Inventors: Naoyuki Matsuo, Masakatsu Urairi, Atsushi Hino