Abstract: There is provided a paste composition using copper fine particles that are capable of exhibiting conductivity after low-temperature sintering, which themselves are less oxidized, and that can be produced with a high yield ratio. A paste composition contains: (A) copper fine particles having a thickness or minor axis of 10 to 500 nm and coated with amino alcohol represented by the chemical formula (1) and (B) an organic solvent.

Abstract: There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 nm to 200 nm in thickness or in minor axis; (B) a silver powder having an average particle size of more than 0.2 ?m and 30 ?m or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the resin particles (C) is 0.01 to 1 part by mass and an amount of the thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B).

Abstract: There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 nm to 200 nm in thickness or in minor axis; (B) a silver powder having an average particle size of more than 0.2 ?m and 30 ?m or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the resin particles (C) is 0.01 to 1 part by mass and an amount of the thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B).

Abstract: The purpose of the present disclosure is to assist automation of programming for automatic generation of an analysis material prepared by analysis work in a clinical trial during pharmaceutical development. Using the format information, the layout information, and the image data of an image/table analysis plan, this program generation assisting system performs form pattern prediction by two approaches: micro rule-based prediction and macro CNN-based prediction. In addition, the program generation assisting system performs model data/variable prediction by using the format information and the layout information of the image/table analysis plan, an ADaM specification, and ADaM/variable association information, and presents a combination of the model data/variable prediction and the pattern prediction.

Abstract: Provided is a thermosetting resin composition containing: (A) silver particles including secondary particles having an average particle size from 0.5 to 5.0 ?m, the secondary particles being formed by aggregation of primary particles having an average particle size from 10 to 100 nm; and (B) a thermosetting resin.

Abstract: Provided are silver particles including a silver powder and a silver layer that includes primary particles, the primary particles being smaller than the silver powder.

Abstract: Provided is a round billet capable of reducing damage on a piercing plug in a method of producing a seamless metal tube with a Mannesmann process. The round billet (5), for use in a seamless metal tube, to be produced into a seamless metal tube with a Mannesmann process includes a body having a hole (6) formed in an axial direction of the body. The hole (6) includes an aperture (6a) opening at least at one end face of the round billet (5), and a tapered portion (61) continued to the aperture (6a) and having a diameter gradually increasing toward the aperture (6a).

Abstract: A method of manufacturing a semiconductor device includes: applying a bonding resin composition on a semiconductor chip supporting member, the bonding resin composition containing a thermosetting resin and silver microparticles having an average particle size of 10 to 200 nm, the silver microparticles having a protective layer made of an organic compound on surfaces thereof; a semi-sintering step of heating the applied bonding resin composition at a temperature that is lower than a reaction starting temperature of the thermosetting resin and is equal to or more than 50° C. to bring the silver microparticles into a semi-sintered state; and a bonding step including: placing a semiconductor chip on the bonding resin composition containing the silver microparticles in a semi-sintered state, heating at a temperature higher than the reaction starting temperature of the thermosetting resin in a pressure-free state, and bonding the semiconductor chip to the semiconductor chip supporting member.

Abstract: A method of manufacturing a semiconductor device includes: applying a bonding resin composition on a semiconductor chip supporting member, the bonding resin composition containing a thermosetting resin and silver microparticles having an average particle size of 10 to 200 nm, the silver microparticles having a protective layer made of an organic compound on surfaces thereof; a semi-sintering step of heating the applied bonding resin composition at a temperature that is lower than a reaction starting temperature of the thermosetting resin and is equal to or more than 50° C. to bring the silver microparticles into a semi-sintered state; and a bonding step including: placing a semiconductor chip on the bonding resin composition containing the silver microparticles in a semi-sintered state, heating at a temperature higher than the reaction starting temperature of the thermosetting resin in a pressure-free state, and bonding the semiconductor chip to the semiconductor chip supporting member.

Abstract: There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

Abstract: There is provided a paste composition using copper fine particles that are capable of exhibiting conductivity after low-temperature sintering, which themselves are less oxidized, and that can be produced with a high yield ratio. A paste composition contains: (A) copper fine particles having a thickness or minor axis of 10 to 500 nm and coated with amino alcohol represented by the chemical formula (1) and (B) an organic solvent.

Abstract: A method of manufacturing a semiconductor device includes: applying a bonding resin composition on a semiconductor chip supporting member, the bonding resin composition containing a thermosetting resin and silver microparticles having an average particle size of 10 to 200 nm, the silver microparticles having a protective layer made of an organic compound on surfaces thereof; a semi-sintering step of heating the applied bonding resin composition at a temperature that is lower than a reaction starting temperature of the thermosetting resin and is equal to or more than 50° C. to bring the silver microparticles into a semi-sintered state; and a bonding step including: placing a semiconductor chip on the bonding resin composition containing the silver microparticles in a semi-sintered state, heating at a temperature higher than the reaction starting temperature of the thermosetting resin in a pressure-free state, and bonding the semiconductor chip to the semiconductor chip supporting member.

Abstract: There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

Abstract: Provided is a round billet capable of reducing damage on a piercing plug in a method of producing a seamless metal tube with a Mannesmann process. The round billet (5), for use in a seamless metal tube, to be produced into a seamless metal tube with a Mannesmann process includes a body having a hole (6) formed in an axial direction of the body. The hole (6) includes an aperture (6a) opening at least at one end face of the round billet (5), and a tapered portion (61) continued to the aperture (6a) and having a diameter gradually increasing toward the aperture (6a).

Abstract: There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 nm to 200 nm in thickness or in minor axis; (B) a silver powder having an average particle size of more than 0.2 ?m and 30 ?m or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the resin particles (C) is 0.01 to 1 part by mass and an amount of the thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B).

Abstract: The object is to provide a method of detecting a fault which ensures high-accuracy detection of a fault in piercing-rolling. A piercing-rolling mill (10) is provided with piercer rolls (1a, 1b), a piercer plug (3), a rolling load sensor (4), a thrust load sensor (5), and a control device (6). The control device (6) measures a rolling load parameter corresponding to the rolling load of the piercer rolls (1a, 1b) and a thrust load parameter corresponding to the thrust load of the piercer plug (3), and detects a fault in piercing-rolling on the basis of a measured value of the rolling load parameter and a measure value of the thrust load parameter.

Abstract: Provided is a round billet capable of reducing damage on a piercing plug in a method of producing a seamless metal tube with a Mannesmann process. The round billet (5), for use in a seamless metal tube, to be produced into a seamless metal tube with a Mannesmann process includes a body having a hole (6) formed in an axial direction of the body. The hole (6) includes an aperture (6a) opening at least at one end face of the round billet (5), and a tapered portion (61) continued to the aperture (6a) and having a diameter gradually increasing toward the aperture (6a).

Abstract: The object is to provide a method of detecting a fault which ensures high-accuracy detection of a fault in piercing-rolling. A piercing-rolling mill 10 is provided with piercer rolls 1a, 1b, a piercer plug 3, a rolling load sensor 4, a thrust load sensor 5, and a control device 6. The control device 6 measures a rolling load parameter corresponding to the rolling load of the piercer rolls 1a, 1b and a thrust load parameter corresponding to the thrust load of the piercer plug 3, and detects a fault in piercing-rolling on the basis of a measured value of the rolling load parameter and a measured value of the thrust load parameter.

Abstract: There is provided a photosensitive thermosetting resin composition of an alkali development type from which it is possible to form a coating film that is halogen-free yet has high-level flame retardancy, has a superior low warpage property after it is cured, is excellent in plasticity, resolution, soldering heat resistance, chemical resistance, and the like, and a flexible printed circuit board using the same.

Abstract: A library control device to controls a library device includes a designated-information acquisition section, a loading control section, a transfer control section and a medium storage control section. The transfer control section that orders, when a storage location indicated by the loading control section to a library device and a storage location designated by storage-location designating information are different from each other, the library device to transfer a storage medium from the storage location designated by the storage-location designating information to a storage location different from the storage location designated by the storage-location designating information.